SCHEMBL722306

SCHEMBL722306

O=C1OC(=O)C2C3CCC(C12)C1C(=O)OC(=O)C31

nearest known ligand 0.55

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.55
GMNN O75496 1/20 0.55
PPM1B O75688 1/20 0.55
LMNA P02545 1/20 0.55
PPP1CC P36873 1/20 0.55
TFPI2 P48307 1/20 0.55
RAB9A P51151 1/20 0.55
PPP5C P53041 1/20 0.55
PPP1CA P62136 1/20 0.55
PMP22 Q01453 1/20 0.55
SMN1; SMN2 Q16637 1/20 0.55
TDP1 Q9NUW8 1/20 0.55
TP53 P04637 1/20 0.55
CYP2D6 P10635 1/20 0.55
NFKB1 P19838 1/20 0.55
THPO P40225 1/20 0.55

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15498551 1.00 KDM4E (0.55) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL10080802 1.00 KDM4E (0.55) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL4570299 1.00 KDM4E (0.55) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL19576251 1.00 KDM4E (0.55) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL15498640 1.00 KDM4E (0.55) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL21338787 1.00 KDM4E (0.55) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL12172590 0.88 KDM4E (0.50) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL15762393 0.88 KDM4E (0.50) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL15033322 0.87 KDM4E (0.44) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL12664900 0.86 KDM4E (0.48) KDM4EGMNNPPM1BLMNAPPP1CC

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 369 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250346788-A1 POLYMALEIMIDE RESIN, RESIN COMPOSITION, CURED OBJECT, SHEET, LAMINATE, AND PRINTED WIRING BOARD RESONAC CORP (JP) 2025-11-13 US claimed
US-20250341777-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR ELEMENT RESONAC CORP (JP) 2025-11-06 US claimed
CN-113444366-B Single layer polymer film and electronic device 杜邦电子公司 2025-05-27 CN claimed
CN-119192636-A Semi-aromatic polyimide dielectric film and preparation method thereof 中南大学 2024-12-27 CN claimed
CN-119072519-A Polymaleimide resin, resin composition, cured product, sheet, laminate, and printed wiring board 株式会社力森诺科 2024-12-03 CN claimed
CN-119072659-A Photosensitive resin composition, cured product, and semiconductor element 株式会社力森诺科 2024-12-03 CN claimed
WO-2024154780-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR ELEMENT 株式会社レゾナック 2024-07-25 WO claimed
US-20230183435-A1 POLYIMIDE FILMS AND ELECTRONIC DEVICES DUPONT ELECTRONCS INC (US) 2023-06-15 US claimed
US-11603440-B2 Polyimide films and electronic devices DUPONT ELECTRONICS, INC. (US) 2023-03-14 US claimed
US-11535710-B2 Single layer polymer films and electronic devices DUPONT ELECTRONICS, INC. 2022-12-27 US claimed
US-20210301086-A1 SINGLE LAYER POLYMER FILMS AND ELECTRONIC DEVICES U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2021-09-30 US claimed
US-20210079182-A1 POLYIMIDE FILMS AND ELECTRONIC DEVICES DUPONT ELECTRONICS, INC. 2021-03-18 US claimed
US-20210079181-A1 POLYIMIDE FILMS AND ELECTRONIC DEVICES U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2021-03-18 US claimed
US-10928730-B2 Photosensitive resin composition, and polymer film made therefrom Zhen Ding Technology Co., Ltd. (TW) 2021-02-23 US claimed
US-20200270406-A1 POLYIMIDE FILMS AND ELECTRONIC DEVICES U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2020-08-27 US claimed
EP-1368411-B1 PHOTOACTIVE POLYMER ROLIC AG (CH) 2005-07-06 EP claimed
US-20260102993-A1 ELECTRICALLY INSULATING LAMINATES FOR ELECTRIC MACHINE APPLICATIONS DUPONT ELECTRONICS INC (US) 2026-04-16 US disclosed
EP-4711400-A1 PROCESS FOR PREPARING WATER-BASED POLYIMIDES ASTA Energy Solutions GmbH (AT) 2026-03-18 EP disclosed
WO-2006052313-A1 POLYIMIDE ELECTRODE BINDERS 3M INNOVATIVE PROPERTIES COMPANY (US) 2006-05-18 WO disclosed
US-20060099506-A1 Polyimide electrode binders 3M INNOVATIVE PROPERTIES COMPANY 2006-05-11 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260102993-A1 ELECTRICALLY INSULATING LAMINATES FOR ELECTRIC MACHINE APPLICATIONS AS3MT, SMCHD1, ASH2L KDM4E 766/4885GMNN 253/4885PPM1B 2859/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.