SCHEMBL7204328

SCHEMBL7204328

c1ccc(SSc2cccc(SSc3ccccn3)n2)nc1

nearest known ligand 0.81

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
APOBEC3G Q9HC16 2/20 0.81
EHMT2 Q96KQ7 1/20 0.81
EHMT1 Q9H9B1 1/20 0.81
L3MBTL1 Q9Y468 3/20 0.48
TDP1 Q9NUW8 5/20 0.44
KDM4E B2RXH2 4/20 0.44
LMNA P02545 4/20 0.44
HTT P42858 3/20 0.44
SMN1; SMN2 Q16637 2/20 0.44
CCR1 P32246 2/20 0.44
CCR5 P51681 2/20 0.44
CCR8 P51685 2/20 0.44
TP53 P04637 1/20 0.44
ALPL P05186 1/20 0.44
HSP90AA1 P07900 1/20 0.44
ALPI P09923 1/20 0.44
ALPG P10696 1/20 0.44
ALOX15 P16050 1/20 0.44
MAPK1 P28482 1/20 0.44
ALDH1A1 P00352 5/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7208721 1.00 APOBEC3G (0.81) APOBEC3GEHMT2EHMT1L3MBTL1TDP1
SCHEMBL21174 0.90 EHMT2 (1.00) APOBEC3GEHMT2EHMT1L3MBTL1TDP1
SCHEMBL29349787 0.90 EHMT2 (1.00) APOBEC3GEHMT2EHMT1L3MBTL1TDP1
SCHEMBL27972393 0.90 EHMT2 (1.00) APOBEC3GEHMT2EHMT1L3MBTL1TDP1
Ammonia Solution, Strong SCHEMBL421495 0.87 EHMT2 (0.94) APOBEC3GEHMT2EHMT1L3MBTL1TDP1
Hydrochloric Acid SCHEMBL10707236 0.87 EHMT2 (0.94) APOBEC3GEHMT2EHMT1L3MBTL1TDP1
Hydrogen Sulfide SCHEMBL3347200 0.87 EHMT2 (0.94) APOBEC3GEHMT2EHMT1L3MBTL1TDP1
Hydrochloric Acid SCHEMBL8671988 0.87 EHMT2 (0.94) APOBEC3GEHMT2EHMT1L3MBTL1TDP1
Hydrochloric Acid SCHEMBL11726971 0.87 EHMT2 (0.94) APOBEC3GEHMT2EHMT1L3MBTL1TDP1
SCHEMBL23714221 0.86 EHMT2 (0.65) APOBEC3GEHMT2EHMT1L3MBTL1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11939691-B2 Tin or tin alloy electroplating bath, and electronic component having electrodeposit formed thereon using the plating bath ISHIHARA CHEMICAL CO., LTD. (JP) 2024-03-26 US disclosed
US-6607653-B1 Tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the alloy with DAIWA FINE CHEMICALS CO., LTD. (JP) 2003-08-19 US disclosed