SCHEMBL722291

SCHEMBL722291

Nc1cc1=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1900952 0.76
SCHEMBL12124166 0.68 PTK2 (0.47)
SCHEMBL107641 0.67 PTK2 (1.00)
SCHEMBL29614551 0.63 PTK2 (0.89)
Water SCHEMBL28568573 0.63 PTK2 (0.89)
Hydrochloric Acid SCHEMBL208784 0.63 PTK2 (0.89)
SCHEMBL11441247 0.63 MEN1 (0.50)
SCHEMBL29769761 0.63 PTK2 (0.89)
Bromide SCHEMBL28372878 0.63 PTK2 (0.89)
Bromide SCHEMBL17912402 0.63 PTK2 (0.89)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9773997-B2 Adhesive composition and display device SAMSUNG DISPLAY CO., LTD. (KR) 2017-09-26 US claimed
US-20170025485-A1 ADHESIVE COMPOSITION AND DISPLAY DEVICE SAMSUNG DISPLAY CO., LTD. (KR) 2017-01-26 US claimed
US-20260146026-A1 COMPOUND, COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT ADEKA CORPORATION (JP) 2026-05-28 US disclosed
EP-4610254-A1 COMPOUND, COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT ADEKA CORPORATION (JP) 2025-09-03 EP disclosed
CN-120019045-A Compound, composition, cured product, method for producing cured product, and method for producing electronic component 株式会社艾迪科 2025-05-16 CN disclosed
CN-114450375-B Adhesive composition 住友化学株式会社 2024-10-25 CN disclosed
US-20240352203-A1 FILM-FORMING MATERIAL FOR SEMICONDUCTOR, MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, PROCESS MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, UNDERLAYER FILM-FORMING MATERIAL, UNDERLAYER FILM, AND SEMICONDUCTOR DEVICE ADEKA CORPORATION (JP) 2024-10-24 US disclosed
US-20240302742-A1 PHOTORESIST COMPOSITION INCLUDING PHOTOSENSITIVE POLYMER AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE SAMSUNG ELECTRONICS CO., LTD. (KR) 2024-09-12 US disclosed
CN-118625595-A Nonionic non-chemically amplified photoresist composition comprising photosensitive polymer and method of manufacturing integrated circuit device 三星电子株式会社 2024-09-10 CN disclosed
US-20240241438-A1 PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2024-07-18 US disclosed
EP-4375750-A1 FILM-FORMING MATERIAL FOR SEMICONDUCTOR, MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, PROCESS MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, UNDERLAYER FILM-FORMING MATERIAL, UNDERLAYER FILM, AND SEMICONDUCTOR DEVICE ADEKA CORPORATION (JP) 2024-05-29 EP disclosed
CN-114450375-A Adhesive composition 住友化学株式会社 2022-05-06 CN disclosed
WO-2021132235-A1 ADHESIVE COMPOSITION 住友化学株式会社 2021-07-01 WO disclosed
WO-2021070801-A1 ADHESIVE COMPOSITION 住友化学株式会社 2021-04-15 WO disclosed
WO-2021070800-A1 ADHESIVE COMPOSITION 住友化学株式会社 2021-04-15 WO disclosed
WO-2021070799-A1 ADHESIVE AGENT COMPOSITION 住友化学株式会社 2021-04-15 WO disclosed
CN-104285168-B Polarization plates 住友化学株式会社 2017-03-08 CN disclosed
CN-104285168-A Polarizing plate SUMITOMO CHEMICAL CO 2015-01-14 CN disclosed
US-8426649-B2 Cyclopropenones and the photochemical generation of cyclic alkynes therefrom UNIVERSITY OF GEORGIA RESEARCH FOUNDATION, INC. (US) 2013-04-23 US disclosed
US-20120053299-A1 Cyclopropenones and the Photochemical Generation of Cyclic Alkynes Therefrom UNIVERSITY OF GEORGIA RESEARCH FOUNDATION, INC. (US) 2012-03-01 US disclosed