SCHEMBL7192072

SCHEMBL7192072

CCCC1CCC(O)(O)CC1

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 1/20 0.36
FYN P06241 1/20 0.34
CYP2C9 P11712 1/20 0.33
CA1 P00915 1/20 0.33
CA2 P00918 1/20 0.33
CA4 P22748 1/20 0.33
OPRM1 P35372 1/20 0.33
OPRK1 P41145 1/20 0.33
OPRL1 P41146 1/20 0.33
ALDH1A1 P00352 3/20 0.32
KMT2A Q03164 3/20 0.32
MEN1 O00255 2/20 0.32
CYP2D6 P10635 1/20 0.32
CTDSP1 Q9GZU7 1/20 0.32
LMNA P02545 2/20 0.32
MAPK1 P28482 2/20 0.32
MAPT P10636 1/20 0.32
HTT P42858 1/20 0.31
GBA1 P04062 1/20 0.31
NOS3 P29474 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9196414 0.86 CYP1A2 (0.54) CYP1A2CYP2C9KMT2AMEN1CYP2D6
SCHEMBL13361159 0.85 CYP1A2 (0.36) CYP1A2FYNCYP2C9CA1CA2
SCHEMBL12481818 0.83 ESR2 (0.35) CYP1A2FYNCYP2C9CA1CA2
SCHEMBL13072139 0.79 CYP1A2 (0.32) CYP1A2FYNCYP2C9CA1CA2
SCHEMBL28573519 0.79 KDM4E (0.42) ALDH1A1MAPT
SCHEMBL10486165 0.78 CYP2C9 (0.33) CYP1A2FYNCYP2C9OPRM1OPRK1
SCHEMBL10486153 0.78 CYP2C9 (0.33) CYP1A2FYNCYP2C9OPRM1OPRK1
SCHEMBL6308213 0.78 CYP1A2 (0.31) CYP1A2FYNCYP2C9OPRM1OPRK1
SCHEMBL10486159 0.78 CYP2C9 (0.33) CYP1A2FYNCYP2C9OPRM1OPRK1
SCHEMBL19012099 0.77 CYP1A2 (0.37) CYP1A2FYNCYP2C9CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6630230-B2 Amorphous polyethylene terephthalate resin and a polyetherester resin; heat shrinkage MITSUBISHI ENGINEERING PLASTICS CORPORATION (JP) 2003-10-07 US disclosed
US-20020146515-A1 Aqueous compositions for coating metal components BASF AKTIENGESELLSCHAFT (DE) 2002-10-10 US disclosed
EP-1229086-A1 Utilisation of aqueous polymer dispersion compositions for the coating of metal objects BASF AKTIENGESELLSCHAFT (DE) 2002-08-07 EP disclosed
US-6355336-B1 Multi-layer packaging film MITSUBISHI, ENGINEERING-PLASTICS CORPORATION (JP) 2002-03-12 US disclosed
US-20010047063-A1 Polyester resin composition and film using the same MITSUBISHI ENGINEERING PLASTICS CORPORATION (JP) 2001-11-29 US disclosed
EP-0077593-B1 PHOTOSENSITIVE MATERIAL FOR ELECTROPHOTOGRAPHY MITA INDUSTRIAL CO. LTD. (JP) 1988-01-20 EP disclosed
US-4551403-A ELECTROCONDUCTIVE SUBSTRATE, AND CHARGE TRANSFER MEDIUM AND CHARGEGENERATING PIGMENT IN POLYESTER MATRIX MITA INDUSTRIAL CO., LTD. (JP) 1985-11-05 US disclosed
EP-0077593-A2 Photosensitive material for electrophotography MITA INDUSTRIAL CO. LTD. (JP) 1983-04-27 EP disclosed