Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 3/20 | 0.56 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.40 |
| ▸ | LMNA | P02545 | 3/20 | 0.39 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.39 |
| ▸ | CA12 | O43570 | 1/20 | 0.39 |
| ▸ | CA2 | P00918 | 1/20 | 0.39 |
| ▸ | CA5A | P35218 | 1/20 | 0.39 |
| ▸ | CA9 | Q16790 | 1/20 | 0.39 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.39 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.39 |
| ▸ | CA5B | Q9Y2D0 | 1/20 | 0.39 |
| ▸ | POLB | P06746 | 4/20 | 0.38 |
| ▸ | RAB9A | P51151 | 4/20 | 0.38 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.38 |
| ▸ | GAA | P10253 | 1/20 | 0.38 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.38 |
| ▸ | HTT | P42858 | 1/20 | 0.38 |
| ▸ | MEN1 | O00255 | 2/20 | 0.37 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.37 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Orcinol SCHEMBL27934275 | 0.91 | MAPT (0.53) | MAPTALDH1A1LMNAPOLBRAB9A | |
| Resorcinol SCHEMBL28688197 | 0.90 | MAPT (0.56) | MAPTALDH1A1LMNACYP3A4CA12 | |
| Phenol SCHEMBL2452431 | 0.90 | MAPT (0.56) | MAPTALDH1A1LMNACYP3A4HSD17B10 | |
| SCHEMBL497309 | 0.90 | MAPT (0.67) | MAPTALDH1A1LMNACYP3A4POLB | |
| Resorcinol SCHEMBL8054902 | 0.86 | MAPT (0.54) | MAPTALDH1A1LMNACYP3A4CA12 | |
| Catechol SCHEMBL28207158 | 0.85 | MAPT (0.57) | MAPTALDH1A1LMNACYP3A4CA2 | |
| SCHEMBL7546964 | 0.84 | MAPT (0.56) | MAPTALDH1A1LMNACYP3A4POLB | |
| SCHEMBL28949256 | 0.83 | MAPT (0.59) | MAPTALDH1A1LMNACYP3A4POLB | |
| Biphenyl SCHEMBL28011477 | 0.82 | MAPT (0.57) | MAPTALDH1A1LMNACYP3A4HSD17B10 | |
| SCHEMBL28671333 | 0.81 | MAPT (0.61) | MAPTALDH1A1LMNACYP3A4POLB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 134 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024056417-A1 | FLAME RETARDANT THERMOPLASTIC POLYURETHANE COMPOSITION | BASF SE (DE) | 2024-03-21 | — | — | WO | claimed |
| CN-114573946-B | Halogen-free low dielectric epoxy resin composition, laminated board and printed circuit board | 联茂(无锡)电子科技有限公司 | 2024-03-08 | — | — | CN | claimed |
| CN-114806078-B | Low expansion coefficient halogen-free resin composition, laminated board and printed circuit board | 联茂(无锡)电子科技有限公司 | 2023-12-05 | — | — | CN | claimed |
| CN-116535813-A | Halogen-free epoxy resin composition | 联茂(无锡)电子科技有限公司 | 2023-08-04 | — | — | CN | claimed |
| CN-115637013-A | Bismaleimide composition, semi-cured film and copper foil substrate | 深圳伊帕思新材料科技有限公司 | 2023-01-24 | — | — | CN | claimed |
| CN-111500015-B | Halogen-free resin composition | 联茂(无锡)电子科技有限公司 | 2023-01-17 | — | — | CN | claimed |
| CN-111117154-B | Flame-retardant thermosetting resin composition, and prepreg, laminated board and printed circuit board manufactured from same | 广东生益科技股份有限公司 | 2022-10-18 | — | — | CN | claimed |
| CN-111138809-B | Halogen-free resin composition | 联茂电子股份有限公司 | 2022-05-06 | — | — | CN | claimed |
| CN-211831344-U | Flexible resistance-capacitance composite copper film structure | 鼎展电子股份有限公司 | 2020-10-30 | — | — | CN | claimed |
| CN-111500015-A | Halogen-free resin composition | 联茂(无锡)电子科技有限公司 | 2020-08-07 | — | — | CN | claimed |
| US-8969446-B2 | Flame retardant polyurethane composition | DOW GLOBAL TECHNOLOGIES LLC (US) | 2015-03-03 | — | — | US | claimed |
| EP-2307501-B1 | FLAME RETARDANT POLYURETHANE COMPOSITION | DOW GLOBAL TECHNOLOGIES LLC (US) | 2014-09-17 | — | — | EP | claimed |
| US-20130316155-A1 | HALOGEN-FREE RESIN COMPOSITION | ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO.,LTD (CN) | 2013-11-28 | — | — | US | claimed |
| US-20130161080-A1 | HALOGEN-FREE RESIN COMPOSITION AND ITS APPLICATION FOR COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD | Elite Material Co., Ltd. (TW) | 2013-06-27 | — | — | US | claimed |
| US-20130108875-A1 | INORGANIC FILLER, RESIN COMPOSITION, AND APPLICATION THEREOF | ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD. (CN) | 2013-05-02 | — | — | US | claimed |
| US-20130105209-A1 | INORGANIC FILLER AND ELECTRIC MATERIAL CONTAINING THE SAME | ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD. (CN) | 2013-05-02 | — | — | US | claimed |
| JP-2011529507-A | — | — | 2011-12-08 | — | — | JP | claimed |
| US-20110130490-A1 | FLAME RETARDANT POLYURETHANE COMPOSITION | GLOBAL INDUSTRIAL CORPORATION | 2011-06-02 | — | — | US | claimed |
| EP-2307501-A1 | FLAME RETARDANT POLYURETHANE COMPOSITION | Dow Global Technologies Inc. (US) | 2011-04-13 | — | — | EP | claimed |
| WO-2010012136-A1 | FLAME RETARDANT POLYURETHANE COMPOSITION | DOW GLOBAL TECHNOLOGIES INC. (US) | 2010-02-04 | — | — | WO | claimed |