⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6567340 | 0.83 | — | — | |
| SCHEMBL2802056 | 0.74 | — | — | |
| SCHEMBL15091615 | 0.74 | — | — | |
| SCHEMBL29817482 | 0.74 | — | — | |
| SCHEMBL706913 | 0.74 | — | — | |
| SCHEMBL19418963 | 0.74 | — | — | |
| SCHEMBL3392802 | 0.74 | — | — | |
| SCHEMBL707089 | 0.74 | — | — | |
| SCHEMBL17885887 | 0.70 | — | — | |
| SCHEMBL8161035 | 0.70 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-108375878-B | Polymerizable composition, method for producing cured film, and cured film | 东京应化工业株式会社 | 2023-12-08 | — | — | CN | disclosed |
| US-11718717-B2 | Resin composition, method for producing resin composition, film formation method, and cured product | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-08-08 | — | — | US | disclosed |
| US-20200392292-A1 | RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION, FILM FORMATION METHOD, AND CURED PRODUCT | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-12-17 | — | — | US | disclosed |
| US-10767017-B2 | Resin composition, method for producing resin composition, film formation method, and cured product | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-09-08 | — | — | US | disclosed |
| US-20190305372-A1 | LITHIUM SECONDARY BATTERY INCLUDING AN ELECTROLYTE ADDITIVE | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2019-10-03 | — | — | US | disclosed |
| US-20180179338-A1 | RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION, FILM FORMATION METHOD, AND CURED PRODUCT | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-06-28 | — | — | US | disclosed |
| US-9163046-B2 | Process for producing substituted metallocene compounds for olefin polymerization | EXXONMOBIL CHEMICAL PATENTS INC. (US) | 2015-10-20 | — | — | US | disclosed |
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| US-20100113717-A1 | Process For Producing Substituted Metallocene Compounds For Olefin Polymerization | EXXONMOBIL CHEMICAL PATENTS INC. | 2010-05-06 | — | — | US | disclosed |
| EP-1866322-B1 | PROCESS FOR PRODUCING SUBSTITUTED METALLOCENE COMPOUNDS FOR OLEFIN POLYMERIZATION | EXXONMOBIL CHEM PATENTS INC (US) | 2010-02-24 | — | — | EP | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| EP-1866322-A2 | PROCESS FOR PRODUCING SUBSTITUTED METALLOCENE COMPOUNDS FOR OLEFIN POLYMERIZATION | ExxonMobil Chemical Patents Inc. (US) | 2007-12-19 | — | — | EP | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |
| US-20060160968-A1 | Process for producing substituted metallocene compounds for olefin polymerization | EXXONMOBIL CHEMICAL PATENTS INC. | 2006-07-20 | — | — | US | disclosed |
| WO-2006065844-A2 | PROCESS FOR PRODUCING SUBSTITUTED METALLOCENE COMPOUNDS FOR OLEFIN POLYMERIZATION | EXXONMOBIL CHEMICAL PATENTS INC. (US) | 2006-06-22 | — | — | WO | disclosed |
| US-20050118742-A1 | Method for reducing the adhesive properties of MEMS and anti-adhesion-coated device | ROBERT BOSCH GMBH (DE) | 2005-06-02 | — | — | US | disclosed |
| EP-1016667-A2 | Redistributing silalkylenes in an alkyl-rich silalkylene-containing residue | DOW CORNING CORPORATION (US) | 2000-07-05 | — | — | EP | disclosed |
| US-6013824-A | CONTACTING ALKYL-RICH SILALKYLENE-CONTAINING RESIDUE WITH HALOSILANE SELECTED FROM ALKYLTRIHALOSILANES AND TETRAHALOSILANES IN PRESENCE OF REDISTRIBUTION CATALYST, HEATING TO FORM DIALKYLDIHALOSILANE | DOW CORNING CORPORATION (US) | 2000-01-11 | — | — | US | disclosed |
| US-4393229-A | HALOGENATION, TRANSALKYLATION | GENERAL ELECTRIC COMPANY (US) | 1983-07-12 | — | — | US | disclosed |