⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8015489 | 0.87 | — | — | |
| SCHEMBL10308290 | 0.87 | — | — | |
| SCHEMBL459259 | 0.86 | — | — | |
| SCHEMBL703802 | 0.86 | — | — | |
| SCHEMBL703482 | 0.86 | — | — | |
| SCHEMBL2956127 | 0.83 | — | — | |
| SCHEMBL6709894 | 0.83 | — | — | |
| SCHEMBL3235533 | 0.83 | — | — | |
| SCHEMBL3229737 | 0.83 | — | — | |
| SCHEMBL6706860 | 0.83 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 84 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240093058-A1 | POLYSILAZANE HARD COATING COMPOSITIONS | MERCK PATENT GMBH (DE) | 2024-03-21 | — | — | US | claimed |
| EP-4274866-A1 | POLYSILAZANE HARD COATING COMPOSITIONS | Merck Patent GmbH (DE) | 2023-11-15 | — | — | EP | claimed |
| WO-2022148757-A1 | POLYSILAZANE HARD COATING COMPOSITIONS | MERCK PATENT GMBH (DE) | 2022-07-14 | — | — | WO | claimed |
| US-20260107711-A1 | PRECURSORS FOR DEPOSITING FILMS WITH ELASTIC MODULUS | VERSUM MAT US LLC (US) | 2026-04-16 | — | — | US | disclosed |
| EP-4110969-B1 | NEW PRECURSORS FOR DEPOSITING FILMS WITH HIGH ELASTIC MODULUS | VERSUM MAT US LLC (US) | 2025-12-10 | — | — | EP | disclosed |
| WO-2025129600-A1 | CONDUCTIVE ADHESIVE COMPOSITIONS, CROSSLINKED CONDUCTIVE ADHESIVE COMPOSITIONS, AND ELECTRICALLY CONDUCTIVE ARTICLES | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2025-06-26 | — | — | WO | disclosed |
| CN-120192718-A | Conductive adhesive composition, crosslinked conductive adhesive composition, and conductive article | 3M中国有限公司 | 2025-06-24 | — | — | CN | disclosed |
| CN-120082306-A | Conductive adhesive composition and conductive article | 3M创新有限公司 | 2025-06-03 | — | — | CN | disclosed |
| US-20240240309-A1 | New Precursors For Depositing Films With High Elastic Modulus | VERSUM MATERIALS US, LLC | 2024-07-18 | — | — | US | disclosed |
| US-20240093058-A1 | POLYSILAZANE HARD COATING COMPOSITIONS | MERCK PATENT GMBH (DE) | 2024-03-21 | — | — | US | disclosed |
| EP-4320286-A1 | NEW PRECURSORS FOR DEPOSITING FILMS WITH HIGH ELASTIC MODULUS | Versum Materials US, LLC (US) | 2024-02-14 | — | — | EP | disclosed |
| US-20090294922-A1 | ORGANIC SILICON OXIDE FINE PARTICLE AND PREPARATION METHOD THEREOF, POROUS FILM-FORMING COMPOSITION, POROUS FILM AND FORMATION METHOD THEREOF, AND SEMICONDUCTOR DEVICE | PANASONIC CORPORATION (JP) | 2009-12-03 | — | — | US | disclosed |
| US-20090294726-A1 | ORGANIC SILICON OXIDE FINE PARTICLES AND PREPARATION METHOD THEREOF, POROUS FILM-FORMING COMPOSITION, POROUS FILM AND FORMATION METHOD THEREOF, AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-12-03 | — | — | US | disclosed |
| US-20070178319-A1 | Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device | MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD. (JP) | 2007-08-02 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |
| EP-1564269-A1 | COMPOSITION FOR POROUS FILM FORMATION, POROUS FILM, PROCESS FOR PRODUCING THE SAME, INTERLAYER INSULATION FILM AND SEMICONDUCTOR DEVICE | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2005-08-17 | — | — | EP | disclosed |
| US-20040216641-A1 | Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. | 2004-11-04 | — | — | US | disclosed |
| CN-1536023-A | Porous membrane shaping composition, preparation method of porous membrane, porous membrane intercalation insulating film and semiconductor device | ��Խ��ѧ��ҵ��ʽ���� | 2004-10-13 | — | — | CN | disclosed |
| US-20040028978-A1 | Proton conducting membrane, method for producing the same, and fuel cell using the same | NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) | 2004-02-12 | — | — | US | disclosed |
| EP-1334993-A2 | Proton conducting membrane, method for producing the same, and fuel cell using the same | National Institute of Advanced Industrial Science and Technology (JP) | 2003-08-13 | — | — | EP | disclosed |