SCHEMBL7095455

SCHEMBL7095455

C[Si](C)(C)OC(COCC(O[Si](C)(C)C)O[Si](C)(C)C)O[Si](C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4436287 0.79
SCHEMBL21198604 0.77
SCHEMBL5701724 0.73
SCHEMBL8359277 0.71
SCHEMBL11808330 0.70
SCHEMBL5702110 0.69
SCHEMBL21174916 0.69
SCHEMBL511311 0.69
SCHEMBL3552494 0.68
SCHEMBL4984066 0.68

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6596455-B2 On a water receptive substrate, a heat-sensitive layer comprising microcapsules containing a compound having thermally reactive functional group, which reacts with a compound in the light sensitive layer; storage stability FUJI PHOTO FILM CO., LTD. (JP) 2003-07-22 US disclosed
US-20010046638-A1 On a water receptive substrate, a heat-sensitive layer comprising microcapsules containing a compound having thermally reactive functional group, which reacts with a compound in the light sensitive layer; storage stability FUJIFILM CORPORATION (JP) 2001-11-29 US disclosed