⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10035838 | 0.86 | — | — | |
| SCHEMBL13308377 | 0.83 | — | — | |
| SCHEMBL1357985 | 0.79 | — | — | |
| SCHEMBL962080 | 0.79 | — | — | |
| SCHEMBL962467 | 0.79 | — | — | |
| SCHEMBL962079 | 0.79 | — | — | |
| Hydrochloric Acid SCHEMBL384029 | 0.76 | — | — | |
| Hydrochloric Acid SCHEMBL382834 | 0.76 | — | — | |
| Iodide SCHEMBL3088722 | 0.76 | — | — | |
| Hydrochloric Acid SCHEMBL14722960 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6607653-B1 | Tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the alloy with | DAIWA FINE CHEMICALS CO., LTD. (JP) | 2003-08-19 | — | — | US | disclosed |