Fluoride Ion

Fluoride Ion

SCHEMBL73611

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nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Fluoride Ion SCHEMBL28044912 0.82
Fluoride Ion SCHEMBL22554800 0.82 CA4 (0.33)
Fluoride Ion SCHEMBL8089966 0.82
SCHEMBL29889134 0.71
SCHEMBL27427293 0.71
Fluoride Ion SCHEMBL23200395 0.71
SCHEMBL6559802 0.71
Fluoride Ion SCHEMBL21829535 0.50
Fluoride Ion SCHEMBL22981870 0.50
Fluoride Ion SCHEMBL22352677 0.50

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2618 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12618154-B2 Selective non-plasma deposition of mask protection material TOKYO ELECTRON LIMITED (JP) 2026-05-05 US claimed
US-20260068643-A1 SEMICONDUCTOR DEVICE AND METHODS OF FORMATION TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2026-03-05 US claimed
US-12520554-B2 Area-selective removal and selective metal cap TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2026-01-06 US claimed
US-20260005145-A1 MEMORY DEVICE INCLUDING CONTROL GATES HAVING TUNGSTEN STRUCTURE MICRON TECHNOLOGY INC (US) 2026-01-01 US claimed
US-20250366121-A1 AREA-SELECTIVE REMOVAL AND SELECTIVE METAL CAP TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2025-11-27 US claimed
US-20250357129-A1 FLUORINE INCORPORATION METHOD FOR NANOSHEET TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2025-11-20 US claimed
US-20250357117-A1 DOPED TUNGSTEN CARBIDE LOW-K ETCH HARD MASK APPLIED MATERIALS INC (US) 2025-11-20 US claimed
US-20250349545-A1 VOLUME-LESS FLUORINE INCORPORATION METHOD TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2025-11-13 US claimed
US-20250300015-A1 SELECTIVE TUNGSTEN NAND DEEP CONTACT GAP BOTTOM FILL APPLIED MATERIALS, INC. 2025-09-25 US claimed
US-20250293041-A1 CYCLIC ETCH/DEPOSITION PLASMA PROCESSES USING TUNGSTEN BASED PRECURSOR GAS TOKYO ELECTRON LIMITED (JP) 2025-09-18 US claimed
US-5162246-A Shallow source and drain junction NORTH CAROLINA STATE UNIVERSITY (US) 1992-11-10 US claimed
CN-1058298-A A kind of silicon film capacitor pressure sensor and manufacture method thereof TU XIANGZHENG (CN) 1992-01-29 CN claimed
US-5069749-A Method of fabricating interconnect layers on an integrated circuit chip using seed-grown conductors DIGITAL EQUIPMENT CORPORATION (US) 1991-12-03 US claimed
US-4923715-A Method of forming thin film by chemical vapor deposition KABUSHIKI KAISHA TOSHIBA (JP) 1990-05-08 US claimed
US-4894256-A VAPOR DEPOSITION, PLASMA RESISTANCE U.S. PHILIPS CORPORATION (US) 1990-01-16 US claimed
EP-0256917-A1 Method of producing interconnection layers using CVD of metal DIGITAL EQUIPMENT CORPORATION (US) 1988-02-24 EP claimed
EP-0134571-B1 INTEGRATED SEMICONDUCTOR CIRCUIT HAVING AN ALUMINIUM OR ALUMINIUM ALLOY MULTILAYER WIRING, AND METHOD FOR ITS MANUFACTURE SIEMENS AKTIENGESELLSCHAFT (DE) 1988-01-07 EP claimed
US-4670614-A HIGH OCTANE GASOLINE RESEARCH ASSOCIATION FOR PETROLEUM ALTERNATIVE DEVELOPMENT (JP) 1987-06-02 US claimed
US-4519785-A Life tungsten filament for incandescent lamp GTE PRODUCTS CORPORATION (US) 1985-05-28 US claimed
EP-0092109-A2 Method for increasing the life of a tungsten filament for an incandescent lamp GTE Products Corporation (US) 1983-10-26 EP claimed