SCHEMBL71111

SCHEMBL71111

CC(C)(c1ccc(OCC(O)COc2ccc(C(C)(C)c3ccc(OCC4CO4)cc3)cc2)cc1)c1ccc(OCC2CO2)cc1

nearest known ligand 0.78

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 5/20 0.78
MAPT P10636 5/20 0.78
ALDH1A1 P00352 5/20 0.78
MEN1 O00255 4/20 0.78
TP53 P04637 3/20 0.78
TSHR P16473 3/20 0.78
HPGD P15428 3/20 0.78
HIF1A Q16665 3/20 0.78
CYP1A2 P05177 1/20 0.78
PPARG P37231 1/20 0.78
HTT P42858 2/20 0.55
AR P10275 1/20 0.53
TDP1 Q9NUW8 1/20 0.47
LMNA P02545 3/20 0.46
PKM P14618 2/20 0.46
GAA P10253 2/20 0.46
CYP3A4 P08684 1/20 0.43
SMN1; SMN2 Q16637 1/20 0.43
NPSR1 Q6W5P4 2/20 0.41
POLB P06746 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11568438 1.00 KMT2A (0.78) KMT2AMAPTALDH1A1MEN1TP53
SCHEMBL16492078 1.00 KMT2A (0.78) KMT2AMAPTALDH1A1MEN1TP53
SCHEMBL16406951 0.96 KMT2A (0.72) KMT2AMAPTALDH1A1MEN1TP53
SCHEMBL822725 0.96 MAPT (0.72) KMT2AMAPTALDH1A1MEN1TP53
SCHEMBL3544569 0.96 KMT2A (0.72) KMT2AMAPTALDH1A1MEN1TP53
SCHEMBL16406955 0.96 KMT2A (0.72) KMT2AMAPTALDH1A1MEN1TP53
SCHEMBL17464405 0.95 KMT2A (0.76) KMT2AMAPTALDH1A1MEN1TP53
SCHEMBL22620801 0.95 KMT2A (0.70) KMT2AMAPTALDH1A1MEN1TP53
SCHEMBL11926978 0.95 KMT2A (0.70) KMT2AMAPTALDH1A1MEN1TP53
SCHEMBL17225361 0.95 KMT2A (0.70) KMT2AMAPTALDH1A1MEN1TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 673 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8114519-B2 Derivatized solid epoxy resin and uses thereof SIKA TECHNOLOGY AG (CH) 2012-02-14 US claimed
US-20100035041-A1 DERIVATIZED SOLID EPOXY RESIN AND USES THEREOF SIKA TECHNOLOGY AG (CH) 2010-02-11 US claimed
EP-2084200-B1 DERIVATIZED SOLID EPOXY RESIN AND USES THEREOF SIKA TECHNOLOGY AG (CH) 2009-12-30 EP claimed
US-20080275170-A1 METAL OXIDE NANOPARTICLES, METHODS OF MAKING, AND METHODS OF USE CITIBANK, N.A., AS COLLATERAL AGENT 2008-11-06 US claimed
EP-1916285-A1 Derivatized solid epoxy resin and its use Sika Technology AG (CH) 2008-04-30 EP claimed
US-20060293463-A1 Compositions for brightness enhancing films GENERAL ELECTRIC COMPANY 2006-12-28 US claimed
EP-1631603-B1 CURABLE (METH)ACRYLATE COMPOSITIONS GEN ELECTRIC (US) 2006-11-22 EP claimed
US-7087659-B2 Curable (meth)acrylate compositions GENERAL ELECTRICAL (US) 2006-08-08 US claimed
EP-1631603-A1 CURABLE (METH)ACRYLATE COMPOSITIONS GENERAL ELECTRIC COMPANY (US) 2006-03-08 EP claimed
US-6833391-B1 Comprising three monomers having highly brominated phenyl, arylether and bisphenol A or F functionality and initiator; light management films; high refractive index; brightness GENERAL ELECTRIC COMPANY 2004-12-21 US claimed
WO-2004106396-A1 CURABLE (METH)ACRYLATE COMPOSITIONS GENERAL ELECTRIC COMPANY (US) 2004-12-09 WO claimed
US-20040249100-A1 CURABLE (METH)ACRYLATE COMPOSITIONS GENERAL ELECTRIC COMPANY (US) 2004-12-09 US claimed
US-20040242720-A1 Curable (meth)acrylate compositions CITIBANK, N.A., AS COLLATERAL AGENT 2004-12-02 US claimed
US-5008309-A Epoxy resin, curing agent and fillers ASMO CO., LTD. (JP) 1991-04-16 US claimed
US-20240228778-A1 ULTRA-LIGHT EPOXY COMPOSITION 3M INNOVATIVE PROPERTIES COMPANY 2024-07-11 US disclosed
US-12031051-B2 Method of preparing recyclable and self-repairable epoxy anticorrosion coating Henan Academy of Sciences (CN) 2024-07-09 US disclosed
US-20240026124-A1 USE OF DIEUGENOL, OLIGOMERS AND/OR POLYMERS OF EUGENOL FOR STABILIZING ORGANIC MATERIALS, STABILIZED PLASTICS COMPOSITION, STABILIZER COMPOSITION AND METHOD FOR STABILIZING ORGANIC MATERIALS Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. (DE) 2024-01-25 US disclosed
US-5008309-A Epoxy resin, curing agent and fillers ASMO CO., LTD. (JP) 1991-04-16 US disclosed
EP-0419737-A2 Molding method SOMAR CORPORATION (JP) 1991-04-03 EP disclosed
EP-0377332-A2 Laminate film having a thermosetting resin layer and use thereof for forming electrically insulating layer over conducting surface SOMAR CORPORATION (JP) 1990-07-11 EP disclosed