Fluoride Ion

Fluoride Ion

SCHEMBL73611

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nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Fluoride Ion SCHEMBL28044912 0.82 — —
Fluoride Ion SCHEMBL22554800 0.82 CA4 (0.33) —
Fluoride Ion SCHEMBL8089966 0.82 — —
SCHEMBL27427293 0.71 — —
SCHEMBL29889134 0.71 — —
Fluoride Ion SCHEMBL23200395 0.71 — —
SCHEMBL6559802 0.71 — —
Fluoride Ion SCHEMBL21829535 0.50 — —
Fluoride Ion SCHEMBL24361 0.50 — —
Fluoride Ion SCHEMBL22981870 0.50 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2618 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12618154-B2 Selective non-plasma deposition of mask protection material TOKYO ELECTRON LIMITED (JP) 2026-05-05 — — US claimed
US-20260068643-A1 SEMICONDUCTOR DEVICE AND METHODS OF FORMATION TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2026-03-05 — — US claimed
US-12520554-B2 Area-selective removal and selective metal cap TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2026-01-06 — — US claimed
US-20260005145-A1 MEMORY DEVICE INCLUDING CONTROL GATES HAVING TUNGSTEN STRUCTURE MICRON TECHNOLOGY INC (US) 2026-01-01 — — US claimed
US-20250366121-A1 AREA-SELECTIVE REMOVAL AND SELECTIVE METAL CAP TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2025-11-27 — — US claimed
US-20250357129-A1 FLUORINE INCORPORATION METHOD FOR NANOSHEET TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2025-11-20 — — US claimed
US-20250357117-A1 DOPED TUNGSTEN CARBIDE LOW-K ETCH HARD MASK APPLIED MATERIALS INC (US) 2025-11-20 — — US claimed
US-20250349545-A1 VOLUME-LESS FLUORINE INCORPORATION METHOD TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2025-11-13 — — US claimed
US-20250300015-A1 SELECTIVE TUNGSTEN NAND DEEP CONTACT GAP BOTTOM FILL APPLIED MATERIALS, INC. 2025-09-25 — — US claimed
US-20250293041-A1 CYCLIC ETCH/DEPOSITION PLASMA PROCESSES USING TUNGSTEN BASED PRECURSOR GAS TOKYO ELECTRON LIMITED (JP) 2025-09-18 — — US claimed
US-5162246-A Shallow source and drain junction NORTH CAROLINA STATE UNIVERSITY (US) 1992-11-10 — — US claimed
CN-1058298-A A kind of silicon film capacitor pressure sensor and manufacture method thereof TU XIANGZHENG (CN) 1992-01-29 — — CN claimed
US-5069749-A Method of fabricating interconnect layers on an integrated circuit chip using seed-grown conductors DIGITAL EQUIPMENT CORPORATION (US) 1991-12-03 — — US claimed
US-4923715-A Method of forming thin film by chemical vapor deposition KABUSHIKI KAISHA TOSHIBA (JP) 1990-05-08 — — US claimed
US-4894256-A VAPOR DEPOSITION, PLASMA RESISTANCE U.S. PHILIPS CORPORATION (US) 1990-01-16 — — US claimed
EP-0256917-A1 Method of producing interconnection layers using CVD of metal DIGITAL EQUIPMENT CORPORATION (US) 1988-02-24 — — EP claimed
EP-0134571-B1 INTEGRATED SEMICONDUCTOR CIRCUIT HAVING AN ALUMINIUM OR ALUMINIUM ALLOY MULTILAYER WIRING, AND METHOD FOR ITS MANUFACTURE SIEMENS AKTIENGESELLSCHAFT (DE) 1988-01-07 — — EP claimed
US-4670614-A HIGH OCTANE GASOLINE RESEARCH ASSOCIATION FOR PETROLEUM ALTERNATIVE DEVELOPMENT (JP) 1987-06-02 — — US claimed
US-4519785-A Life tungsten filament for incandescent lamp GTE PRODUCTS CORPORATION (US) 1985-05-28 — — US claimed
EP-0092109-A2 Method for increasing the life of a tungsten filament for an incandescent lamp GTE Products Corporation (US) 1983-10-26 — — EP claimed
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