⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13145858 | 0.81 | — | — | |
| SCHEMBL515099 | 0.81 | — | — | |
| SCHEMBL14110690 | 0.79 | — | — | |
| SCHEMBL18083896 | 0.77 | — | — | |
| SCHEMBL6351738 | 0.77 | — | — | |
| SCHEMBL580589 | 0.77 | — | — | |
| SCHEMBL13839010 | 0.76 | — | — | |
| SCHEMBL29316031 | 0.75 | — | — | |
| SCHEMBL10316324 | 0.74 | — | — | |
| SCHEMBL564426 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0688847-B1 | Moisture-curable hot melt pressure sensitive adhesives | DOW CORNING (US) | 2003-08-13 | — | — | EP | disclosed |
| EP-0688847-A2 | Moisture-curable hot melt pressure sensitive adhesives | DOW CORNING CORPORATION (US) | 1995-12-27 | — | — | EP | disclosed |
| US-5473026-A | Moisture-curable hot melt silicone pressure-sensitive adhesives | DOW CORNING CORPORATION (US) | 1995-12-05 | — | — | US | disclosed |