SCHEMBL7101677

SCHEMBL7101677

CCO[Si](CC[Si](C)(C)O[SiH](C)C)(OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6557064 0.90
SCHEMBL30112993 0.88
SCHEMBL7106598 0.84
SCHEMBL7103187 0.84
SCHEMBL7103441 0.84
SCHEMBL7101817 0.83
SCHEMBL14370711 0.83
SCHEMBL515099 0.81
SCHEMBL1893389 0.79
SCHEMBL580589 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3645607-B1 METHOD FOR HYDROSILYLATION OF ALIPHATICALLY UNSATURATED ALKOXYSILANES AND HYDROGEN TERMINATED ORGANOSILOXANE OLIGOMERS TO PREPARE ALKOXYSILYL TERMINATED POLYMERS USEFUL FOR FUNCTIONALIZING POLYORGANOSILOXANES USING AN IRIDIUM CATALYST DOW SILICONES CORP (US) 2025-11-05 EP disclosed
CN-114196072-B Preparation method of graphene/white carbon black hybrid filler 北京化工大学 2023-02-28 CN disclosed
US-20230045816-A1 THERMOELECTRIC CONVERSION STRUCTURE ASAHI RUBBER INC. (JP) 2023-02-16 US disclosed
EP-4092767-A1 THERMOELECTRIC CONVERSION STRUCTURE Asahi Rubber Inc. (JP) 2022-11-23 EP disclosed
CN-110317457-B Polysilazane composition, coated substrate, and multilayer structure 信越化学工业株式会社 2022-09-16 CN disclosed
CN-114196072-A Preparation method of graphene/white carbon black hybrid filler 北京化工大学 2022-03-18 CN disclosed
CN-113039247-A Curable silicone composition, cured product thereof, laminate, method for producing laminate, and optical device or optical display 陶氏东丽株式会社 2021-06-25 CN disclosed
CN-112996858-A Curable silicone composition, cured product thereof, laminate, method for producing laminate, and optical device or optical display 陶氏东丽株式会社 2021-06-18 CN disclosed
CN-112996857-A Curable silicone composition, cured product thereof, laminate, method for producing laminate, and optical device or optical display 陶氏东丽株式会社 2021-06-18 CN disclosed
EP-2759581-B1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF KANEKA CORP (JP) 2018-01-24 EP disclosed
US-20140288222-A1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF KANEKA CORPORATION (JP) 2014-09-25 US disclosed
EP-2759581-A1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF Kaneka Corporation (JP) 2014-07-30 EP disclosed
US-7405316-B2 Organosilicon compounds SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-07-29 US disclosed
US-7279589-B2 Preparation of 1-(alkoxysilyl)ethyl-1,1,3,3-tetramethyldisiloxane SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-10-09 US disclosed
US-20070037997-A1 Reacting vinyl-containing alkoxysilane in portions with 1,1,3,3-tetramethyldisiloxane in the presence of a rhodium compound SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-02-15 US disclosed
US-20030120016-A1 Silalkylene oligosiloxane surface treating agent and process for preparation DOW CORNING TORAY SILICONE, CO. LTD. (JP) 2003-06-26 US disclosed
US-20020010245-A1 Thermally conductive silicone rubber composition DOW CORNING TORAY SILICON, CO., LTD. (JP) 2002-01-24 US disclosed
EP-1162239-A2 Thermally conductive silicone rubber composition Dow Corning Toray Silicone Co., Ltd. (JP) 2001-12-12 EP disclosed
EP-1162203-A1 Silalkylene oligosiloxane surface treating agents and process for their preparation Dow Corning Toray Silicone Co., Ltd. (JP) 2001-12-12 EP disclosed
EP-0885915-A2 Polyorganosiloxanes having dialkoxyorganosiloxy groups Hüls Silicone Gesellschaft mit beschränkter Haftung (DE) 1998-12-23 EP disclosed