SCHEMBL7108937

SCHEMBL7108937

[121Pb]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11114595 1.00
SCHEMBL2359540 1.00
SCHEMBL154501 0.71
SCHEMBL10654249 0.71
SCHEMBL19097695 0.58
SCHEMBL25396888 0.00
SCHEMBL25438576 0.00
Water SCHEMBL25437472 0.00
Methane SCHEMBL23929073 0.00
SCHEMBL25436537 0.00

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 88 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-7021638-A None JP disclosed
JP-3172532-A None JP disclosed
JP-60055647-A None JP disclosed
JP-4122053-A None JP disclosed
US-11989367-B2 Display panel and display apparatus CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. (CN) 2024-05-21 US disclosed
EP-4350719-A1 DIRECT-CURRENT MAGNETIC FIELD SUPERCONDUCTING COIL POWER SUPPLY DEVICE Teral Inc. (JP) 2024-04-10 EP disclosed
US-20240053855-A1 DISPLAY PANEL AND DISPLAY DEVICE CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. (CN) 2024-02-15 US disclosed
US-20230350516-A1 DISPLAY PANEL AND DISPLAY APPARATUS BOE TECHNOLOGY GROUP CO., LTD. (CN) 2023-11-02 US disclosed
WO-2023167792-A1 ENCAPSULATION ARRANGEMENTS IN LIGHT-EMITTING DIODE PACKAGES CREELED, INC. (US) 2023-09-07 WO disclosed
US-20230282786-A1 ENCAPSULATION ARRANGEMENTS IN LIGHT-EMITTING DIODE PACKAGES JPMORGAN CHASE BANK, N.A. 2023-09-07 US disclosed
JP-H0721638-A TAPE LOADING MECHANISM VICTOR CO OF JAPAN LTD 1995-01-24 JP disclosed
US-5173621-A Transceiver with isolated power rails for ground bounce reduction FAIRCHILD SEMICONDUCTOR CORPORATION (US) 1992-12-22 US disclosed
JP-H04122053-A PACKAGE METHOD OF SEMICONDUCTOR CHIP FUJITSU LTD 1992-04-22 JP disclosed
US-5065224-A Low noise integrated circuit and leadframe FAIRCHILD SEMICONDUCTOR CORPORATION (US) 1991-11-12 US disclosed
JP-H03172532-A TWO-CYCLE ENGINE SUZUKI MOTOR CORP 1991-07-25 JP disclosed
US-4722779-A DETECTION OF OXYGEN IN EXHAUST NGK SPARK PLUG CO., LTD. (JP) 1988-02-02 US disclosed
EP-0251880-A2 Reduction in power rail perturbation and in the effect thereof on integrated circuit performance FAIRCHILD SEMICONDUCTOR CORPORATION (US) 1988-01-07 EP disclosed
EP-0011671-B1 SIGNATURE VERIFICATION SYSTEM AND METHOD OF MANUFACTURING A DOCUMENT FOR AN AUTHORIZED USER Transaction Sciences Corporation (US) 1985-10-16 EP disclosed
JP-S6055647-A SEMICONDUCTOR DEVICE NEC CORP 1985-03-30 JP disclosed
US-3959589-A Digital bit stream synchronizer BELL TELEPHONE LABORATORIES, INCORPORATED (US) 1976-05-25 US disclosed