Hydrazine

Hydrazine

SCHEMBL729621

NN.[W]

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrazine SCHEMBL9443194 0.82
Hydrazine SCHEMBL8141972 0.82
Hydrazine SCHEMBL239 0.82
Hydrazine SCHEMBL2463370 0.82
Hydrazine SCHEMBL8158007 0.82
Hydrazine SCHEMBL16089343 0.82
Hydrazine SCHEMBL23797207 0.67
Hydrazine SCHEMBL3048264 0.67
Hydrazine SCHEMBL8048995 0.67
Hydrazine SCHEMBL8999263 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6596888-B2 Employed to form diffusion barrier layers on microelectronic devices via vapor deposition. UNIVERSITY OF FLORIDA 2003-07-22 US claimed
US-20020045343-A1 MOCVD of WNx thin films using imido precursors NAVY, SECRETARY OF THE UNITED STATES OF AMERICA OFFICE OF NAVAL RESEARCH 2002-04-18 US claimed
US-8697561-B2 Microelectronic structure by selective deposition INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2014-04-15 US disclosed
US-20120142182-A1 MICROELECTRONIC STRUCTURE BY SELECTIVE DEPOSITION INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-06-07 US disclosed
US-8138100-B2 Microelectronic structure by selective deposition INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-03-20 US disclosed
US-7816743-B2 Microelectronic structure by selective deposition INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2010-10-19 US disclosed
US-7510939-B2 Microelectronic structure by selective deposition INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-03-31 US disclosed
US-20090075439-A1 MICROELECTRONIC STRUCTURE BY SELECTIVE DEPOSITION INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-03-19 US disclosed
US-20090072317-A1 MICROELECTRONIC STRUCTURE BY SELECTIVE DEPOSITION INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-03-19 US disclosed
US-20080001225-A1 MICROELECTRONIC STRUCTURE BY SELECTIVE DEPOSITION INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2008-01-03 US disclosed
US-6596888-B2 Employed to form diffusion barrier layers on microelectronic devices via vapor deposition. UNIVERSITY OF FLORIDA 2003-07-22 US disclosed
US-6596888-B2 Employed to form diffusion barrier layers on microelectronic devices via vapor deposition. UNIVERSITY OF FLORIDA 2003-07-22 US disclosed
US-20020045343-A1 MOCVD of WNx thin films using imido precursors NAVY, SECRETARY OF THE UNITED STATES OF AMERICA OFFICE OF NAVAL RESEARCH 2002-04-18 US disclosed
US-20020045343-A1 MOCVD of WNx thin films using imido precursors NAVY, SECRETARY OF THE UNITED STATES OF AMERICA OFFICE OF NAVAL RESEARCH 2002-04-18 US disclosed