⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Iodide SCHEMBL28114621 | 0.98 | NPSR1 (0.32) | — | |
| Hydrochloric Acid SCHEMBL28369727 | 0.98 | NPSR1 (0.32) | — | |
| SCHEMBL2512273 | 0.79 | — | — | |
| SCHEMBL1076387 | 0.77 | — | — | |
| Propene SCHEMBL28218434 | 0.76 | GLA (0.31) | — | |
| SCHEMBL2408958 | 0.76 | — | — | |
| SCHEMBL1219898 | 0.76 | — | — | |
| SCHEMBL2363790 | 0.75 | — | — | |
| SCHEMBL1173139 | 0.75 | — | — | |
| SCHEMBL5616570 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 129 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113451576-B | Graphite composite material, preparation method thereof and lithium ion battery | 贝特瑞(江苏)新能源材料有限公司 | 2022-07-01 | — | — | CN | claimed |
| CN-113451576-A | Graphite composite material, preparation method thereof and lithium ion battery | 贝特瑞(江苏)新能源材料有限公司 | 2021-09-28 | — | — | CN | claimed |
| CN-109647507-A | Alkylaromatic hydrocarbon selectively carbonylation uses catalyst | 中国石油化工股份有限公司 | 2019-04-19 | — | — | CN | claimed |
| CN-1311042-C | Thermosetting adhesive composition and adhesive band used said composition for electronic member | LYNOS LTD (KR) | 2007-04-18 | — | — | CN | claimed |
| CN-1690153-A | Thermosetting adhesive composition and adhesive band used said composition for electronic member | LYNOS LTD (KR) | 2005-11-02 | — | — | CN | claimed |
| JP-4370996-A | — | — | None | — | — | JP | disclosed |
| JP-63297418-A | — | — | None | — | — | JP | disclosed |
| WO-2024147917-A1 | DIELECTRIC FILM FORMING COMPOSITION CONTAINING ACYL GERMANIUM COMPOUND | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2024-07-11 | — | — | WO | disclosed |
| EP-3963036-B1 | METHOD OF ETCHING SEMICONDUCTORS | FUJIFILM ELECTRONIC MAT USA INC (US) | 2024-07-10 | — | — | EP | disclosed |
| CN-118201773-A | Copper-clad laminate and circuit board using same | DIC株式会社 | 2024-06-14 | — | — | CN | disclosed |
| US-20240174924-A1 | ETCHING COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2024-05-30 | — | — | US | disclosed |
| CN-117222095-A | Laminate, circuit board, and high-frequency circuit board | DIC株式会社 | 2023-12-12 | — | — | CN | disclosed |
| US-20020025431-A1 | Tape automated bonding (TAB); adhesive strength, moderate elastic modulus and coefficient of expansion; adhesive layer of a thermoplastic resin and a polyepoxide having skeleton containing one of dicyclopentadiene, terpene, or biphenyl | TORAY INDUSTRIES | 2002-02-28 | — | — | US | disclosed |
| US-20020012780-A1 | Base sheet for flexible printed circuit board | SHIN-ETSU CHEMICAL CO., LTD. | 2002-01-31 | — | — | US | disclosed |
| US-6303219-B1 | USED FOR MOUNTING A SEMICONDUCTOR INTEGRATED CIRCUIT; STRENGTH; RELIABILITY | TORAY INDUSTRIES, INC. (JP) | 2001-10-16 | — | — | US | disclosed |
| US-6054509-A | EPOXY RESIN; THREE DIFFERENT NITRILE RUBBERS DISTINGUISHABLE RELATIVE TO THE IODINE VALUE AND CARBOXYL GROUP CONTENT AT MOLECULAR CHAIN ENDS IN SPECIFIED PROPORTION; CURING AGENT; AND CURING ACCELERATOR; USE IN LAMINATED PRINTED CIRCUITS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-04-25 | — | — | US | disclosed |
| EP-0823729-A1 | ADHESIVE SHEET FOR SEMICONDUCTOR CONNECTING SUBSTRATE, ADHESIVE-BACKED TAPE FOR TAB, ADHESIVE-BACKED TAPE FOR WIRE-BONDING CONNECTION, SEMICONDUCTOR CONNECTING SUBSTRATE, AND SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 1998-02-11 | — | — | EP | disclosed |
| US-5260130-A | Adhesive layer containing epoxy resin, nitrile rubber containing carboxy groups, curing agent and curing accelerator | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1993-11-09 | — | — | US | disclosed |
| JP-H04370996-A | BONDING SHEET | SHIN ETSU CHEM CO LTD | 1992-12-24 | — | — | JP | disclosed |
| JP-S63297418-A | COVER LAY FILM | SHIN ETSU CHEM CO LTD | 1988-12-05 | — | — | JP | disclosed |