Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CDK1 | P06493 | 2/20 | 0.41 |
| ▸ | CCNB1 | P14635 | 2/20 | 0.41 |
| ▸ | CCNA2 | P20248 | 2/20 | 0.41 |
| ▸ | CDK2 | P24941 | 2/20 | 0.41 |
| ▸ | CCNA1 | P78396 | 2/20 | 0.41 |
| ▸ | MGMT | P16455 | 1/20 | 0.41 |
| ▸ | CASP1 | P29466 | 1/20 | 0.35 |
| ▸ | CA1 | P00915 | 2/20 | 0.33 |
| ▸ | CA2 | P00918 | 2/20 | 0.33 |
| ▸ | CA9 | Q16790 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | MEN1 | O00255 | 1/20 | 0.32 |
| ▸ | POLB | P06746 | 1/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.32 |
| ▸ | CA7 | P43166 | 1/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | MAPT | P10636 | 1/20 | 0.31 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.31 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Formaldehyde SCHEMBL5554851 | 0.95 | CDK1 (0.39) | CDK1CCNB1CCNA2CDK2CCNA1 | |
| SCHEMBL9770779 | 0.86 | CDK1 (0.37) | CDK1CCNB1CCNA2CDK2CCNA1 | |
| SCHEMBL7171099 | 0.81 | CDK1 (0.32) | CDK1CCNB1CCNA2CDK2CCNA1 | |
| SCHEMBL10424897 | 0.80 | CDK1 (0.33) | CDK1CCNB1CCNA2CDK2CCNA1 | |
| SCHEMBL24727889 | 0.78 | MAPT (0.47) | CDK1CCNB1CCNA2CDK2CCNA1 | |
| SCHEMBL15068452 | 0.76 | CA1 (0.46) | CA1CA2CA9ALDH1A1MEN1 | |
| SCHEMBL15584 | 0.76 | — | — | |
| Methylamine SCHEMBL3265606 | 0.74 | — | — | |
| SCHEMBL28278934 | 0.74 | MEN1 (0.44) | CA1CA2CA9ALDH1A1MEN1 | |
| Hydroxyamine SCHEMBL7152009 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 147 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3926003-A1 | RUBBER COMPOSITION, LAMINATE, AND MARINE HOSE | The Yokohama Rubber Co., Ltd. (JP) | 2021-12-22 | — | — | EP | claimed |
| CN-100501571-C | Photoresist composition for multi-micro nozzle head coater | SAMSUNG ELECTRONICS CO LTD (KR) | 2009-06-17 | — | — | CN | claimed |
| CN-1306336-C | Photoresist composite and pattern forming process with it | SAMSUNG ELECTRONICS CO LTD (KR) | 2007-03-21 | — | — | CN | claimed |
| CN-1550897-A | Photoresist composition for multi-micro nozzle head coater | ���ǵ�����ʽ���� | 2004-12-01 | — | — | CN | claimed |
| US-6686120-B2 | THERMAL ACID GENERATOR AND A METHOD OF FORMING A PATTERN USING THE SAME. THE PHOTORESIST COMPOSITION INCLUDES ABOUT 100 PARTS BY WEIGHT OF AN ALKALI-SOLUBLE ACRYL COPOLYMER, ABOUT 5-100 PARTS BY WEIGHT OF 1,2-QUINONEDIAZIDE COMPOUND, ABOUT | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2004-02-03 | — | — | US | claimed |
| CN-1432871-A | Photoresist composite and pattern forming process with it | SAMSUNG ELECTRONICS CO LTD (KR) | 2003-07-30 | — | — | CN | claimed |
| US-20030134222-A1 | Photoresist composition and method of forming pattern using the same | SAMSUNG ELECTRONICS CO., LTD. | 2003-07-17 | — | — | US | claimed |
| JP-56114667-A | — | — | None | — | — | JP | disclosed |
| WO-2024004769-A1 | RUBBER COMPOSITION FOR TRANSMISSION BELT, TRANSMISSION BELT, AND METHOD FOR MANUFACTURING TRANSMISSION BELT | 三ツ星ベルト株式会社 | 2024-01-04 | — | — | WO | disclosed |
| CN-116648671-A | Negative photosensitive resin composition capable of realizing low-temperature curing and low refractive index | 株式会社东进世美肯 | 2023-08-25 | — | — | CN | disclosed |
| CN-115735143-A | Polarizing plate with adhesive layer | 住友化学株式会社 | 2023-03-03 | — | — | CN | disclosed |
| CN-115731778-A | Transparent resin layer | 日东电工株式会社 | 2023-03-03 | — | — | CN | disclosed |
| CN-115710473-A | Transparent resin layer | 日东电工株式会社 | 2023-02-24 | — | — | CN | disclosed |
| US-5489474-A | LACTIC ACID BASE POLYMER | MITSUI TOATSU CHEMICALS, INC. (JP) | 1996-02-06 | — | — | US | disclosed |
| EP-0677561-A1 | Degradable resin composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1995-10-18 | — | — | EP | disclosed |
| US-5416147-A | Hydrosilylative composition and process of hydrosilylation reaction | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1995-05-16 | — | — | US | disclosed |
| US-5374682-A | Hard, acid resistant automobile topcoatings | NIPPON PAINT CO., LTD. (JP) | 1994-12-20 | — | — | US | disclosed |
| EP-0602933-A2 | Hydrosilylative compositions and hydrosilylation reaction processes | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1994-06-22 | — | — | EP | disclosed |
| EP-0587069-A1 | Degradable adhesive film and degradable resin composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1994-03-16 | — | — | EP | disclosed |
| JP-S56114667-A | ABRASIVE MOLDING AND BINDING AGENT FOR ABRASIVE | SANWA CHEM:KK | 1981-09-09 | — | — | JP | disclosed |