⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19815967 | 0.97 | GGPS1 (0.50) | — | |
| SCHEMBL16969864 | 0.97 | GGPS1 (0.50) | — | |
| SCHEMBL9957672 | 0.97 | GGPS1 (0.50) | — | |
| SCHEMBL7689355 | 0.97 | GGPS1 (0.50) | — | |
| SCHEMBL484147 | 0.91 | — | — | |
| SCHEMBL16970122 | 0.82 | — | — | |
| SCHEMBL16969640 | 0.80 | GGPS1 (0.50) | — | |
| SCHEMBL16970132 | 0.80 | GGPS1 (0.50) | — | |
| SCHEMBL16969900 | 0.80 | GGPS1 (0.50) | — | |
| SCHEMBL16970148 | 0.80 | GGPS1 (0.50) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023114999-A2 | MOISTURIZER COMPOSITIONS AND METHODS OF MAKING THE SAME | MOTAHARI ZAHRA (US) | 2023-06-22 | — | — | WO | claimed |
| US-20020160926-A1 | Concentrated, stable, preferably clear, fabric softening composition | TRINH TOAN (US) | 2002-10-31 | — | — | US | claimed |
| EP-2905349-B1 | Ag ball, solder joint, formed solder, solder paste and silver paste | SENJU METAL INDUSTRY CO (JP) | 2017-05-17 | — | — | EP | disclosed |
| US-9266196-B2 | Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste | SENJU METAL INDUSTRY CO., LTD. (JP) | 2016-02-23 | — | — | US | disclosed |
| EP-2905349-A2 | Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste | SENJU METAL INDUSTRY CO., LTD. (JP) | 2015-08-12 | — | — | EP | disclosed |
| US-20150217409-A1 | Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE | Senju Metal lndustry Co., Ltd. (JP) | 2015-08-06 | — | — | US | disclosed |
| EP-0913444-B1 | Adhesive compositions | VANTICO AG (CH) | 2003-07-09 | — | — | EP | disclosed |
| US-5281655-A | Hydroxy- or carboxy-containing acrylic resins, alkyd resins, epoxy resins, fluorine-containing resins, urethane resins, crosslinking agent | KANSAI PAINT COMPANY, LIMITED (JP) | 1994-01-25 | — | — | US | disclosed |
| US-5264620-A | Abrasion resistant polyurethane | BASF CORPORATION (US) | 1993-11-23 | — | — | US | disclosed |
| US-4970266-A | Process for the preparation of functionalized polymers | SHELL OIL COMPANY (US) | 1990-11-13 | — | — | US | disclosed |