SCHEMBL728663

SCHEMBL728663

CCO[SiH](C)O[SiH](C)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12396027 0.88
SCHEMBL27627718 0.87
SCHEMBL35695 0.85
SCHEMBL26328853 0.82
SCHEMBL11407685 0.81
SCHEMBL3911468 0.81
Fluoride SCHEMBL28074676 0.81
SCHEMBL3912026 0.81
SCHEMBL3910453 0.81
Water SCHEMBL27502571 0.81

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 108 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3663301-B1 BORON-CONTAINING COMPOUNDS, COMPOSITIONS, AND METHODS FOR THE DEPOSITION OF BORON CONTAINING FILMS VERSUM MAT US LLC (US) 2023-08-30 EP claimed
US-10985013-B2 Method and precursors for manufacturing 3D devices VERSUM MATERIALS US, LLC (US) 2021-04-20 US claimed
CN-105845549-B Method and precursor for manufacturing 3D devices 弗萨姆材料美国有限责任公司 2020-03-03 CN claimed
US-10354860-B2 Method and precursors for manufacturing 3D devices VERSUM MATERIALS US, LLC (US) 2019-07-16 US claimed
US-20180047898-A1 PROCESS FOR DEPOSITING POROUS ORGANOSILICATE GLASS FILMS FOR USE AS RESISTIVE RANDOM ACCESS MEMORY AIR PRODUCTS AND CHEMICALS, INC. 2018-02-15 US claimed
CN-107636852-A Method for depositing porous organosilicate glass films for use as resistive random access memories 弗萨姆材料美国有限责任公司 2018-01-26 CN claimed
EP-2412011-B1 CHEMICAL VAPOR DEPOSITION METHOD TOKYO ELECTRON LTD (JP) 2017-09-20 EP claimed
CN-105845549-A Method and precursors for manufacturing 3D devices 气体产品与化学公司 2016-08-10 CN claimed
US-20160225616-A1 METHOD AND PRECURSORS FOR MANUFACTURING 3D DEVICES AIR PRODUCTS AND CHEMICALS, INC. (US) 2016-08-04 US claimed
EP-3051001-A2 METHOD AND PRECURSORS FOR MANUFACTURING 3D DEVICES AIR PRODUCTS AND CHEMICALS, INC. (US) 2016-08-03 EP claimed
US-9212420-B2 Chemical vapor deposition method TOKYO ELECTRON LIMITED (JP) 2015-12-15 US claimed
EP-1482070-B1 MECHANICAL ENHANCER ADDITIVES FOR LOW DIELECTRIC FILMS AIR PROD & CHEM (US) 2015-11-11 EP claimed
US-8137764-B2 organosilicate film formed by plasma-enhanced chemical vapor deposition from a first silicon-containing precursor that comprises from 3 to 4 Si O bonds per Si atom, from 0 to 1 of Si H, Si Br, and Si Cl bonds per Si atom and a second silicon-containing precursor comprises at least one Si C bond per Si AIR PRODUCTS AND CHEMICALS, INC. (US) 2012-03-20 US claimed
US-20100247803-A1 Chemical vapor deposition method TOKYO ELECTRON LIMITED (JP) 2010-09-30 US claimed
CN-101441415-A Antireflective coatings AIR PROD & CHEM (US) 2009-05-27 CN claimed
US-20090096106-A1 ANTIREFLECTIVE COATINGS AIR PRODUCTS AND CHEMICALS, INC. (US) 2009-04-16 US claimed
EP-2048700-A2 Antireflective coatings Air Products and Chemicals, Inc. (US) 2009-04-15 EP claimed
US-20040241463-A1 Mechanical enhancer additives for low dielectric films VERSUM MATERIALS US, LLC 2004-12-02 US claimed
EP-1482070-A1 Mechanical enhancer additives for low dielectric films AIR PRODUCTS AND CHEMICALS, INC. (US) 2004-12-01 EP claimed
EP-3663301-B1 BORON-CONTAINING COMPOUNDS, COMPOSITIONS, AND METHODS FOR THE DEPOSITION OF BORON CONTAINING FILMS VERSUM MAT US LLC (US) 2023-08-30 EP disclosed
CN-116411261-A Boron-containing compounds, compositions, and methods for depositing boron-containing films 弗萨姆材料美国有限责任公司 2023-07-11 CN disclosed
US-11605535-B2 Boron-containing compounds, compositions, and methods for the deposition of a boron containing films VERSUM MATERIALS US, LLC (US) 2023-03-14 US disclosed
US-11164739-B2 Use of silicon structure former with organic substituted hardening additive compounds for dense OSG films VERSUM MATERIALS US, LLC (US) 2021-11-02 US disclosed
US-10985013-B2 Method and precursors for manufacturing 3D devices VERSUM MATERIALS US, LLC (US) 2021-04-20 US disclosed
US-20200365401-A1 Boron-Containing Compounds, Compositions, And Methods For The Deposition Of A Boron Containing Films VERSUM MATERIALS US, LLC (US) 2020-11-19 US disclosed
US-10763103-B2 Boron-containing compounds, compositions, and methods for the deposition of a boron containing films VERSUM MATERIALS US, LLC (US) 2020-09-01 US disclosed
EP-3231892-B1 MECHANICAL ENHANCEMENT OF DENSE AND POROUS ORGANOSILICATE MATERIALS BY UV EXPOSURE VERSUM MAT US LLC (US) 2020-08-05 EP disclosed
EP-3663301-A1 BORON-CONTAINING COMPOUNDS, COMPOSITIONS, AND METHODS FOR THE DEPOSITION OF BORON CONTAINING FILMS Versum Materials US, LLC (US) 2020-06-10 EP disclosed
CN-105845549-B Method and precursor for manufacturing 3D devices 弗萨姆材料美国有限责任公司 2020-03-03 CN disclosed
US-20190304775-A1 Method and Precursors for Manufacturing 3D Devices VERSUM MATERIALS US, LLC (US) 2019-10-03 US disclosed
US-20190244810-A1 Use of Silicon Structure Former with Organic Substituted Hardening Additive Compounds for Dense OSG Films VERSUM MATERIALS US, LLC (US) 2019-08-08 US disclosed
US-10354860-B2 Method and precursors for manufacturing 3D devices VERSUM MATERIALS US, LLC (US) 2019-07-16 US disclosed
EP-3121310-B1 METHOD FOR REMOVAL OF CARBON FROM AN ORGANOSILICATE MATERIAL VERSUM MAT US LLC (US) 2018-02-28 EP disclosed
US-20180047898-A1 PROCESS FOR DEPOSITING POROUS ORGANOSILICATE GLASS FILMS FOR USE AS RESISTIVE RANDOM ACCESS MEMORY AIR PRODUCTS AND CHEMICALS, INC. 2018-02-15 US disclosed
CN-107636852-A Method for depositing porous organosilicate glass films for use as resistive random access memories 弗萨姆材料美国有限责任公司 2018-01-26 CN disclosed
EP-2199428-B1 Method for removal of carbon from an organosilicate material VERSUM MAT US LLC (US) 2018-01-24 EP disclosed
EP-3231892-A1 MECHANICAL ENHANCEMENT OF DENSE AND POROUS ORGANOSILICATE MATERIALS BY UV EXPOSURE Versum Materials US, LLC (US) 2017-10-18 EP disclosed
EP-2412011-B1 CHEMICAL VAPOR DEPOSITION METHOD TOKYO ELECTRON LTD (JP) 2017-09-20 EP disclosed
EP-3211121-A2 METHOD FOR REMOVAL OF CARBON FROM AN ORGANOSILICATE MATERIAL Air Products and Chemicals, Inc. (US) 2017-08-30 EP disclosed
EP-1457583-B1 Mechanical enhancement of dense and porous organosilicate materials by UV exposure AIR PROD & CHEM (US) 2017-05-31 EP disclosed
EP-1848032-B1 Materials and methods of forming controlled voids in dielectric layers AIR PROD & CHEM (US) 2017-03-01 EP disclosed
EP-3121310-A1 METHOD FOR REMOVAL OF CARBON FROM AN ORGANOSILICATE MATERIAL Air Products and Chemicals, Inc. (US) 2017-01-25 EP disclosed
EP-2657365-B1 Method for removal of carbon from an organosilicate material AIR PROD & CHEM (US) 2017-01-18 EP disclosed
US-20160293410-A1 BORON-CONTAINING COMPOUNDS, COMPOSITIONS, AND METHODS FOR THE DEPOSITION OF A BORON CONTAINING FILMS AIR PRODUCTS AND CHEMICALS, INC. (US) 2016-10-06 US disclosed
CN-105845549-A Method and precursors for manufacturing 3D devices 气体产品与化学公司 2016-08-10 CN disclosed
US-20160225616-A1 METHOD AND PRECURSORS FOR MANUFACTURING 3D DEVICES AIR PRODUCTS AND CHEMICALS, INC. (US) 2016-08-04 US disclosed
EP-3051001-A2 METHOD AND PRECURSORS FOR MANUFACTURING 3D DEVICES AIR PRODUCTS AND CHEMICALS, INC. (US) 2016-08-03 EP disclosed
US-9293361-B2 Materials and methods of forming controlled void AIR PRODUCTS AND CHEMICALS, INC. (US) 2016-03-22 US disclosed
US-9212420-B2 Chemical vapor deposition method TOKYO ELECTRON LIMITED (JP) 2015-12-15 US disclosed
EP-1482070-B1 MECHANICAL ENHANCER ADDITIVES FOR LOW DIELECTRIC FILMS AIR PROD & CHEM (US) 2015-11-11 EP disclosed
US-9061317-B2 Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants AIR PRODUCTS AND CHEMICALS, INC. (US) 2015-06-23 US disclosed
US-8951342-B2 Methods for using porogens for low k porous organosilica glass films AIR PRODUCTS AND CHEMICALS, INC. (US) 2015-02-10 US disclosed
US-20140363950-A1 Materials and Methods of Forming Controlled Void VERSUM MATERIALS US, LLC 2014-12-11 US disclosed
US-8846522-B2 Materials and methods of forming controlled void AIR PRODUCTS AND CHEMICALS, INC. (US) 2014-09-30 US disclosed
US-8759563-B2 Low-impurity organosilicon product as precursor for CVD AIR PRODUCTS AND CHEMICALS, INC. (US) 2014-06-24 US disclosed
US-20130295334-A1 Method for Removal of Carbon from an Organosilicate Material VERSUM MATERIALS US, LLC 2013-11-07 US disclosed
EP-2657365-A2 Method for removal of carbon from an organosilicate material AIR PRODUCTS AND CHEMICALS, INC. (US) 2013-10-30 EP disclosed
US-20130260575-A1 SILICON PRECURSORS AND COMPOSITIONS COMPRISING SAME FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS AIR PRODUCTS AND CHEMICALS, INC. (US) 2013-10-03 US disclosed
CN-101621001-B Mechanical enhancement of dense and porous organosilicate materials by uv exposure AIR PROD & CHEM 2013-09-25 CN disclosed
US-20130157435-A1 Materials and Methods of Forming Controlled Void AIR PRODUCTS AND CHEMICALS, INC. (US) 2013-06-20 US disclosed
US-20130095255-A1 Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films with Low Dielectric Constants AIR PRODUCTS AND CHEMICALS, INC. (US) 2013-04-18 US disclosed
US-8399349-B2 Materials and methods of forming controlled void AIR PRODUCTS AND CHEMICALS, INC. (US) 2013-03-19 US disclosed
US-20130060061-A1 Low-Impurity Organosilicon Product as Precursor for CVD AIR PRODUCTS AND CHEMICALS, INC. (US) 2013-03-07 US disclosed
US-8329933-B2 Low-impurity organosilicon product as precursor for CVD AIR PRODUCTS AND CHEMICALS, INC. (US) 2012-12-11 US disclosed
US-20120282415-A1 Methods For Using Porogens For Low K Porous Organosilica Glass Films AIR PRODUCTS AND CHEMICALS, INC. (US) 2012-11-08 US disclosed
US-8293001-B2 Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants AIR PRODUCTS AND CHEMICALS, INC. (US) 2012-10-23 US disclosed
US-8137764-B2 organosilicate film formed by plasma-enhanced chemical vapor deposition from a first silicon-containing precursor that comprises from 3 to 4 Si O bonds per Si atom, from 0 to 1 of Si H, Si Br, and Si Cl bonds per Si atom and a second silicon-containing precursor comprises at least one Si C bond per Si AIR PRODUCTS AND CHEMICALS, INC. (US) 2012-03-20 US disclosed
US-20110295033-A1 LOW-IMPURITY ORGANOSILICON PRODUCT AS PRECURSOR FOR CVD AIR PRODUCTS AND CHEMICALS, INC. (US) 2011-12-01 US disclosed
US-20110143032-A1 Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films With Low Dielectric Constants AIR PRODUCTS AND CHEMICALS, INC. (US) 2011-06-16 US disclosed
US-7943195-B2 Mixing of glass with hydrocarbons; chemical vapor deposition; mixing organosilane and/or organosiloxane precursors with porogens; neohexyl-1,3,5,7-tetramethylcyclo-tetrasiloxane AIR PRODUCTS AND CHEMICALS, INC. (US) 2011-05-17 US disclosed
US-7932188-B2 Mechanical enhancement of dense and porous organosilicate materials by UV exposure AIR PRODUCTS AND CHEMICALS, INC. (US) 2011-04-26 US disclosed
EP-1354980-B1 Method for forming a porous SiOCH layer. AIR PROD & CHEM (US) 2011-02-23 EP disclosed
US-7855123-B2 Method of integrating an air gap structure with a substrate TOKYO ELECTRON LIMITED (JP) 2010-12-21 US disclosed
EP-2261390-A2 Mechanical enhancer additives for low dielectric films AIR PRODUCTS AND CHEMICALS, INC. (US) 2010-12-15 EP disclosed
US-20100247803-A1 Chemical vapor deposition method TOKYO ELECTRON LIMITED (JP) 2010-09-30 US disclosed
US-20100248443-A1 Method of integrating an air gap structure with a substrate TOKYO ELECTRON LIMITED (JP) 2010-09-30 US disclosed
EP-2199428-A2 Method for removal of carbon from an organosilicate material Air Products and Chemicals, Inc. (US) 2010-06-23 EP disclosed
US-20100151206-A1 Method for Removal of Carbon From An Organosilicate Material AIR PRODUCTS AND CHEMICALS, INC. (US) 2010-06-17 US disclosed
EP-1867653-B1 Low-impurity organosilicon product as precursor for CVD AIR PROD & CHEM (US) 2010-04-14 EP disclosed
CN-101621001-A Mechanical enhancement of dense and porous organosilicate materials by uv exposure AIR PROD & CHEM 2010-01-06 CN disclosed
EP-2116632-A2 Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants Air Products and Chemicals, Inc. (US) 2009-11-11 EP disclosed
CN-100543947-C Mixture for depositing low dielectric constant organosilicate films AIR PROD & CHEM (US) 2009-09-23 CN disclosed
EP-1953168-B1 Method of purifying organosilicon compositions used as precursors in chemical vapor deposition AIR PROD & CHEM (US) 2009-07-01 EP disclosed
CN-101441415-A Antireflective coatings AIR PROD & CHEM (US) 2009-05-27 CN disclosed
US-20090096106-A1 ANTIREFLECTIVE COATINGS AIR PRODUCTS AND CHEMICALS, INC. (US) 2009-04-16 US disclosed
EP-2048700-A2 Antireflective coatings Air Products and Chemicals, Inc. (US) 2009-04-15 EP disclosed
US-20090054674-A1 Mechanical Enhancement of Dense and Porous Organosilicate Materials by UV Exposure AIR PRODUCTS AND CHEMICALS, INC. (US) 2009-02-26 US disclosed
US-7468290-B2 Mechanical enhancement of dense and porous organosilicate materials by UV exposure AIR PRODUCTS AND CHEMICALS, INC. (US) 2008-12-23 US disclosed
US-20080271640-A1 Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films with Low Dielectric Constants AIR PRODUCTS AND CHEMICALS, INC. (US) 2008-11-06 US disclosed
US-20080268177-A1 Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films with Low Dielectric Constants AIR PRODUCTS AND CHEMICALS, INC. (US) 2008-10-30 US disclosed
US-20080188679-A1 Method Of Purifying Organosilicon Compositions Used As Precursors In Chemical Vapor Desposition AIR PRODUCTS AND CHEMICALS, INC. (US) 2008-08-07 US disclosed
EP-1953168-A1 Method of purifying organosilicon compositions used as precursors in chemical vapor deposition Air Products and Chemicals, Inc. (US) 2008-08-06 EP disclosed
US-7384471-B2 Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants AIR PRODUCTS AND CHEMICALS, INC. (US) 2008-06-10 US disclosed
US-20080038934-A1 MATERIALS AND METHODS OF FORMING CONTROLLED VOID AIR PRODUCTS AND CHEMICALS, INC. (US) 2008-02-14 US disclosed
EP-1867653-A1 Low-impurity organosilicon product as precursor for CVD Air Products and Chemicals, Inc. (US) 2007-12-19 EP disclosed
US-20070287849-A1 Low-Impurity Organosilicon Product As Precursor For CVD AIR PRODUCTS AND CHEMICALS, INC. (US) 2007-12-13 US disclosed
EP-1848032-A2 Materials and methods of forming controlled voids in dielectric layers Air Products and Chemicals, Inc. (US) 2007-10-24 EP disclosed
US-7098149-B2 Mechanical enhancement of dense and porous organosilicate materials by UV exposure AIR PRODUCTS AND CHEMICALS, INC. (US) 2006-08-29 US disclosed
US-6846515-B2 Methods for using porogens and/or porogenated precursors to provide porous organosilica glass films with low dielectric constants AIR PRODUCTS AND CHEMICALS, INC. (US) 2005-01-25 US disclosed
US-20040241463-A1 Mechanical enhancer additives for low dielectric films VERSUM MATERIALS US, LLC 2004-12-02 US disclosed
EP-1482070-A1 Mechanical enhancer additives for low dielectric films AIR PRODUCTS AND CHEMICALS, INC. (US) 2004-12-01 EP disclosed
EP-1457583-A2 Mechanical enhancement of dense and porous organosilicate materials by UV exposure AIR PRODUCTS AND CHEMICALS, INC. (US) 2004-09-15 EP disclosed
US-20040175957-A1 Mechanical enhancement of dense and porous organosilicate materials by UV exposure VERSUM MATERIALS US, LLC 2004-09-09 US disclosed
US-20040175501-A1 Mechanical enhancement of dense and porous organosilicate materials by UV exposure VERSUM MATERIALS US, LLC 2004-09-09 US disclosed
CN-1527366-A Mechanical property improvement of dense and porous organosilicate materials by ultraviolet radiation �����Ʒ�뻯ѧ��˾ 2004-09-08 CN disclosed
US-20030232137-A1 Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants VERSUM MATERIALS US, LLC 2003-12-18 US disclosed
US-20030198742-A1 Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants VERSUM MATERIALS US, LLC 2003-10-23 US disclosed
EP-1354980-A1 Method for forming a porous SiOCH layer. AIR PRODUCTS AND CHEMICALS, INC. (US) 2003-10-22 EP disclosed
EP-1354980-A1 Method for forming a porous SiOCH layer. AIR PRODUCTS AND CHEMICALS, INC. (US) 2003-10-22 EP disclosed