Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.57 |
| ▸ | THRB | P10828 | 1/20 | 0.57 |
| ▸ | GGPS1 | O95749 | 6/20 | 0.46 |
| ▸ | FDPS | P14324 | 9/20 | 0.44 |
| ▸ | SMPD1 | P17405 | 2/20 | 0.42 |
| ▸ | CES2 | O00748 | 1/20 | 0.42 |
| ▸ | LPAR1 | Q92633 | 1/20 | 0.42 |
| ▸ | LPAR3 | Q9UBY5 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8684922 | 1.00 | TSHR (0.57) | TSHRTHRBGGPS1FDPSSMPD1 | |
| SCHEMBL8684908 | 1.00 | TSHR (0.57) | TSHRTHRBGGPS1FDPSSMPD1 | |
| SCHEMBL8685537 | 1.00 | TSHR (0.57) | TSHRTHRBGGPS1FDPSSMPD1 | |
| SCHEMBL10708964 | 1.00 | TSHR (0.57) | TSHRTHRBGGPS1FDPSSMPD1 | |
| SCHEMBL10519632 | 1.00 | TSHR (0.57) | TSHRTHRBGGPS1FDPSSMPD1 | |
| Tridecane SCHEMBL8588770 | 1.00 | TSHR (0.57) | TSHRTHRBGGPS1FDPSSMPD1 | |
| SCHEMBL8685336 | 1.00 | TSHR (0.57) | TSHRTHRBGGPS1FDPSSMPD1 | |
| SCHEMBL8686291 | 1.00 | TSHR (0.57) | TSHRTHRBGGPS1FDPSSMPD1 | |
| SCHEMBL8686237 | 1.00 | TSHR (0.57) | TSHRTHRBGGPS1FDPSSMPD1 | |
| SCHEMBL8684839 | 1.00 | TSHR (0.57) | TSHRTHRBGGPS1FDPSSMPD1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4301823-A1 | CURABLE ADHESIVE COMPOSITION COMPRISING MALEIMIDE AND THIOL | Henkel AG & Co. KGaA (DE) | 2024-01-10 | — | — | EP | disclosed |
| WO-2022183481-A1 | CURABLE ADHESIVE COMPOSITION COMPRISING MALEIMIDE AND THIOL | HENKEL AG & CO. KGAA (DE) | 2022-09-09 | — | — | WO | disclosed |
| CN-109196414-A | Sealing material for liquid crystal display device, upper and lower conductive material and liquid crystal display element | 积水化学工业株式会社 | 2019-01-11 | — | — | CN | disclosed |
| CN-108780247-A | Sealing agent for liquid crystal display element, vertical conduction material, and liquid crystal display element | 积水化学工业株式会社 | 2018-11-09 | — | — | CN | disclosed |
| CN-108780249-A | Sealing material for liquid crystal display device, upper and lower conductive material and liquid crystal display element | 积水化学工业株式会社 | 2018-11-09 | — | — | CN | disclosed |
| WO-2018129686-A1 | RADIATION CURABLE SEALANT COMPOSITION | HENKEL AG & CO. KGAA (DE) | 2018-07-19 | — | — | WO | disclosed |
| CN-103858216-B | For the composition of electronic installation | 汉高股份有限及两合公司 | 2017-06-06 | — | — | CN | disclosed |
| CN-103875065-B | Underfill composition | 汉高股份有限及两合公司 | 2017-02-15 | — | — | CN | disclosed |
| CN-103781870-B | Encapsulant composition | HENKEL AG & CO.KGAA (DE) | 2015-12-16 | — | — | CN | disclosed |
| CN-103875065-A | Underfill composition | HENKEL AG & CO KGAA | 2014-06-18 | — | — | CN | disclosed |
| CN-101488480-A | Interlayer dielectric and pre-applied die attach adhesive materials | HENKEL CORP (US) | 2009-07-22 | — | — | CN | disclosed |
| CN-100449776-C | Interlayer dielectric and pre-applied die attach adhesive material | HENKEL LOCTITE CORP (US) | 2009-01-07 | — | — | CN | disclosed |
| CN-101209987-A | Thermosetting resin composition containing maleimide and/or vinyl compound | HENKEL CORP (US) | 2008-07-02 | — | — | CN | disclosed |
| CN-1663048-A | Interlayer dielectric and pre-applied die attach adhesive material | HENKEL LOCTITE CORP (US) | 2005-08-31 | — | — | CN | disclosed |
| WO-2003107427-A1 | INTERLAYER DIELECTRIC AND PRE-APPLIED DIE ATTACH ADHESIVE MATERIALS | HENKEL LOCTITE CORPORATION (US) | 2003-12-24 | — | — | WO | disclosed |
| EP-0950082-A4 | REDUCING VOID FORMATION IN CURABLE ADHESIVE FORMULATIONS | QUANTUM MATERIALS INC (US) | 2000-07-12 | — | — | EP | disclosed |
| CN-1243141-A | Method for producing electronic element using binder capable of reprocessing | NAT STARCH CHEM INVEST (US) | 2000-02-02 | — | — | CN | disclosed |
| EP-0950082-A1 | REDUCING VOID FORMATION IN CURABLE ADHESIVE FORMULATIONS | QUANTUM MATERIALS, INC. (US) | 1999-10-20 | — | — | EP | disclosed |
| WO-1998030647-A1 | REDUCING VOID FORMATION IN CURABLE ADHESIVE FORMULATIONS | QUANTUM MATERIALS, INC. (US) | 1998-07-16 | — | — | WO | disclosed |
| CN-1158607-A | Thermosetting resin composition containing maleimide and/or vinyl compound | QUANTUM MATERIALS INC (US) | 1997-09-03 | — | — | CN | disclosed |