SCHEMBL722575

SCHEMBL722575

C[Si](C)(O[SiH3])[SiH2]O[SiH](c1ccccc1)c1ccccc1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2918670 0.85
SCHEMBL483504 0.84
SCHEMBL9422215 0.78
SCHEMBL3969057 0.78
SCHEMBL12815158 0.78
SCHEMBL9422213 0.74
SCHEMBL7715457 0.74
SCHEMBL9978307 0.73
SCHEMBL7956058 0.73
SCHEMBL9314407 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 691 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120649193-B Organic silicon fiber and preparation method thereof 苏州大学 2026-05-12 CN claimed
CN-119039588-A Siloxane benzocyclobutene prepolymer, solvent-free high-temperature-resistant low-dielectric ink for inkjet 3D printing, and preparation method and application thereof 大连理工大学 2024-11-29 CN claimed
CN-115404022-B Adhesive tape with non-crosslinked silicone pressure-sensitive adhesive 德莎欧洲股份公司 2024-04-02 CN claimed
US-11773117-B2 Compound for enhancing adhesion properties of polyimide resin and polyimide copolymer produced using same LG CHEM, LTD. (KR) 2023-10-03 US claimed
CN-115404022-A Adhesive tape with non-crosslinked silicone pressure sensitive adhesive 德莎欧洲股份公司 2022-11-29 CN claimed
CN-110461857-B Compound for improving adhesive characteristics of polyimide resin and polyimide copolymer prepared using the same 株式会社LG化学 2022-07-26 CN claimed
WO-2022124458-A1 NON-SLIP PAD FOR SEMICONDUCTOR WAFER TRANSFER HAVING HEAT RESISTANCE AND CONDUCTIVITY 주식회사 글린트머티리얼즈 2022-06-16 WO claimed
US-11312889-B2 Moisture-crosslinkable, dimensionally stable polymer material TESA SE (DE) 2022-04-26 US claimed
CN-110114388-B Polyimide copolymer and polyimide film using same 株式会社LG化学 2021-08-27 CN claimed
CN-113004807-A Thermosetting conductive adhesive and preparation method thereof 无锡帝科电子材料股份有限公司 2021-06-22 CN claimed
EP-1139921-B1 LENSES CAPABLE OF POST-FABRICATION POWER MODIFICATION CALIFORNIA INST OF TECHN (US) 2007-03-07 EP claimed
EP-1730085-A2 GLASS-CERAMIC AND GLASS PLATES, HEATING PLATES, AND PREPARATION Eurokera (FR) 2006-12-13 EP claimed
WO-2005092810-A2 GLASS-CERAMIC AND GLASS PLATES, HEATING PLATES, AND PREPARATION EUROKERA (FR) 2005-10-06 WO claimed
US-20050214521-A1 Glass-ceramic and glass plates, heating plates, and preparation EUROKERA (FR) 2005-09-29 US claimed
EP-0776946-B1 Heat resistant polyorganosiloxane compositions DOW CORNING TORAY SILICONE (JP) 2003-04-16 EP claimed
US-6031049-A Blends comprising a syndiotactic polystyrene and a polyphenylene ether IDEMITSU PETROCHEMICAL CO., LTD. (JP) 2000-02-29 US claimed
EP-0767211-B1 Styrene-based resin composition IDEMITSU PETROCHEMICAL CO (JP) 1999-04-21 EP claimed
EP-0767211-A1 Styrene-based resin composition IDEMITSU PETROCHEMICAL CO., LTD. (JP) 1997-04-09 EP claimed
EP-0566936-B1 Aquatic antifouling mortar composition DOW CORNING TORAY SILICONE (JP) 1995-12-06 EP claimed
EP-0566936-A1 Aquatic antifouling mortar composition Dow Corning Toray Silicone Company, Limited (JP) 1993-10-27 EP claimed