SCHEMBL7418604

SCHEMBL7418604

CCC(O)CI

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Diiodohydroxypropane SCHEMBL2279164 0.76
3-Pentanol SCHEMBL5341 0.76
SCHEMBL2381211 0.74
SCHEMBL567519 0.74
SCHEMBL2382259 0.74
SCHEMBL8376038 0.73
SCHEMBL17676279 0.73
3-Pentanol SCHEMBL7547369 0.72
3-Pentanol SCHEMBL27320978 0.72
3-Pentanol SCHEMBL3183384 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111954848-B Photosensitive resin composition, cured product, insulating material, resin material for solder resist, and resist member DIC株式会社 2024-05-03 CN disclosed
CN-109153653-B Novel compound, photocurable composition, cured product thereof, printing ink, and printed matter using the printing ink DIC株式会社 2022-06-28 CN disclosed
US-11193925-B2 Medication adherence monitoring device UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC. (US) 2021-12-07 US disclosed
US-11079675-B2 Compound, photocurable composition, cured product of same, printing ink, and printed matter curing the printing ink DIC CORPORATION (JP) 2021-08-03 US disclosed
CN-111954848-A Photosensitive resin composition, cured product, insulating material, resin material for solder resist, and resist member DIC株式会社 2020-11-17 CN disclosed
US-20200103394-A1 MEDICATION ADHERENCE MONITORING DEVICE UNIV FLORIDA (US) 2020-04-02 US disclosed
WO-2019198490-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, RESIN MATERIAL FOR SOLDER RESISTS AND RESIST MEMBER DIC株式会社 2019-10-17 WO disclosed
US-20190137872-A1 NOVEL COMPOUND, PHOTOCURABLE COMPOSITION, CURED PRODUCT OF SAME, PRINTING INK, AND PRINTED MATTER SURING THE PRINTING INK DIC CORPORATION (JP) 2019-05-09 US disclosed
CN-109153653-A New compound, Photocurable composition, its solidfied material, printing ink and the printed article for having used the printing ink DIC株式会社 2019-01-04 CN disclosed
CN-108191655-A The synthetic method of U.S.'s western corn rootworm sex pheromone and its application 西北农林科技大学 2018-06-22 CN disclosed
US-9139690-B2 Bisphenol A (BPA) free epoxy resins UNIVERSITY OF MASSACHUSETTS LOWELL (US) 2015-09-22 US disclosed
WO-2015134390-A1 MEDICATION ADHERENCE MONITORING DEVICE UNIVERSITY OF FLORIDA RESEARCH FOUNDATION (US) 2015-09-11 WO disclosed
WO-2014201026-A2 ANTIOXIDANT, ANTI-INFLAMMATORY AND ANTICANCER DERIVATIVES OF TRIPTOLIDE AND NANOSPHERES THEREOF CEDARS-SINAI MEDICAL CENTER (US) 2014-12-18 WO disclosed
US-20140088289-A1 BISPHENOL A (BPA) FREE EPOXY RESINS UNIVERSITY OF MASSACHUSETTS LOWELL (US) 2014-03-27 US disclosed
WO-2013155223-A1 COMPOSITIONS AND METHODS FOR TREATING CANCER THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 2013-10-17 WO disclosed
EP-2370449-B1 SILSESQUIOXANE PHOTOINITIATORS BASF SE (DE) 2013-08-14 EP disclosed
EP-2295444-A2 Lipopeptides as antibacterial agents Cubist Pharmaceutical Inc. (US) 2011-03-16 EP disclosed
EP-0641323-A1 CARBOSTYRIL DERIVATIVES AS MATRIX METALLOPROTEINASES INHIBITORS OTSUKA PHARMACEUTICAL CO., LTD. (JP) 1995-03-08 EP disclosed
WO-1994021612-A1 CARBOSTYRIL DERIVATIVES AS MATRIX METALLOPROTEINASES INHIBITORS OTSUKA PHARMACEUTICAL CO., LTD. (JP) 1994-09-29 WO disclosed
US-4231937-A LIQUID-PHASE REACTION USING CARBON DIOXIDE, OXYGEN, AND A CATALYTIC MIXTURE OF A METAL HALIDE AND A METAL CARBONATE ATLANTIC RICHFIELD COMPANY (US) 1980-11-04 US disclosed