SCHEMBL736614

SCHEMBL736614

ClCc1ccccc1-c1ccccc1CCl

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DPP4 P27487 3/20 0.46
ALDH1A1 P00352 2/20 0.44
TSHR P16473 1/20 0.44
AURKA O14965 1/20 0.39
AURKB Q96GD4 1/20 0.39
KMT2A Q03164 3/20 0.37
IDO1 P14902 3/20 0.36
PNMT P11086 1/20 0.36
CSNK2A2 P19784 1/20 0.34
CSNK2B P67870 1/20 0.34
CSNK2A1 P68400 1/20 0.34
CSNK2A3 Q8NEV1 1/20 0.34
L3MBTL1 Q9Y468 2/20 0.33
DNMT1 P26358 1/20 0.33
DNMT3L Q9UJW3 1/20 0.33
DNMT3A Q9Y6K1 1/20 0.33
HSPA5 P11021 1/20 0.33
PDCD1 Q15116 1/20 0.33
CD274 Q9NZQ7 1/20 0.33
TAAR1 Q96RJ0 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10896807 0.97 DPP4 (0.44) DPP4ALDH1A1TSHRAURKAAURKB
SCHEMBL19002938 0.89 DPP4 (0.40) DPP4ALDH1A1TSHRAURKAAURKB
SCHEMBL1538745 0.87 DPP4 (0.39) DPP4ALDH1A1TSHRAURKAAURKB
SCHEMBL9456872 0.86 DPP4 (0.50) DPP4ALDH1A1TSHRAURKAAURKB
SCHEMBL8858813 0.85 HSPA5 (0.46) DPP4ALDH1A1TSHRAURKAAURKB
SCHEMBL29265422 0.85 DPP4 (0.50) DPP4ALDH1A1TSHRKMT2APDCD1
SCHEMBL8108088 0.85 TAAR1 (0.41) DPP4ALDH1A1TSHRKMT2AIDO1
SCHEMBL31179899 0.84 DPP4 (0.48) DPP4ALDH1A1TSHRAURKAAURKB
SCHEMBL83911 0.84 DPP4 (0.60) DPP4ALDH1A1TSHRKMT2APDCD1
SCHEMBL150237 0.83 TSHR (0.50) DPP4ALDH1A1TSHRAURKAAURKB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 127 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9447238-B2 Polyphenylene oxide resin, method of preparing polyphenylene oxide resin, polyphenylene oxide prepolymer and resin composition ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD. (CN) 2016-09-20 US claimed
US-20160185904-A1 POLYPHENYLENE OXIDE RESIN, METHOD OF PREPARING POLYPHENYLENE OXIDE RESIN, POLYPHENYLENE OXIDE PREPOLYMER AND RESIN COMPOSITION ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD. (CN) 2016-06-30 US claimed
US-12378354-B2 Active ester resin, method for producing thereof, epoxy resin composition, cured product thereof, prepreg, laminated board, and material for circuit substrate NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2025-08-05 US disclosed
EP-4585661-A1 ADHESIVE COMPOSITION FOR SEMICONDUCTOR PACKAGE LG CHEM, LTD. (KR) 2025-07-16 EP disclosed
WO-2025018840-A1 ADHESIVE COMPOSITION FOR SEMICONDUCTOR PACKAGE 주식회사 엘지화학 2025-01-23 WO disclosed
US-20240329525-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-10-03 US disclosed
US-20240270899-A1 POLYESTER RESIN AJINOMOTO CO., INC. (JP) 2024-08-15 US disclosed
EP-4410860-A1 POLYESTER RESIN AJINOMOTO CO., INC. (JP) 2024-08-07 EP disclosed
US-20240210827-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-06-27 US disclosed
US-11993731-B2 Adhesive composition for semiconductor circuit connection and adhesive film containing the same LG CHEM, LTD. (KR) 2024-05-28 US disclosed
WO-2024071129-A1 ACTIVE ESTER RESIN, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF, PREPREG, LAMINATED BOARD, AND BUILD-UP FILM 日鉄ケミカル&マテリアル株式会社 2024-04-04 WO disclosed
WO-1999064044-A1 NOVEL THERAPEUTIC AGENTS THAT MODULATE 5-HT RECEPTORS ADVANCED MEDICINE, INC. (US) 1999-12-16 WO disclosed
EP-0514338-B1 Mixtures of sprioheptadiene compounds CIBA GEIGY AG (CH) 1996-03-27 EP disclosed
EP-0514338-A1 Mixtures of sprioheptadiene compounds CIBA-GEIGY AG (CH) 1992-11-19 EP disclosed
US-4987206-A IMPROVED CHEMICAL RESISTANCE E. I. DU PONT DE NEMOURS AND COMPANY (US) 1991-01-22 US disclosed
US-4879416-A Preparation of bidentate ligands EASTMAN KODAK COMPANY (US) 1989-11-07 US disclosed
US-4564705-A POLYAMIDE, POLYUREA AND POLYURETHANE MONOMERS E. I. DU PONT DE NEMOURS AND COMPANY (US) 1986-01-14 US disclosed
US-4451642-A Bis(aminoneopentyl) aromatics and polyamides derived therefrom E. I. DU PONT DE NEMOURS AND COMPANY (US) 1984-05-29 US disclosed
US-4202838-A Sulphonated condensation products CIBA-GEIGY CORPORATION (US) 1980-05-13 US disclosed
US-4130579-A Bis(2-methyl-2-cyanopropyl) aromatics E. I. DU PONT DE NEMOURS AND COMPANY (US) 1978-12-19 US disclosed