⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17102295 | 0.87 | — | — | |
| SCHEMBL28991804 | 0.87 | — | — | |
| SCHEMBL27805474 | 0.87 | — | — | |
| SCHEMBL7747356 | 0.87 | — | — | |
| SCHEMBL12076561 | 0.82 | — | — | |
| SCHEMBL310479 | 0.82 | — | — | |
| SCHEMBL3517739 | 0.82 | — | — | |
| SCHEMBL285604 | 0.82 | — | — | |
| SCHEMBL21563 | 0.82 | — | — | |
| SCHEMBL12076550 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-220208665-U | Resistance-capacitance electronic device | 福建火炬电子科技股份有限公司 | 2023-12-19 | — | — | CN | disclosed |
| US-6559666-B2 | Method and device for semiconductor testing using electrically conductive adhesives | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2003-05-06 | — | — | US | disclosed |
| US-20010035759-A1 | Method and device for semiconductor testing using electrically conductive adhesives | BERNIER WILLIAM E (US) | 2001-11-01 | — | — | US | disclosed |
| US-20010024127-A1 | SEMICONDUCTOR TESTING USING ELECTRICALLY CONDUCTIVE ADHESIVES | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2001-09-27 | — | — | US | disclosed |
| US-6288559-B1 | Semiconductor testing using electrically conductive adhesives | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2001-09-11 | — | — | US | disclosed |
| US-6268739-B1 | Method and device for semiconductor testing using electrically conductive adhesives | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2001-07-31 | — | — | US | disclosed |