⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6850849 | 0.82 | — | — | |
| Hydrochloric Acid SCHEMBL8157385 | 0.80 | — | — | |
| Hydrochloric Acid SCHEMBL8157380 | 0.80 | — | — | |
| SCHEMBL783218 | 0.79 | — | — | |
| Chloromethane SCHEMBL8158371 | 0.78 | — | — | |
| SCHEMBL8381030 | 0.78 | — | — | |
| SCHEMBL28189147 | 0.78 | — | — | |
| Bromide SCHEMBL8380566 | 0.76 | — | — | |
| Bromide SCHEMBL9080053 | 0.76 | — | — | |
| Hydrochloric Acid SCHEMBL9078801 | 0.76 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 264 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12252452-B2 | Coatings on particles of high energy materials and methods of forming same | Forge Nano, Inc. (US) | 2025-03-18 | — | — | US | claimed |
| WO-2025000320-A1 | METHOD FOR PREPARING POLYOLEFIN BY MEANS OF CASCADE POLYMERIZATION | 浙江大学衢州研究院 | 2025-01-02 | — | — | WO | claimed |
| US-20240166774-A1 | METHOD FOR PREPARING SUPPORTED OLEFIN POLYMERIZATION CATALYST, RESULTING CATALYST AND APPLICATION THEREOF | ZHEJIANG UNIVERSITY (CN) | 2024-05-23 | — | — | US | claimed |
| EP-4273177-A1 | METHOD FOR PREPARING SUPPORTED OLEFIN POLYMERIZATION CATALYST, RESULTING CATALYST AND APPLICATION THEREOF | Zhejiang University (CN) | 2023-11-08 | — | — | EP | claimed |
| CN-111732682-B | Preparation method of cross-linked polyolefin for packaging high-light-transmittance solar cell | 浙江大学 | 2022-12-23 | — | — | CN | claimed |
| CN-111690086-B | Preparation method of rapid crosslinking type propenyl polyolefin for packaging solar cell | 浙江大学衢州研究院 | 2022-11-08 | — | — | CN | claimed |
| WO-2022133849-A1 | METHOD FOR PREPARING SUPPORTED OLEFIN POLYMERIZATION CATALYST, RESULTING CATALYST AND APPLICATION THEREOF | 浙江大学 | 2022-06-30 | — | — | WO | claimed |
| WO-2021081219-A1 | HAFNIUM ALUMINUM OXIDE COATINGS DEPOSITED BY ATOMIC LAYER DEPOSITION | APPLIED MATERIALS, INC. (US) | 2021-04-29 | — | — | WO | claimed |
| US-20210123143-A1 | HAFNIUM ALUMINUM OXIDE COATINGS DEPOSITED BY ATOMIC LAYER DEPOSITION | APPLIED MATERIALS, INC. | 2021-04-29 | — | — | US | claimed |
| US-20180087164-A1 | TUNING ELECTRODE SURFACE ELECTRONICS WITH THIN LAYERS | CALIFORNIA INST OF TECHN (US) | 2018-03-29 | — | — | US | claimed |
| US-20160027614-A1 | DEPOSITION OF METAL DOPED AMORPHOUS CARBON FILM | APPLIED MATERIALS, INC. | 2016-01-28 | — | — | US | claimed |
| US-20150064361-A1 | UV treatment for ALD film densification | INTERMOLECULAR INC. (US) | 2015-03-05 | — | — | US | claimed |
| US-8841153-B2 | Method for producing a doped organic semiconducting layer | OSRAM OPTO SEMICONDUCTORS GMBH (DE) | 2014-09-23 | — | — | US | claimed |
| US-6410665-B1 | POLYMERIZATION COORDINATION CATALYST FOR ALPHA-OLEFIN | BASELL POLYOLEFINE GMBH (DE) | 2002-06-25 | — | — | US | claimed |
| EP-0675907-B1 | A PROCESS FOR FORMING A CARRIER MATERIAL | MOBIL OIL CORP (US) | 1999-09-22 | — | — | EP | claimed |
| US-5475067-A | Polymerizing in a semi-continuous pulsating manner; molecular weight control | EXXON CHEMICAL PATENTS INC. (US) | 1995-12-12 | — | — | US | claimed |
| EP-0474391-B1 | Polyolefins | NIPPON OIL CO LTD (JP) | 1995-10-25 | — | — | EP | claimed |
| EP-0422703-B1 | CATALYST AND PROCESS FOR THE POLYMERIZATION AND COPOLYMERIZATION OF ALPHA-OLEFINS | Enichem Anic S.r.l. (IT) | 1993-06-30 | — | — | EP | claimed |
| EP-0474391-A2 | Polyolefins | NIPPON OIL CO. LTD. (JP) | 1992-03-11 | — | — | EP | claimed |
| EP-4688204-A1 | ATOMIC LAYER DEPOSITION OF FILTRATION MEDIA | Donaldson Company, Inc. (US) | 2026-02-11 | — | — | EP | disclosed |
| US-20250340995-A1 | A THERMALLY STABLE GRAPHENE-CONTAINING LAMINATE | Paragraf Limited (GB) | 2025-11-06 | — | — | US | disclosed |
| US-20250331196-A1 | MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | TAIWAN SEMICONDUCTOR MFG CO LTD (TW) | 2025-10-23 | — | — | US | disclosed |
| US-20250311238-A1 | SELECTION DEVICE, MANUFACTURING METHOD THEREFOR, AND NON-VOLATILE MEMORY DEVICE COMPRISING SELECTION DEVICE | FOUNDATION FOR RESEARCH AND BUSINESS, SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY (KR) | 2025-10-02 | — | — | US | disclosed |
| EP-3735601-B1 | OPTICAL ELEMENTS BASED ON POLYMERIC STRUCTURES INCORPORATING INORGANIC MATERIALS | MAGIC LEAP INC (US) | 2025-08-27 | — | — | EP | disclosed |
| US-12394163-B2 | Optical elements based on polymeric structures incorporating inorganic materials | MAGIC LEAP, INC. (US) | 2025-08-19 | — | — | US | disclosed |
| US-12394626-B2 | Method of forming a structure and system for same | ASM IP HOLDING B.V. (NL) | 2025-08-19 | — | — | US | disclosed |
| US-20250250666-A1 | LATERAL GAP FILL | LAM RESEARCH CORPORATION | 2025-08-07 | — | — | US | disclosed |
| US-12382640-B2 | Memory device and method for fabricating the same | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2025-08-05 | — | — | US | disclosed |
| US-20250191908-A1 | TUNABILITY OF DOPANT CONCENTRATION IN THIN HAFNIUM OXIDE FILMS | APPLIED MATERIALS, INC. (US) | 2025-06-12 | — | — | US | disclosed |
| US-12313709-B2 | Magnetoresistive sensor | Paragraf Limited (GB) | 2025-05-27 | — | — | US | disclosed |
| EP-4537642-A1 | A THERMALLY STABLE GRAPHENE-CONTAINING LAMINATE | Paragraf Limited (GB) | 2025-04-16 | — | — | EP | disclosed |
| US-12274068-B2 | Method of forming ferroelectric memory device | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2025-04-08 | — | — | US | disclosed |
| US-12252452-B2 | Coatings on particles of high energy materials and methods of forming same | Forge Nano, Inc. (US) | 2025-03-18 | — | — | US | disclosed |
| EP-4511324-A1 | A GRAPHENE-CONTAINING LAMINATE | Paragraf Limited (GB) | 2025-02-26 | — | — | EP | disclosed |
| US-12238932-B2 | Ferroelectric memory device, manufacturing method of the ferroelectric memory device and semiconductor chip | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2025-02-25 | — | — | US | disclosed |
| US-20250062118-A1 | HIGH PRESSURE PLASMA INHIBITION | LAM RES CORP (US) | 2025-02-20 | — | — | US | disclosed |
| US-20250037988-A1 | SILICON OXIDE DEPOSITION METHOD | ASM IP HOLDING B.V. (NL) | 2025-01-30 | — | — | US | disclosed |
| WO-2025000320-A1 | METHOD FOR PREPARING POLYOLEFIN BY MEANS OF CASCADE POLYMERIZATION | 浙江大学衢州研究院 | 2025-01-02 | — | — | WO | disclosed |
| US-12148609-B2 | Silicon oxide deposition method | ASM IP HOLDING B.V. (NL) | 2024-11-19 | — | — | US | disclosed |
| US-20240325990-A1 | ATOMIC LAYER DEPOSITION OF FILTRATION MEDIA | DONALDSON COMPANY, INC. | 2024-10-03 | — | — | US | disclosed |
| WO-2024206872-A1 | ATOMIC LAYER DEPOSITION OF FILTRATION MEDIA | DONALDSON COMPANY, INC. (US) | 2024-10-03 | — | — | WO | disclosed |
| US-20240273839-A1 | OPTICAL ELEMENTS BASED ON POLYMERIC STRUCTURES INCORPORATING INORGANIC MATERIALS | CITIBANK, N.A., AS COLLATERAL AGENT | 2024-08-15 | — | — | US | disclosed |
| US-12043893-B2 | Manufacturing processes to synthesize, functionalize, surface treat and/or encapsulate powders, and applications thereof | Forge Nano, Inc. (US) | 2024-07-23 | — | — | US | disclosed |
| US-20240228401-A1 | COATINGS ON PARTICLES OF HIGH ENERGY MATERIALS AND METHODS OF FORMING SAME | Forge Nano Inc. | 2024-07-11 | — | — | US | disclosed |
| US-20240222068-A1 | CONDENSATE PRECURSORS AND CONTAMINANT PURGE APPARATUS AND METHODS | FEI COMPANY (US) | 2024-07-04 | — | — | US | disclosed |
| US-20240218509-A1 | MINIMIZING RADICAL RECOMBINATION USING ALD SILICON OXIDE SURFACE COATING WITH INTERMITTENT RESTORATION PLASMA | LAM RES CORP (US) | 2024-07-04 | — | — | US | disclosed |
| EP-4394080-A2 | CONDENSATE PRECURSORS AND CONTAMINANT PURGE APPARATUS AND METHODS | FEI Company (US) | 2024-07-03 | — | — | EP | disclosed |
| US-20240194479-A1 | METHODS AND APPLICATIONS OF NOVEL AMORPHOUS HIGH-K METAL-OXIDE DIELECTRICS BY SUPER-CYCLE ATOMIC LAYER DEPOSITION | APPLIED MATERIALS, INC. (US) | 2024-06-13 | — | — | US | disclosed |
| US-20240166774-A1 | METHOD FOR PREPARING SUPPORTED OLEFIN POLYMERIZATION CATALYST, RESULTING CATALYST AND APPLICATION THEREOF | ZHEJIANG UNIVERSITY (CN) | 2024-05-23 | — | — | US | disclosed |
| US-20240153762-A1 | WAFER FOR THE CVD GROWTH OF UNIFORM GRAPHENE AND METHOD OF MANUFACTURE THEREOF | Paragraf Limited (GB) | 2024-05-09 | — | — | US | disclosed |
| US-11976016-B2 | Coatings on particles of high energy materials and methods of forming same | Forge Nano Inc. (US) | 2024-05-07 | — | — | US | disclosed |
| US-11954809-B2 | Optical elements based on polymeric structures incorporating inorganic materials | MAGIC LEAP, INC. (US) | 2024-04-09 | — | — | US | disclosed |
| US-11920239-B2 | Minimizing radical recombination using ALD silicon oxide surface coating with intermittent restoration plasma | LAM RESEARCH CORPORATION (US) | 2024-03-05 | — | — | US | disclosed |
| EP-4314377-A1 | A WAFER FOR THE CVD GROWTH OF UNIFORM GRAPHENE AND METHOD OF MANUFACTURE THEREOF | Paragraf Limited (GB) | 2024-02-07 | — | — | EP | disclosed |
| US-20230420256-A1 | METHOD OF FORMING A PHOTORESIST UNDERLAYER AND STRUCTURE INCLUDING SAME | ASM IP HOLDING B.V. (NL) | 2023-12-28 | — | — | US | disclosed |
| US-20230399752-A1 | Commercially Viable Biosensor Manufacture | VOC HEALTH, INC. | 2023-12-14 | — | — | US | disclosed |
| WO-2023237561-A1 | A THERMALLY STABLE GRAPHENE-CONTAINING LAMINATE | Paragraf Limited (GB) | 2023-12-14 | — | — | WO | disclosed |
| US-20230373000-A1 | Manufacturing of Workpieces Having Nanostructured Phases from Functionalized Powder Feedstocks | Forge Nano, Inc. | 2023-11-23 | — | — | US | disclosed |
| US-20230363173-A1 | METHOD OF FORMING FERROELECTRIC MEMORY DEVICE | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2023-11-09 | — | — | US | disclosed |
| EP-4273177-A1 | METHOD FOR PREPARING SUPPORTED OLEFIN POLYMERIZATION CATALYST, RESULTING CATALYST AND APPLICATION THEREOF | Zhejiang University (CN) | 2023-11-08 | — | — | EP | disclosed |
| WO-2023202944-A1 | A GRAPHENE-CONTAINING LAMINATE | Paragraf Limited (GB) | 2023-10-26 | — | — | WO | disclosed |
| WO-2023205284-A1 | LATERAL GAP FILL | LAM RESEARCH CORPORATION (US) | 2023-10-26 | — | — | WO | disclosed |
| WO-2023200072-A1 | SELECTION DEVICE, MANUFACTURING METHOD THEREFOR, AND NON-VOLATILE MEMORY DEVICE COMPRISING SELECTION DEVICE | 서울과학기술대학교 산학협력단 | 2023-10-19 | — | — | WO | disclosed |
| US-20230269947-A1 | FERROELECTRIC MEMORY DEVICE, MANUFACTURING METHOD OF THE FERROELECTRIC MEMORY DEVICE AND SEMICONDUCTOR CHIP | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2023-08-24 | — | — | US | disclosed |
| US-11735422-B2 | Method of forming a photoresist underlayer and structure including same | ASM IP HOLDING B.V. (NL) | 2023-08-22 | — | — | US | disclosed |
| US-11706928-B2 | Memory device and method for fabricating the same | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2023-07-18 | — | — | US | disclosed |
| WO-2023114870-A1 | HIGH PRESSURE PLASMA INHIBITION | LAM RESEARCH CORPORATION (US) | 2023-06-22 | — | — | WO | disclosed |
| US-11655262-B2 | Process for the generation of metal-containing films | BASF SE (DE) | 2023-05-23 | — | — | US | disclosed |
| US-11653501-B2 | Ferroelectric memory device, manufacturing method of the ferroelectric memory device and semiconductor chip | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2023-05-16 | — | — | US | disclosed |
| WO-2023067309-A1 | A METHOD OF PRODUCING AN ELECTRONIC DEVICE PRECURSOR | Paragraf Limited (GB) | 2023-04-27 | — | — | WO | disclosed |
| US-20230128614-A1 | MAGNETORESISTIVE SENSOR | Paragraf Limited (GB) | 2023-04-27 | — | — | US | disclosed |
| CN-111732682-B | Preparation method of cross-linked polyolefin for packaging high-light-transmittance solar cell | 浙江大学 | 2022-12-23 | — | — | CN | disclosed |
| US-11505562-B2 | Process for the generation of metal-containing films | BASF SE (DE) | 2022-11-22 | — | — | US | disclosed |
| WO-2022225525-A1 | METHODS AND APPLICATIONS OF NOVEL AMORPHOUS HIGH-K METAL-OXIDE DIELECTRICS BY SUPER-CYCLE ATOMIC LAYER DEPOSITION | APPLIED MATERIALS, INC. (US) | 2022-10-27 | — | — | WO | disclosed |
| US-20220333242-A1 | Flow Control System for a Deposition Reactor | Forge Nano Inc. | 2022-10-20 | — | — | US | disclosed |
| WO-2022200083-A1 | A WAFER FOR THE CVD GROWTH OF UNIFORM GRAPHENE AND METHOD OF MANUFACTURE THEREOF | Paragraf Limited (GB) | 2022-09-29 | — | — | WO | disclosed |
| US-20220285396-A1 | FERROELECTRIC MEMORY DEVICE, MANUFACTURING METHOD OF THE FERROELECTRIC MEMORY DEVICE AND SEMICONDUCTOR CHIP | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2022-09-08 | — | — | US | disclosed |
| US-20220262082-A1 | OPTICAL ELEMENTS BASED ON POLYMERIC STRUCTURES INCORPORATING INORGANIC MATERIALS | CITIBANK, N.A., AS COLLATERAL AGENT | 2022-08-18 | — | — | US | disclosed |
| US-20220231036-A1 | MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2022-07-21 | — | — | US | disclosed |
| US-20220220131-A1 | PROCESS FOR THE GENERATION OF METAL-CONTAINING FILMS | BASF SE (DE) | 2022-07-14 | — | — | US | disclosed |
| US-20220216059-A1 | METHOD OF TREATING A SUBSTRATE | ASM IP HOLDING B.V. (NL) | 2022-07-07 | — | — | US | disclosed |
| US-20220145459-A1 | MINIMIZING RADICAL RECOMBINATION USING ALD SILICON OXIDE SURFACE COATING WITH INTERMITTENT RESTORATION PLASMA | LAM RES CORP (US) | 2022-05-12 | — | — | US | disclosed |
| US-11328492-B2 | Optical elements based on polymeric structures incorporating inorganic materials | MAGIC LEAP, INC. (US) | 2022-05-10 | — | — | US | disclosed |
| US-20220139935-A1 | MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2022-05-05 | — | — | US | disclosed |
| US-11319332-B2 | Process for the generation of metal-containing films | BASF SE (DE) | 2022-05-03 | — | — | US | disclosed |
| US-20220084817-A1 | SILICON OXIDE DEPOSITION METHOD | ASM IP HOLDING B.V. (NL) | 2022-03-17 | — | — | US | disclosed |
| EP-3957769-A1 | PROCESS FOR THE GENERATION OF METAL-CONTAINING FILMS | BASF SE (DE) | 2022-02-23 | — | — | EP | disclosed |
| US-20210381107-A1 | MATERIAL DEPOSITION SYSTEMS, AND RELATED METHODS AND MICROELECTRONIC DEVICES | MICRON TECHNOLOGY, INC. | 2021-12-09 | — | — | US | disclosed |
| EP-3728688-B1 | PROCESS FOR THE GENERATION OF METAL-CONTAINING FILMS | BASF SE (DE) | 2021-11-10 | — | — | EP | disclosed |
| US-20210295601-A1 | OPTICAL ELEMENTS BASED ON POLYMERIC STRUCTURES INCORPORATING INORGANIC MATERIALS | CITIBANK, N.A., AS COLLATERAL AGENT | 2021-09-23 | — | — | US | disclosed |
| US-11069780-B2 | Coating liquid for forming oxide, method for producing oxide film, and method for producing field-effect transistor | RICOH COMPANY, LTD. (JP) | 2021-07-20 | — | — | US | disclosed |
| US-20210171416-A1 | COATINGS ON PARTICLES OF HIGH ENERGY MATERIALS AND METHODS OF FORMING SAME | Forge Nano, Inc. | 2021-06-10 | — | — | US | disclosed |
| US-20210123143-A1 | HAFNIUM ALUMINUM OXIDE COATINGS DEPOSITED BY ATOMIC LAYER DEPOSITION | APPLIED MATERIALS, INC. | 2021-04-29 | — | — | US | disclosed |
| WO-2021081219-A1 | HAFNIUM ALUMINUM OXIDE COATINGS DEPOSITED BY ATOMIC LAYER DEPOSITION | APPLIED MATERIALS, INC. (US) | 2021-04-29 | — | — | WO | disclosed |
| US-20210111025-A1 | METHOD OF FORMING A PHOTORESIST UNDERLAYER AND STRUCTURE INCLUDING SAME | ASM IP HOLDING B.V. (NL) | 2021-04-15 | — | — | US | disclosed |
| US-20210079520-A1 | PROCESS FOR THE GENERATION OF METAL-CONTAINING FILMS | WAYNE STATE UNIVERSITY (US) | 2021-03-18 | — | — | US | disclosed |
| US-20210079025-A1 | PROCESS FOR THE GENERATION OF METAL-CONTAINING FILMS | WAYNE STATE UNIVERSITY | 2021-03-18 | — | — | US | disclosed |
| US-10916060-B2 | Optical elements based on polymeric structures incorporating inorganic materials | MAGIC LEAP, INC. (US) | 2021-02-09 | — | — | US | disclosed |
| EP-3735601-A1 | OPTICAL ELEMENTS BASED ON POLYMERIC STRUCTURES INCORPORATING INORGANIC MATERIALS | Magic Leap, Inc. (US) | 2020-11-11 | — | — | EP | disclosed |
| US-10818705-B2 | Method for manufacturing a field effect transistor, method for manufacturing a volatile semiconductor memory element, method for manufacturing a non-volatile semiconductor memory element, method for manufacturing a display element, method for manufacturing an image display device, and method for manufacturing a system | RICOH COMPANY, LTD. (JP) | 2020-10-27 | — | — | US | disclosed |
| US-10818770-B2 | Metal oxide, field-effect transistor, and method for producing the same | RICOH COMPANY, LTD. (JP) | 2020-10-27 | — | — | US | disclosed |
| EP-3713695-A1 | MANUFACTURING OF WORKPIECES HAVING NANOSTRUCTURED PHASES FROM FUNCTIONALIZED POWDER FEEDSTOCKS | Forge Nano, Inc. (US) | 2020-09-30 | — | — | EP | disclosed |
| US-20200276638-A1 | MANUFACTURING OF WORKPIECES HAVING NANOSTRUCTURED PHASES FROM FUNCTIONALIZED POWDER FEEDSTOCKS | Forge Nano, Inc. | 2020-09-03 | — | — | US | disclosed |
| US-20200208266-A1 | MANUFACTURING PROCESSES TO SYNTHESIZE, FUNCTIONALIZE, SURFACE TREAT AND/OR ENCAPSULATE POWDERS, AND APPLICATIONS THEREOF | Forge Nano Inc. | 2020-07-02 | — | — | US | disclosed |
| EP-3673096-A1 | MANUFACTURING PROCESSES TO SYNTHESIZE, FUNCTIONALIZE, SURFACE TREAT AND/OR ENCAPSULATE POWDERS, AND APPLICATIONS THEREOF | Forge Nano, Inc. (US) | 2020-07-01 | — | — | EP | disclosed |
| US-10565954-B2 | Field-effect transistor, display element, image display device, and system | RICOH COMPANY, LTD. (JP) | 2020-02-18 | — | — | US | disclosed |
| EP-3063783-B1 | FIELD-EFFECT TRANSISTOR, DISPLAY ELEMENT, IMAGE DISPLAY DEVICE, AND SYSTEM | RICOH CO LTD (JP) | 2020-02-12 | — | — | EP | disclosed |
| US-10431458-B2 | Mask shrink layer for high aspect ratio dielectric etch | LAM RESEARCH CORPORATION (US) | 2019-10-01 | — | — | US | disclosed |
| EP-3544047-A2 | COATING LIQUID FOR FORMING OXIDE, METHOD FOR PRODUCING OXIDE FILM, AND METHOD FOR PRODUCING FIELD-EFFECT TRANSISTOR | Ricoh Company, Ltd. (JP) | 2019-09-25 | — | — | EP | disclosed |
| US-20190288076-A1 | COATING LIQUID FOR FORMING OXIDE, METHOD FOR PRODUCING OXIDE FILM, AND METHOD FOR PRODUCING FIELD-EFFECT TRANSISTOR | RICOH COMPANY, LTD. (JP) | 2019-09-19 | — | — | US | disclosed |
| US-10403234-B2 | Field-effect transistor, display element, image display device, and system | RICOH COMPANY, LTD. (JP) | 2019-09-03 | — | — | US | disclosed |
| US-20190206136-A1 | OPTICAL ELEMENTS BASED ON POLYMERIC STRUCTURES INCORPORATING INORGANIC MATERIALS | CITIBANK, N.A. | 2019-07-04 | — | — | US | disclosed |
| WO-2019104186-A1 | MANUFACTURING OF WORKPIECES HAVING NANOSTRUCTURED PHASES FROM FUNCTIONALIZED POWDER FEEDSTOCKS | Forge Nano, Inc. (US) | 2019-05-31 | — | — | WO | disclosed |
| US-10170324-B2 | Technique to tune sidewall passivation deposition conformality for high aspect ratio cylinder etch | LAM RESEARCH CORPORATION (US) | 2019-01-01 | — | — | US | disclosed |
| US-10170323-B2 | Technique to deposit metal-containing sidewall passivation for high aspect ratio cylinder etch | LAM RESEARCH CORPORATION (US) | 2019-01-01 | — | — | US | disclosed |
| US-20180277060-A1 | FIELD-EFFECT TRANSISTOR, DISPLAY ELEMENT, IMAGE DISPLAY DEVICE, AND SYSTEM | RICOH COMPANY, LTD. (JP) | 2018-09-27 | — | — | US | disclosed |
| US-20180226046-A1 | FIELD-EFFECT TRANSISTOR, DISPLAY ELEMENT, IMAGE DISPLAY DEVICE, AND SYSTEM | RICOH COMPANY, LTD. (JP) | 2018-08-09 | — | — | US | disclosed |
| US-10008181-B2 | Field-effect transistor, display element, image display device, and system | RICOH COMPANY, LTD. (JP) | 2018-06-26 | — | — | US | disclosed |
| US-9972274-B2 | Field-effect transistor, display element, image display device, and system | RICOH COMPANY, LTD. (JP) | 2018-05-15 | — | — | US | disclosed |
| US-20180087164-A1 | TUNING ELECTRODE SURFACE ELECTRONICS WITH THIN LAYERS | CALIFORNIA INST OF TECHN (US) | 2018-03-29 | — | — | US | disclosed |
| US-20180044791-A1 | MINIMIZING RADICAL RECOMBINATION USING ALD SILICON OXIDE SURFACE COATING WITH INTERMITTENT RESTORATION PLASMA | LAM RES CORP (US) | 2018-02-15 | — | — | US | disclosed |
| US-9892917-B2 | Plasma assisted atomic layer deposition of multi-layer films for patterning applications | LAM RESEARCH CORPORATION (US) | 2018-02-13 | — | — | US | disclosed |
| US-9865459-B2 | Plasma treatment to improve adhesion between hardmask film and silicon oxide film | APPLIED MATERIALS, INC. (US) | 2018-01-09 | — | — | US | disclosed |
| US-9828672-B2 | Minimizing radical recombination using ALD silicon oxide surface coating with intermittent restoration plasma | LAM RESEARCH CORPORATION (US) | 2017-11-28 | — | — | US | disclosed |
| US-20170271381-A1 | METHOD FOR MANUFACTURING A FIELD EFFECT TRANSISTOR, METHOD FOR MANUFACTURING A VOLATILE SEMICONDUCTOR MEMORY ELEMENT, METHOD FOR MANUFACTURING A NON-VOLATILE SEMICONDUCTOR MEMORY ELEMENT, METHOD FOR MANUFACTURING A DISPLAY ELEMENT, METHOD FOR MANUFACTURING AN IMAGE DISPLAY DEVICE, AND METHOD FOR MANUFACTURING A SYSTEM | RICOH COMPANY, LTD. (JP) | 2017-09-21 | — | — | US | disclosed |
| US-20170263210-A1 | FIELD-EFFECT TRANSISTOR, DISPLAY ELEMENT, IMAGE DISPLAY DEVICE, AND SYSTEM | RICOH COMPANY, LTD. (JP) | 2017-09-14 | — | — | US | disclosed |
| US-9691872-B2 | III-V semiconductor device with interfacial layer | IMEC VZW (BE) | 2017-06-27 | — | — | US | disclosed |
| US-20170178920-A1 | TECHNIQUE TO TUNE SIDEWALL PASSIVATION DEPOSITION CONFORMALITY FOR HIGH ASPECT RATIO CYLINDER ETCH | LAM RESEARCH CORPORATION | 2017-06-22 | — | — | US | disclosed |
| US-20170170026-A1 | TECHNIQUE TO DEPOSIT METAL-CONTAINING SIDEWALL PASSIVATION FOR HIGH ASPECT RATIO CYLINDER ETCH | LAM RES CORP (US) | 2017-06-15 | — | — | US | disclosed |
| US-9624577-B2 | Deposition of metal doped amorphous carbon film | APPLIED MATERIALS, INC. (US) | 2017-04-18 | — | — | US | disclosed |
| US-9620377-B2 | Technique to deposit metal-containing sidewall passivation for high aspect ratio cylinder etch | Lab Research Corporation (US) | 2017-04-11 | — | — | US | disclosed |
| US-20170076945-A1 | MASK SHRINK LAYER FOR HIGH ASPECT RATIO DIELECTRIC ETCH | LAM RES CORP (US) | 2017-03-16 | — | — | US | disclosed |
| US-20170018650-A1 | FIELD-EFFECT TRANSISTOR, DISPLAY ELEMENT, IMAGE DISPLAY DEVICE, AND SYSTEM | RICOH COMPANY, LTD. (JP) | 2017-01-19 | — | — | US | disclosed |
| EP-3118900-A1 | FIELD-EFFECT TRANSISTOR, DISPLAY ELEMENT, IMAGE DISPLAY DEVICE, AND SYSTEM | Ricoh Company, Ltd. (JP) | 2017-01-18 | — | — | EP | disclosed |
| US-9543148-B1 | Mask shrink layer for high aspect ratio dielectric etch | LAM RESEARCH CORPORATION (US) | 2017-01-10 | — | — | US | disclosed |
| US-20160336178-A1 | PLASMA ASSISTED ATOMIC LAYER DEPOSITION OF MULTI-LAYER FILMS FOR PATTERNING APPLICATIONS | LAM RESEARCH CORPORATION | 2016-11-17 | — | — | US | disclosed |
| US-20160314960-A1 | PLASMA TREATMENT TO IMPROVE ADHESION BETWEEN HARDMASK FILM AND SILICON OXIDE FILM | APPLIED MATERIALS, INC. | 2016-10-27 | — | — | US | disclosed |
| US-20160281230-A1 | MINIMIZING RADICAL RECOMBINATION USING ALD SILICON OXIDE SURFACE COATING WITH INTERMITTENT RESTORATION PLASMA | LAM RESEARCH CORPORATION | 2016-09-29 | — | — | US | disclosed |
| US-20160267873-A1 | FIELD-EFFECT TRANSISTOR, DISPLAY ELEMENT, IMAGE DISPLAY DEVICE, AND SYSTEM | RICOH COMPANY, LTD. (JP) | 2016-09-15 | — | — | US | disclosed |
| EP-3063783-A1 | FIELD-EFFECT TRANSISTOR, DISPLAY ELEMENT, IMAGE DISPLAY DEVICE, AND SYSTEM | Ricoh Company, Ltd. (JP) | 2016-09-07 | — | — | EP | disclosed |
| US-9425394-B2 | Doped oxide dielectrics for resistive random access memory cells | INTERMOLECULAR, INC. (US) | 2016-08-23 | — | — | US | disclosed |
| US-20160163558-A1 | TECHNIQUE TO DEPOSIT METAL-CONTAINING SIDEWALL PASSIVATION FOR HIGH ASPECT RATIO CYLINDER ETCH | LAM RESEARCH CORPORATION | 2016-06-09 | — | — | US | disclosed |
| EP-2830096-B1 | III-V semiconductor device with interfacial layer | IMEC VZW (BE) | 2016-04-13 | — | — | EP | disclosed |
| US-9276203-B2 | Resistive switching layers including Hf-Al-O | INTERMOLECULAR, INC. (US) | 2016-03-01 | — | — | US | disclosed |
| US-20160027614-A1 | DEPOSITION OF METAL DOPED AMORPHOUS CARBON FILM | APPLIED MATERIALS, INC. | 2016-01-28 | — | — | US | disclosed |
| US-9246094-B2 | Stacked bi-layer as the low power switchable RRAM | INTERMOLECULAR, INC. (US) | 2016-01-26 | — | — | US | disclosed |
| US-20150380309-A1 | Metal-insulator-semiconductor (MIS) contact with controlled defect density | GLOBALFOUNDRIES U.S. INC. | 2015-12-31 | — | — | US | disclosed |
| US-9178152-B2 | Metal organic chemical vapor deposition of embedded resistors for ReRAM cells | INTERMOLECULAR, INC. (US) | 2015-11-03 | — | — | US | disclosed |
| US-9142764-B1 | Methods of forming embedded resistors for resistive random access memory cells | INTERMOLECULAR, INC. (US) | 2015-09-22 | — | — | US | disclosed |
| US-9082828-B2 | Al bond pad clean method | APPLIED MATERIALS, INC. (US) | 2015-07-14 | — | — | US | disclosed |
| US-20150188045-A1 | Stacked Bi-layer as the low power switchable RRAM | INTERMOLECULAR INC. (US) | 2015-07-02 | — | — | US | disclosed |
| US-20150187841-A1 | Method of forming current-programmable inline resistor | INTERMOLECULAR INC. (US) | 2015-07-02 | — | — | US | disclosed |
| US-20150179937-A1 | Metal Organic Chemical Vapor Deposition of Embedded Resistors for ReRAM Cells | INTERMOLECULAR INC. (US) | 2015-06-25 | — | — | US | disclosed |
| US-9065040-B2 | Controlling composition of multiple oxides in resistive switching layers using atomic layer deposition | INTERMOLECULAR, INC. (US) | 2015-06-23 | — | — | US | disclosed |
| US-20150137333-A1 | METHODS OF SELECTIVELY FORMING A MATERIAL USING A PARYLENE COATING AND RELATED SEMICONDUCTOR STRUCTURES | MICRON TECHNOLOGY, INC. | 2015-05-21 | — | — | US | disclosed |
| US-9029192-B1 | Metal organic chemical vapor deposition of resistive switching layers for ReRAM cells | INTERMOLECULAR, INC. (US) | 2015-05-12 | — | — | US | disclosed |
| US-9006696-B2 | Metal aluminum nitride embedded resistors for resistive random memory access cells | INTERMOLECULAR, INC. (US) | 2015-04-14 | — | — | US | disclosed |
| US-20150093876-A1 | Doped Oxide Dielectrics for Resistive Random Access Memory Cells | KABUSHIKI KAISHA TOSHIBA (JP) | 2015-04-02 | — | — | US | disclosed |
| US-8980766-B2 | Sequential atomic layer deposition of electrodes and resistive switching components | INTERMOLECULAR, INC. (US) | 2015-03-17 | — | — | US | disclosed |
| US-20150060753-A1 | CONTROLLING COMPOSITION OF MULTIPLE OXIDES IN RESISTIVE SWITCHING LAYERS USING ATOMIC LAYER DEPOSITION | INTERMOLECULAR INC (US) | 2015-03-05 | — | — | US | disclosed |
| US-20150064361-A1 | UV treatment for ALD film densification | INTERMOLECULAR INC. (US) | 2015-03-05 | — | — | US | disclosed |
| US-8945305-B2 | Methods of selectively forming a material using parylene coating | MICRON TECHNOLOGY, INC. (US) | 2015-02-03 | — | — | US | disclosed |
| US-20150028428-A1 | III-V Semiconductor Device with Interfacial Layer | Katholieke Universiteit Leuven, KU LEUVEN R&D (BE) | 2015-01-29 | — | — | US | disclosed |
| EP-2830096-A1 | III-V semiconductor device with interfacial layer | IMEC vzw (BE) | 2015-01-28 | — | — | EP | disclosed |
| US-20140377931-A1 | Metal Aluminum Nitride Embedded Resistors for Resistive Random Memory Access Cells | SANDISK TECHNOLOGIES LLC | 2014-12-25 | — | — | US | disclosed |
| US-8883557-B1 | Controlling composition of multiple oxides in resistive switching layers using atomic layer deposition | INTERMOLECULAR, INC. (US) | 2014-11-11 | — | — | US | disclosed |
| US-20140319443-A1 | Sequential Atomic Layer Deposition of Electrodes and Resistive Switching Components | SANDISK TECHNOLOGIES LLC | 2014-10-30 | — | — | US | disclosed |
| US-8852996-B2 | Carbon doped resistive switching layers | INTERMOLECULAR, INC. (US) | 2014-10-07 | — | — | US | disclosed |
| US-8853661-B1 | Metal aluminum nitride embedded resistors for resistive random memory access cells | INTERMOLECULAR, INC. (US) | 2014-10-07 | — | — | US | disclosed |
| WO-2014150985-A1 | METAL ALUMINUM NITRIDE EMBEDDED RESISTORS FOR RESISTIVE RANDOM MEMORY ACCESS CELLS | KABUSHIKI KAISHA TOSHIBA (JP) | 2014-09-25 | — | — | WO | disclosed |
| US-8841153-B2 | Method for producing a doped organic semiconducting layer | OSRAM OPTO SEMICONDUCTORS GMBH (DE) | 2014-09-23 | — | — | US | disclosed |
| US-20140264223-A1 | Metal Aluminum Nitride Embedded Resistors for Resistive Random Memory Access Cells | INTERMOLECULAR INC. (US) | 2014-09-18 | — | — | US | disclosed |
| US-20140264224-A1 | Performance Enhancement of Forming-Free ReRAM Devices Using 3D Nanoparticles | INTERMOLECULAR, INC. (US) | 2014-09-18 | — | — | US | disclosed |
| US-8809205-B2 | Sequential atomic layer deposition of electrodes and resistive switching components | INTERMOLECULAR, INC. (US) | 2014-08-19 | — | — | US | disclosed |
| US-20140187052-A1 | Selective Etching of Hafnium Oxide Using Diluted Hydrofluoric Acid | INTERMOLECULAR INC. (US) | 2014-07-03 | — | — | US | disclosed |
| US-20140175361-A1 | Resistive Switching Layers Including Hf-Al-O | INTERMOLECULAR INC. (US) | 2014-06-26 | — | — | US | disclosed |
| US-20140175367-A1 | Materials for Thin Resisive Switching Layers of Re-RAM Cells | INTERMOLECULAR INC. (US) | 2014-06-26 | — | — | US | disclosed |
| US-20140175354-A1 | SEQUENTIAL ATOMIC LAYER DEPOSITION OF ELECTRODES AND RESISTIVE SWITCHING COMPONENTS | INTERMOLECULAR INC. (US) | 2014-06-26 | — | — | US | disclosed |
| US-20140175355-A1 | Carbon Doped Resistive Switching Layers | INTERMOLECULAR INC. (US) | 2014-06-26 | — | — | US | disclosed |
| US-20140127887-A1 | Chemical Vapor Deposition System | INTERMOLECULAR, INC. (US) | 2014-05-08 | — | — | US | disclosed |
| US-20140124788-A1 | Chemical Vapor Deposition System | INTERMOLECULAR, INC. (US) | 2014-05-08 | — | — | US | disclosed |
| US-20140113445-A1 | AL BOND PAD CLEAN METHOD | APPLIED MATERIALS, INC. (US) | 2014-04-24 | — | — | US | disclosed |
| US-20140014965-A1 | Chemical vapor deposition system with in situ, spatially separated plasma | INTERMOLECUAL, INC. | 2014-01-16 | — | — | US | disclosed |
| EP-2643494-A1 | METHOD OF FORMING CONFORMAL BARRIER LAYERS FOR PROTECTION OF THERMOELECTRIC MATERIALS | Corning Incorporated (US) | 2013-10-02 | — | — | EP | disclosed |
| EP-1426389-B1 | Ethylene-alpha-olefin polymers, processes and uses | PENNZOIL QUAKER STATE CO (US) | 2013-03-27 | — | — | EP | disclosed |
| WO-2012071173-A1 | METHOD OF FORMING CONFORMAL BARRIER LAYERS FOR PROTECTION OF THERMOELECTRIC MATERIALS | CORNING INCORPORATED (US) | 2012-05-31 | — | — | WO | disclosed |
| US-20120128867-A1 | METHOD OF FORMING CONFORMAL BARRIER LAYERS FOR PROTECTION OF THERMOELECTRIC MATERIALS | CORNING INCORPORATED | 2012-05-24 | — | — | US | disclosed |
| US-20120052681-A1 | METHODS OF SELECTIVELY FORMING A MATERIAL | MICRON TECHNOLOGY, INC. (US) | 2012-03-01 | — | — | US | disclosed |
| US-20110124141-A1 | Method for Producing a Doped Organic Semiconducting Layer | OSRAM OPTO SEMICONDUCTORS GMBH (DE) | 2011-05-26 | — | — | US | disclosed |
| US-7867920-B2 | Method for modifying high-k dielectric thin film and semiconductor device | TOKYO ELECTRON LIMITED (JP) | 2011-01-11 | — | — | US | disclosed |
| EP-2248201-A1 | METHOD FOR PRODUCING A DOPED ORGANIC SEMICONDUCTING LAYER | OSRAM Opto Semiconductors GmbH (DE) | 2010-11-10 | — | — | EP | disclosed |
| US-7645710-B2 | Method and apparatus for fabricating a high dielectric constant transistor gate using a low energy plasma system | APPLIED MATERIALS, INC. (US) | 2010-01-12 | — | — | US | disclosed |
| US-20090302433-A1 | METHOD FOR MODIFYING HIGH-K DIELECTRIC THIN FILM AND SEMICONDUCTOR DEVICE | TOKYO ELECTRON LIMITED (JP) | 2009-12-10 | — | — | US | disclosed |
| EP-1426388-B1 | Ethylene-alpha-olefin polymers, processes and uses | PENNZOIL QUAKER STATE CO (US) | 2009-11-11 | — | — | EP | disclosed |
| WO-2009106068-A1 | METHOD FOR PRODUCING A DOPED ORGANIC SEMICONDUCTING LAYER | OSRAM OPTO SEMICONDUCTORS GMBH (DE) | 2009-09-03 | — | — | WO | disclosed |
| EP-0818472-B2 | Cyclic olefin copolymers, compositions and molded articles comprising the copolymers | IDEMITSU KOSAN CO (JP) | 2009-07-29 | — | — | EP | disclosed |
| WO-2007121007-A2 | METHOD AND APPARATUS FOR FABRICATING A HIGH DIELECTRIC CONSTANT TRANSISTOR GATE USING A LOW ENERGY PLASMA SYSTEM | APPLIED MATERIALS, INC. (US) | 2007-10-25 | — | — | WO | disclosed |
| US-20070212896-A1 | METHOD AND APPARATUS FOR FABRICATING A HIGH DIELECTRIC CONSTANT TRANSISTOR GATE USING A LOW ENERGY PLASMA SYSTEM | APPLIED MATERIALS, INC. | 2007-09-13 | — | — | US | disclosed |
| EP-1337565-B1 | BIMETALLIC CATALYST FOR PRODUCING POLYETHYLENE RESINS WITH BIMODAL MOLECULAR WEIGHT DISTRIBUTION, ITS PREPARATION AND USE | UNIVATION TECH LLC (US) | 2007-05-09 | — | — | EP | disclosed |
| US-7129302-B2 | Bimetallic catalyst for producing polyethylene resins with bimodal molecular weight distribution, its preparation and use | UNIVATION TECHNOLOGIES, LLC (US) | 2006-10-31 | — | — | US | disclosed |
| US-7129197-B2 | Synthesis of poly-alpha olefin and use thereof | SHELL OIL COMPANY (US) | 2006-10-31 | — | — | US | disclosed |
| US-20050267271-A1 | Bimetallic catalyst for producing polyethylene resins with bimodal molecular weight distribution, its preparation and use | MINK ROBERT I | 2005-12-01 | — | — | US | disclosed |
| US-6964937-B2 | Bimetallic catalyst for producing polyethylene resins with bimodal molecular weight distribution, its preparation and use | UNIVATION TECHNOLOGIES, LLC (US) | 2005-11-15 | — | — | US | disclosed |
| EP-0990005-B1 | ETHYLENE-ALPHA-OLEFIN POLYMERS, PROCESSES AND USES | PENNZOIL QUAKER STATE CO (US) | 2004-12-08 | — | — | EP | disclosed |
| WO-2004076502-A1 | SUPPORTED MULTINUCLEAR METALLOCENE CATALYST FOR OLEFIN POLYMERIZATION AND METHOD FOR PREPARING THE SAME | HONAM PETROCHEMICAL CORPORATION (KR) | 2004-09-10 | — | — | WO | disclosed |
| US-6787617-B1 | FORMING NARROW MOLECULAR WEIGHT HOMOPOLYMERS AS INTERMEDIATES TO BLOCK OR TERMINAL FUNCTIONALIZED POLYMERS; HAFNIUM OR ZIRCONIUM CYCLOPENTADIENYL FUNCTIONALIZED CATALYSTS WITH TRIPHENYLBORON AND TRIALKYLALUMINUM COMPOUNDS | JAPAN AS REPRESENTED BY DIRECTOR GENERAL OF THE AGENCY OF INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) | 2004-09-07 | — | — | US | disclosed |
| US-20040168627-A1 | Atomic layer deposition of oxide film | SHARP LABORATORIES OF AMERICA, INC. | 2004-09-02 | — | — | US | disclosed |
| EP-1442104-A1 | SYNTHESIS OF POLY-ALPHA OLEFIN AND USE THEREOF | SHELL INTERNATIONALE RESEARCHMAATSCHAPPIJ B.V. (NL) | 2004-08-04 | — | — | EP | disclosed |
| EP-1428842-A2 | Ethylene-alpha-olefin polymers, processes and uses | Pennzoil Quaker State Company (US) | 2004-06-16 | — | — | EP | disclosed |
| EP-1426389-A2 | Ethylene-alpha-olefin polymers, processes and uses | Pennzoil Quaker State Company (US) | 2004-06-09 | — | — | EP | disclosed |
| EP-1426388-A2 | Ethylene-alpha-olefin polymers, processes and uses | Pennzoil Quaker State Company (US) | 2004-06-09 | — | — | EP | disclosed |
| US-6730818-B2 | ETHYLENE-VINYLIDENE MONOMER POLYMER WITH MOLECULAR WEIGHT OF < 2000, MOLECULAR WEIGHT DISTRIBUTION OF < 2.5 AND SUBSTANTIALLY HEAD TO TAIL MOLECULAR STRUCTURE; LUBRICANTS | PENZOIL-QUAKER STATE COMPANY | 2004-05-04 | — | — | US | disclosed |
| US-20040048736-A1 | Bimetallic catalyst for producing polyethylene resins with bimodal molecular weight distribution, its preparation and use | UNIVATION TECHNOLOGIES, LLC | 2004-03-11 | — | — | US | disclosed |
| EP-0719797-B2 | Process for obtaining polyolefins with broad bimodal or multimodal molecular weight distributions | REPSOL QUIMICA SA (ES) | 2004-03-03 | — | — | EP | disclosed |
| EP-1337565-A1 | BIMETALLIC CATALYST FOR PRODUCING POLYETHYLENE RESINS WITH BIMODAL MOLECULAR WEIGHT DISTRIBUTION, ITS PREPARATION AND USE | ExxonMobil Chemical Patents Inc. (US) | 2003-08-27 | — | — | EP | disclosed |
| US-6605676-B1 | Process for obtaining polyolefins with broad bimodal or multimodal molecular weight distributions | REPSOL QUIMICA, S.A. (ES) | 2003-08-12 | — | — | US | disclosed |
| EP-0977786-B1 | PREMIUM PIPE RESINS | EXXONMOBIL OIL CORP (US) | 2003-06-11 | — | — | EP | disclosed |
| US-20030055184-A1 | Synthesis of poly-alpha olefin and use thereof | PENNZOIL-QUAKER STATE COMPANY | 2003-03-20 | — | — | US | disclosed |
| WO-2003020856-A1 | SYNTHESIS OF POLY-ALPHA OLEFIN AND USE THEREOF | SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ B.V. (NL) | 2003-03-13 | — | — | WO | disclosed |
| US-20020193647-A1 | Ethylene alpha-olefin polymers, process and uses | PENNZOIL-QUAKER STATE COMPANY | 2002-12-19 | — | — | US | disclosed |
| US-6417416-B1 | TERPOLYMERS FOR SYNTHETIC LUBRICANTS; CATALYTIC HYDROGENATION AND HYDROISOMERIZATIN IN PRESENCE OF GROUP IV COMPOUND AND ALUMINOXANE; THERMOCRACKING | PENNZOIL-QUAKER STATE COMPANY | 2002-07-09 | — | — | US | disclosed |
| US-6410665-B1 | POLYMERIZATION COORDINATION CATALYST FOR ALPHA-OLEFIN | BASELL POLYOLEFINE GMBH (DE) | 2002-06-25 | — | — | US | disclosed |
| US-6403181-B1 | CONDUITS MADE FROM POLYETHYLENE MIXTURES HAVING BIMODAL MOLECULAR WEIGHT DISTRIBUTION, HIGH MOLECULAR WEIGHT AND HIGH VISCOSITY; IMPACT/TENSILE STRENGTH; VIABILITY | MOBIL OIL CORPORATION | 2002-06-11 | — | — | US | disclosed |
| WO-2002044222-A1 | BIMETALLIC CATALYST FOR PRODUCING POLYETHYLENE RESINS WITH BIMODAL MOLECULAR WEIGHT DISTRIBUTION, ITS PREPARATION AND USE | EXXONMOBIL CHEMICAL PATENTS INC. (US) | 2002-06-06 | — | — | WO | disclosed |
| EP-1209171-A1 | PROCESS FOR PRODUCING OLEFIN LIVING POLYMER | JAPAN as Represented by DIRECTOR GENERAL OF AGENCY OF INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) | 2002-05-29 | — | — | EP | disclosed |
| US-6388148-B2 | OBTAINED BY CRACKING A PRECURSOR POLYMER AND OPTIONALLY HYDROGENATING OR HYDROISOMERIZING THE PRODUCT; USEFUL AS A LUBRICATING OIL | PENNZOIL-QUAKER STATE COMPANY | 2002-05-14 | — | — | US | disclosed |
| US-20010044562-A1 | Ethylene-alpha-olefin polymers, processes and uses | PENNZOIL-QUAKER STATE COMPANY | 2001-11-22 | — | — | US | disclosed |
| EP-0977786-A4 | PREMIUM PIPE RESINS | MOBIL OIL CORP (US) | 2001-10-24 | — | — | EP | disclosed |
| EP-0818472-B1 | Cyclic olefin copolymers, compositions and molded articles comprising the copolymers | IDEMITSU KOSAN CO (JP) | 2001-08-16 | — | — | EP | disclosed |
| US-6262324-B1 | CRACKING A COPOLYMER | PENNZOIL-QUAKER STATE COMPANY | 2001-07-17 | — | — | US | disclosed |
| EP-0504418-B2 | PROCESS FOR PRODUCING CYCLOOLEFIN POLYMER AND CYCLOOLEFIN COPOLYMERS | IDEMITSU KOSAN CO (JP) | 2001-06-13 | — | — | EP | disclosed |
| US-6124513-A | TERPOLYMERS USEFUL AS BASE OILS FOR LUBRICATING OILS AND CONSUMER PRODUCTS. | PENNZOIL-QUAKER STATE COMPANY (US) | 2000-09-26 | — | — | US | disclosed |
| EP-0719797-B1 | Process for obtaining polyolefins with broad bimodal or multimodal molecular weight distributions | REPSOL QUIMICA SA (ES) | 2000-04-12 | — | — | EP | disclosed |
| EP-0990005-A1 | ETHYLENE-ALPHA-OLEFIN POLYMERS, PROCESSES AND USES | Pennzoil Quaker State Company (US) | 2000-04-05 | — | — | EP | disclosed |
| EP-0977786-A1 | PREMIUM PIPE RESINS | MOBIL OIL CORPORATION (a New York corporation) (US) | 2000-02-09 | — | — | EP | disclosed |
| US-5916982-A | Process for the production of polyolefins | NIPPON OIL CO., LTD. (JP) | 1999-06-29 | — | — | US | disclosed |
| WO-1998058972-A1 | ETHYLENE-ALPHA-OLEFIN POLYMERS, PROCESSES AND USES | PENNZOIL-QUAKER STATE COMPANY (US) | 1998-12-30 | — | — | WO | disclosed |
| WO-1998049209-A1 | PREMIUM PIPE RESINS | MOBIL OIL CORPORATION (US) | 1998-11-05 | — | — | WO | disclosed |
| EP-0504418-B1 | PROCESS FOR PRODUCING CYCLOOLEFIN POLYMER AND CYCLOOLEFIN COPOLYMERS | IDEMITSU KOSAN CO (JP) | 1998-05-13 | — | — | EP | disclosed |
| EP-0818472-A2 | Cyclic olefin copolymers, compositions and molded articles comprising the copolymers | IDEMITSU KOSAN CO., LTD. (JP) | 1998-01-14 | — | — | EP | disclosed |
| US-5693728-A | Process for producing cyclic olefin based polymers | IDEMITSU KOSAN CO., LTD. (JP) | 1997-12-02 | — | — | US | disclosed |
| US-5648443-A | Cyclic olefin copolymers, compositions and molded articles comprising the copolymers | IDEMITSU KOSAN CO., LTD. (JP) | 1997-07-15 | — | — | US | disclosed |
| US-5629398-A | HOMO- OR COPOLYMERIZE WITH OLEFIN USING CATALYST CONTAINING TRANSITION METAL COMPOUND COMPLEXING WITH ANOTHER COMPOUND AND ORGANOALUMINUM COMPOUND; UNIQUE PHYSICAL PROPERTIES | IDEMITSU KOSAN CO., LTD. (JP) | 1997-05-13 | — | — | US | disclosed |
| EP-0768320-A1 | Catalyst component and catalyst | NIPPON OIL CO. LTD. (JP) | 1997-04-16 | — | — | EP | disclosed |
| EP-0768319-A1 | Process for the production of polyolefins | NIPPON OIL CO. LTD. (JP) | 1997-04-16 | — | — | EP | disclosed |
| EP-0200351-B2 | Liquid ethylene-type random copolymer, process for production thereof, and use thereof | MITSUI PETROCHEMICAL IND (JP) | 1996-10-16 | — | — | EP | disclosed |
| US-5556821-A | Catalyst component for the polymerization of olefins | NIPPON OIL COMPANY, LIMITED (JP) | 1996-09-17 | — | — | US | disclosed |
| EP-0720625-A1 | PROCESS FOR POLYOLEFIN PRODUCTION USING SHORT RESIDENCE TIME REACTORS | EXXON CHEMICAL PATENTS INC. (US) | 1996-07-10 | — | — | EP | disclosed |
| EP-0719797-A2 | Process for obtaining polyolefins with broad bimodal or multimodal molecular weight distributions | REPSOL QUIMICA S.A. (ES) | 1996-07-03 | — | — | EP | disclosed |
| US-5475067-A | Polymerizing in a semi-continuous pulsating manner; molecular weight control | EXXON CHEMICAL PATENTS INC. (US) | 1995-12-12 | — | — | US | disclosed |
| EP-0474391-B1 | Polyolefins | NIPPON OIL CO LTD (JP) | 1995-10-25 | — | — | EP | disclosed |
| WO-1995007937-A1 | PROCESS FOR POLYOLEFIN PRODUCTION USING SHORT RESIDENCE TIME REACTORS | EXXON CHEMICAL PATENTS INC. (US) | 1995-03-23 | — | — | WO | disclosed |
| EP-0339571-B1 | Process for preparation of ethylene polymers | SHOWA DENKO KK (JP) | 1994-02-23 | — | — | EP | disclosed |
| US-5191027-A | COMPOSITION COMPRISING AN EPOXY COMPOUND | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1993-03-02 | — | — | US | disclosed |
| EP-0504418-A1 | PROCESS FOR PRODUCING CYCLOOLEFIN POLYMER, CYCLOOLEFIN COPOLYMER, AND COMPOSITION AND MOLDING PREPARED THEREFROM | IDEMITSU KOSAN COMPANY LIMITED (JP) | 1992-09-23 | — | — | EP | disclosed |
| EP-0474391-A2 | Polyolefins | NIPPON OIL CO. LTD. (JP) | 1992-03-11 | — | — | EP | disclosed |
| EP-0142143-B1 | PROCESS FOR THE PRODUCTION OF POLYETHYLENE COMPOSITIONS | IDEMITSU KOSAN COMPANY LIMITED (JP) | 1991-03-13 | — | — | EP | disclosed |
| EP-0397195-A2 | A composition comprising an epoxy compound | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1990-11-14 | — | — | EP | disclosed |
| EP-0374619-A1 | Process for the production of polyethylene compositions | IDEMITSU KOSAN COMPANY LIMITED (JP) | 1990-06-27 | — | — | EP | disclosed |
| EP-0339571-A1 | Process for preparation of ethylene polymers | SHOWA DENKO KABUSHIKI KAISHA (JP) | 1989-11-02 | — | — | EP | disclosed |
| US-4704491-A | SYNTHETIC LUBRICANT OILS | MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) | 1987-11-03 | — | — | US | disclosed |
| EP-0200351-A2 | Liquid ethylene-type random copolymer, process for production thereof, and use thereof | MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) | 1986-11-05 | — | — | EP | disclosed |
| US-4564647-A | LOW PRESSURE, TRANSITION METAL COMPOUND, FILERS | IDEMITSU KOSAN COMPANY LIMITED (JP) | 1986-01-14 | — | — | US | disclosed |
| EP-0142143-A2 | Process for the production of polyethylene compositions | IDEMITSU KOSAN COMPANY LIMITED (JP) | 1985-05-22 | — | — | EP | disclosed |
| EP-0142143-A2 | Process for the production of polyethylene compositions | IDEMITSU KOSAN COMPANY LIMITED (JP) | 1985-05-22 | — | — | EP | disclosed |