SCHEMBL727217

SCHEMBL727217

CC=C(F)C(F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL727216 1.00
SCHEMBL19629125 1.00
Bicarbonate SCHEMBL20423561 0.87
SCHEMBL28961465 0.83
SCHEMBL23658828 0.74
SCHEMBL14985844 0.69
SCHEMBL14194678 0.69
SCHEMBL18878223 0.69
SCHEMBL12695687 0.69
SCHEMBL269458 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 511 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114080318-B Injection overmolding with thermal/cold cycling for fabricating optical lenses using 3D printed functional wafers 依视路国际公司 2025-04-15 CN claimed
CN-114080312-B Method for manufacturing optical lens by using 3D printing functional wafer 依视路国际公司 2025-04-15 CN claimed
CN-117430870-A Polymer coated inorganic particles, low-dielectric heat-conducting nylon material containing same and preparation and application of low-dielectric heat-conducting nylon material 中国石油化工股份有限公司 2024-01-23 CN claimed
WO-2024007535-A1 FLUORINE-CONTAINING RESIN COPPER-CLAD LAMINATE AND MULTI-LAYER CIRCUIT BOARD 广东生益科技股份有限公司 2024-01-11 WO claimed
US-11815317-B2 Net shape moldable thermally conductive materials HAMILTON SUNDSTRAND CORPORATION (US) 2023-11-14 US claimed
CN-116925440-A Low-hardness wear-resistant thermoplastic vulcanized rubber composition and preparation method thereof 会通新材料(上海)有限公司 2023-10-24 CN claimed
EP-3353436-B1 ADHESIVE, BEARING WITH THE ADHESIVE, AND METHODS OF MAKING SAINT GOBAIN PERFORMANCE PLASTICS CORP (US) 2023-04-26 EP claimed
US-20220399138-A1 FLEXIBLE FLAT CABLE MANUFACTURING METHOD AND FLEXIBLE FLAT CABLE LUXSHARE-ICT CO., LTD. (TW) 2022-12-15 US claimed
US-20220352273-A1 DISPLAY PANEL, FABRICATION METHOD THEREFOR, AND DISPLAY DEVICE HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD. (CN) 2022-11-03 US claimed
US-11444138-B2 Display panel, fabrication method therefor, and display device HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD. (CN) 2022-09-13 US claimed
WO-2004058836-A1 POLYMERS WITH NEW SEQUENCE DISTRIBUTIONS EXXONMOBIL CHEMICAL PATENTS INC. (US) 2004-07-15 WO claimed
WO-2004058825-A2 POLYMERS WITH NEW SEQUENCE DISTRIBUTIONS EXXONMOBIL CHEMICAL PATENTS, INC. (US) 2004-07-15 WO claimed
JP-3179491-B2 2001-06-25 JP claimed
US-5814768-A Twisted pairs communications cable COMMSCOPE, INC. (US) 1998-09-29 US claimed
US-5614319-A ALLOY OF OLEFIN POLYMER AND FLUOROHYDROCARBON POLYMER COMMSCOPE, INC. (US) 1997-03-25 US claimed
EP-0617745-A1 STATIC DISSIPATIVE NONWOVEN TEXTILE MATERIAL W.L. GORE & ASSOCIATES, INC. (US) 1994-10-05 EP claimed
WO-1993012281-A1 STATIC DISSIPATIVE NONWOVEN TEXTILE MATERIAL W.L. GORE & ASSOCIATES, INC. (US) 1993-06-24 WO claimed
US-5213882-A Static dissipative nonwoven textile material W. L. GORE & ASSOCIATES, INC. (US) 1993-05-25 US claimed
EP-0426904-A1 Method for applying a coating to a substrate DUNFRIES INVESTMENTS LIMITED (GB) 1991-05-15 EP claimed
US-4045323-A Anolyte sealing, electrical insulating for electrolytic cells BASF WYANDOTTE CORPORATION (US) 1977-08-30 US claimed