Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | EPHX1 | P07099 | 1/20 | 0.68 |
| ▸ | ACHE | P22303 | 12/20 | 0.60 |
| ▸ | NAAA | Q02083 | 1/20 | 0.55 |
| ▸ | TSHR | P16473 | 2/20 | 0.50 |
| ▸ | FAAH | O00519 | 1/20 | 0.50 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28164347 | 1.00 | EPHX1 (0.68) | EPHX1ACHENAAATSHRFAAH | |
| SCHEMBL28085686 | 1.00 | EPHX1 (0.68) | EPHX1ACHENAAATSHRFAAH | |
| SCHEMBL28164860 | 1.00 | EPHX1 (0.68) | EPHX1ACHENAAATSHRFAAH | |
| SCHEMBL28164866 | 1.00 | EPHX1 (0.68) | EPHX1ACHENAAATSHRFAAH | |
| SCHEMBL723173 | 1.00 | EPHX1 (0.68) | EPHX1ACHENAAATSHRFAAH | |
| SCHEMBL10878591 | 1.00 | EPHX1 (0.68) | EPHX1ACHENAAATSHRFAAH | |
| SCHEMBL28164348 | 1.00 | EPHX1 (0.68) | EPHX1ACHENAAATSHRFAAH | |
| SCHEMBL28164343 | 1.00 | EPHX1 (0.68) | EPHX1ACHENAAATSHRFAAH | |
| SCHEMBL18641585 | 1.00 | EPHX1 (0.68) | EPHX1ACHENAAATSHRFAAH | |
| SCHEMBL28164392 | 1.00 | EPHX1 (0.68) | EPHX1ACHENAAATSHRFAAH |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7947637-B2 | Cleaning formulation for removing residues on surfaces | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2011-05-24 | — | — | US | claimed |
| EP-2041776-A2 | CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES | FujiFilm Electronic Materials USA, Inc. (US) | 2009-04-01 | — | — | EP | claimed |
| WO-2008005354-A2 | CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-01-10 | — | — | WO | claimed |
| US-20080004197-A1 | CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2008-01-03 | — | — | US | claimed |
| CN-109642086-A | resin composition and use thereof | 住友化学株式会社 | 2019-04-16 | — | — | CN | disclosed |
| CN-109311270-A | Laminate, building material, building, and heat-insulating container | 住友化学株式会社 | 2019-02-05 | — | — | CN | disclosed |
| CN-109312167-A | Resin combination and its application | 住友化学株式会社 | 2019-02-05 | — | — | CN | disclosed |
| CN-109312017-A | Polymer, molded article, foam, resin composition, and method for producing polymer | 住友化学株式会社 | 2019-02-05 | — | — | CN | disclosed |
| CN-108291091-A | Resin product and drug effect component slow release equipment | 住友化学株式会社 | 2018-07-17 | — | — | CN | disclosed |
| CN-107001524-A | Polymer | 住友化学株式会社 | 2017-08-01 | — | — | CN | disclosed |
| US-20120048295-A1 | CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2012-03-01 | — | — | US | disclosed |
| US-7947637-B2 | Cleaning formulation for removing residues on surfaces | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2011-05-24 | — | — | US | disclosed |
| WO-2010104816-A1 | CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2010-09-16 | — | — | WO | disclosed |
| EP-2041776-A2 | CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES | FujiFilm Electronic Materials USA, Inc. (US) | 2009-04-01 | — | — | EP | disclosed |
| WO-2008005354-A2 | CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-01-10 | — | — | WO | disclosed |
| US-20080004197-A1 | CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2008-01-03 | — | — | US | disclosed |