⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Methane SCHEMBL28161404 | 1.00 | — | — | |
| SCHEMBL431959 | 1.00 | — | — | |
| SCHEMBL2797489 | 1.00 | — | — | |
| SCHEMBL10781925 | 1.00 | — | — | |
| SCHEMBL2586571 | 1.00 | — | — | |
| SCHEMBL2086942 | 1.00 | — | — | |
| SCHEMBL5608685 | 1.00 | — | — | |
| SCHEMBL33655 | 1.00 | — | — | |
| SCHEMBL21240130 | 1.00 | — | — | |
| SCHEMBL27897116 | 1.00 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1115 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12604552-B2 | Contact etch stop layer for a pixel sensor | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2026-04-14 | — | — | US | claimed |
| US-20250243579-A1 | DLC COATING AND PREPARATION METHOD AND DEVICE THEREFOR, COMPOSITE COATING LAYER AND COATED PRODUCT | JIANGSU FAVORED NANOTECHNOLOGY CO., LTD. (CN) | 2025-07-31 | — | — | US | claimed |
| CN-120119232-A | Method for effectively reducing adsorption and accumulation of tritium on ionization chamber wall | 中国工程物理研究院材料研究所 | 2025-06-10 | — | — | CN | claimed |
| US-20250138376-A1 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF AND LIQUID CRYSTAL PANEL | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. (CN) | 2025-05-01 | — | — | US | claimed |
| US-20250113608-A1 | THIN-FILM TRANSISTOR AND METHOD FOR MANUFACTURING SAME, AND DISPLAY PANEL | Nanjing BOE Display Technology Co., Ltd. (CN) | 2025-04-03 | — | — | US | claimed |
| US-20250102870-A1 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF AND LIQUID CRYSTAL PANEL | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. (CN) | 2025-03-27 | — | — | US | claimed |
| EP-4509639-A1 | DLC COATING AND PREPARATION METHOD AND DEVICE THEREFOR, COMPOSITE COATING LAYER AND COATED PRODUCT | Jiangsu Favored Nanotechnology Co., Ltd. (CN) | 2025-02-19 | — | — | EP | claimed |
| US-20250013048-A1 | OPTICAL WAVEGUIDE AND ENCAPSULATION METHOD THEREOF | BOE TECHNOLOGY GROUP CO., LTD. (CN) | 2025-01-09 | — | — | US | claimed |
| US-12189255-B2 | Array substrate and manufacturing method thereof and liquid crystal panel | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. (CN) | 2025-01-07 | — | — | US | claimed |
| CN-119208555-A | Porous silicon-carbon material and preparation method and application thereof | 浙江锂威能源科技有限公司 | 2024-12-27 | — | — | CN | claimed |
| EP-0436588-B1 | LOW STRESS POLYSILICON MICROSTRUCTURES | SIEMENS AG (DE) | 1994-03-23 | — | — | EP | claimed |
| US-5217753-A | Vapor depostion; multilayer coating | LIBBEY-OWENS-FORD CO. (US) | 1993-06-08 | — | — | US | claimed |
| US-5059556-A | Low stress polysilicon microstructures | SIEMENS-BENDIX AUTOMOTIVE ELECTRONICS, L.P. (US) | 1991-10-22 | — | — | US | claimed |
| EP-0436588-A1 | LOW STRESS POLYSILICON MICROSTRUCTURES. | SIEMENS AG (DE) | 1991-07-17 | — | — | EP | claimed |
| EP-0420950-A4 | COATED GLASS ARTICLES | — | 1991-07-10 | — | — | EP | claimed |
| EP-0420950-A1 | COATED GLASS ARTICLES. | LIBBEY OWENS FORD CO (US) | 1991-04-10 | — | — | EP | claimed |
| EP-0404101-A1 | Method for depositing silicon dioxide film and product | WATKINS-JOHNSON COMPANY (US) | 1990-12-27 | — | — | EP | claimed |
| CN-1047845-A | The glasswork that has coating | LIBBEY OWENS FORD CO (US) | 1990-12-19 | — | — | CN | claimed |
| WO-1990009883-A1 | COATED GLASS ARTICLES | LIBBEY-OWENS-FORD CO. (US) | 1990-09-07 | — | — | WO | claimed |
| WO-1990003660-A1 | LOW STRESS POLYSILICON MICROSTRUCTURES | SIEMENS AKTIENGESELLSCHAFT (DE) | 1990-04-05 | — | — | WO | claimed |