SCHEMBL7186439

SCHEMBL7186439

CCC(N)C(=O)NN

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9648494 0.80
SCHEMBL9221700 0.79
SCHEMBL246284 0.79
SCHEMBL15417545 0.79
SCHEMBL30660250 0.79
SCHEMBL8246948 0.77
SCHEMBL10288542 0.77
SCHEMBL30541580 0.77 DPP7 (0.63)
SCHEMBL8174142 0.76
SCHEMBL31192246 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6624231-B2 Addition-condensation copolymer fluorinated resin SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-09-23 US disclosed
US-6582824-B1 Curable epoxy compound; thermoplastic polyurethane comprised of polyoxytetramethylene glycol and polyisocyanate monomers; automobile and truck joints 3M INNOVATIVE PROPERTIES COMPANY 2003-06-24 US disclosed
US-20020132902-A1 Curable compositions SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-09-19 US disclosed
EP-1165718-A1 HOT MELT ADHESIVE COMPOSITION FOR BONDING A LOCATOR PIN TO GLASS 3M Innovative Properties Company (US) 2002-01-02 EP disclosed
US-20010025079-A1 Hot melt adhesive composition for bonding a locator pin to glass 3M INNOVATIVE PROPERTIES COMPANY 2001-09-27 US disclosed
WO-2001055278-A1 HOT MELT ADHESIVE COMPOSITION FOR BONDING A LOCATOR PIN TO GLASS 3M INNOVATIVE PROPERTIES COMPANY (US) 2001-08-02 WO disclosed
EP-1120450-A1 Hot melt adhesive composition for bonding a locator pin to glass 3M Innovative Properties Company (US) 2001-08-01 EP disclosed
EP-1117748-A1 SEALANT COMPOSITION, ARTICLE AND METHOD MINNESOTA MINING AND MANUFACTURING COMPANY (US) 2001-07-25 EP disclosed
WO-2000020526-A1 SEALANT COMPOSITION, ARTICLE AND METHOD MINNESOTA MINING AND MANUFACTURING COMPANY (US) 2000-04-13 WO disclosed
US-5580946-A Thermoplastic polyurethane-epoxy mixtures that develop cross-linking upon melt processing REFAC INTERNATIONAL, LTD. (US) 1996-12-03 US disclosed
WO-1995013310-A1 MELT PROCESSED CROSSLINKING THERMOPLASTIC POLYURETHANE-EPOXY MIXTURES REFAC INTERNATIONAL, LTD. (US) 1995-05-18 WO disclosed
US-5153274-A Reacting a carboxylated acrylonitrile-butadiene polymer and the resin product of a diamine or dihydrazide and an N,N'-bisimide of an unsaturated carboxylic acid; adhesives; composites; toughness THE SECRETARY OF STATE FOR DEFENCE IN HER MAJESTY'S GOVERNMENT OF THE UNITED KINGDOM OF GREAT BRITAIN AND NORTHERN IRELAND (GB) 1992-10-06 US disclosed
US-5087681-A Thermosetting composition; crosslinked polyimide matrix SECRETARY OF STATE FOR DEFENCE IN HER MAJESTY'S GOVERNMENT OF UNITED KINGDOM (GB) 1992-02-11 US disclosed
EP-0165812-A2 Thermosetting imide resin compositions The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and (GB) 1985-12-27 EP disclosed
EP-0131027-A1 CURABLE THERMOSETTING PREPOLYMERISED IMIDE RESIN COMPOSITIONS. SECR DEFENCE BRIT (GB) 1985-01-16 EP disclosed
WO-1984002528-A1 CURABLE THERMOSETTING PREPOLYMERISED IMIDE RESIN COMPOSITIONS SECR DEFENCE BRIT (GB) 1984-07-05 WO disclosed
US-4211861-A N,N*-BISIMIDE TECHNOCHEMIE GMBH VERFAHRENSTECHNIK (DE) 1980-07-08 US disclosed