Paraben

Paraben

SCHEMBL7261815

O=C(O)c1ccc(O)cc1.O=C(O)c1ccc2cc(O)ccc2c1

nearest known ligand 0.67

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA12 O43570 3/20 0.67
CA1 P00915 3/20 0.67
CA2 P00918 3/20 0.67
CA6 P23280 3/20 0.67
CA9 Q16790 3/20 0.67
CA4 P22748 2/20 0.67
CA7 P43166 2/20 0.67
CA14 Q9ULX7 2/20 0.67
CA3 P07451 1/20 0.67
TYR P14679 1/20 0.67
DRD1 P21728 1/20 0.67
CA5A P35218 1/20 0.67
CA5B Q9Y2D0 1/20 0.67
MEN1 O00255 1/20 0.61
NPC1 O15118 1/20 0.61
RAB9A P51151 1/20 0.61
KMT2A Q03164 1/20 0.61
SRD5A2 P31213 1/20 0.59
CLK1 P49759 1/20 0.56
DYRK1A Q13627 1/20 0.56

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Terephthalic Acid SCHEMBL6052891 0.98 MEN1 (0.63) CA12CA1CA2CA6CA9
Paraben SCHEMBL9579181 0.96 CA12 (0.73) CA12CA1CA2CA6CA9
Terephthalic Acid SCHEMBL27531137 0.96 CA12 (0.73) CA12CA1CA2CA6CA9
SCHEMBL9944055 0.96 MEN1 (0.66) CA12CA1CA2CA6CA9
SCHEMBL29357264 0.96 MEN1 (0.66) CA12CA1CA2CA6CA9
SCHEMBL44327 0.96 MEN1 (0.66) CA12CA1CA2CA6CA9
SCHEMBL14716619 0.94 CA12 (0.59) CA12CA1CA2CA6CA9
SCHEMBL830494 0.94 MEN1 (0.63) CA12CA1CA2CA6CA9
Hydrochloric Acid SCHEMBL3923537 0.94 MEN1 (0.63) CA12CA1CA2CA6CA9
Potassium SCHEMBL7180341 0.94 MEN1 (0.63) CA12CA1CA2CA6CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6656386-B2 To provide molded article having reflow- soldering heat resistance KABUSHIKI KAISHA UENO SEIYAKU OYO KENKUJO (JP) 2003-12-02 US claimed
CN-113683759-B High-modulus thermotropic liquid crystal polyarylate film and preparation method and application thereof 宁波聚嘉新材料科技有限公司 2023-03-24 CN disclosed
CN-110184678-B Preparation method of graphene and liquid crystal polyester synergetic enhanced polymer fiber 天津工业大学 2022-06-21 CN disclosed
CN-111534882-B Preparation method of functionalized multi-walled carbon nanotube reinforced polyester fiber 北京光华纺织集团有限公司 2022-05-20 CN disclosed
CN-113683759-A High-modulus thermotropic liquid crystal polyarylate film and preparation method and application thereof 宁波聚嘉新材料科技有限公司 2021-11-23 CN disclosed
US-10882992-B2 Thermoplastic resin composition and molded article thereof TORAY INDUSTRIES, INC. (JP) 2021-01-05 US disclosed
EP-3536746-B1 THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE THEREOF TORAY INDUSTRIES (JP) 2020-12-16 EP disclosed
US-10829879-B2 Conductive nonwoven fabric and method of producing meltblown nonwoven fabric used in conductive nonwoven fabric KURARAY CO., LTD. (JP) 2020-11-10 US disclosed
CN-111534882-A Preparation method of functionalized multi-walled carbon nanotube reinforced polyester fiber 北京光华纺织集团有限公司 2020-08-14 CN disclosed
US-20200048457-A1 THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE THEREOF TORAY INDUSTRIES, INC. (JP) 2020-02-13 US disclosed
WO-2017210057-A1 POLYMER AND OTHER COMPOUNDS FUNCTIONALIZED WITH TERMINAL 1,1-DISUBSTITUTED ALKENE MONOMER(S) AND METHODS THEREOF SIRRUS, INC. (US) 2017-12-07 WO disclosed
US-20170275793-A1 CONDUCTIVE NONWOVEN FABRIC AND METHOD OF PRODUCING MELTBLOWN NONWOVEN FABRIC USED IN CONDUCTIVE NONWOVEN FABRIC KURARAY CO., LTD. (JP) 2017-09-28 US disclosed
CN-105968516-A Geogrid and production method thereof 安徽杰奥玛克合成材料科技有限公司 2016-09-28 CN disclosed
CN-1293117-C Anisotropic melt-forming polymers having a high degree of stretchability TICONA LLC (US) 2007-01-03 CN disclosed
CN-1235454-C Copper foil with insulating layer, method for producing same, and printed wiring board using same MITSUI MINING & SMELTING CO (JP) 2006-01-04 CN disclosed
CN-1697591-A Method of manufacturing copper foil with insulating layer, copper foil with insulating layer obtained with the same method, and printed circuit board MITSUI MINING & SMELTING CO (JP) 2005-11-16 CN disclosed
CN-1556823-A Anisotropic melt-forming polymers having a high degree of stretchability 提克纳有限责任公司 2004-12-22 CN disclosed
CN-1489883-A Copper foil with insulating layer, method for producing same, and printed wiring board using same ���������kҵ��ʽ���� 2004-04-14 CN disclosed
US-4983713-A Heat resistance, melt processability POLYPLASTICS CO., LTD. (JP) 1991-01-08 US disclosed
US-4395536-A Preparation of aromatic copolyesters via in situ esterification with isopropenyl esters of an alkyl acid CELANESE CORPORATION (US) 1983-07-26 US disclosed