SCHEMBL7514658

SCHEMBL7514658

[Al+3].[Al+3].[Al+3].[N-3].[N-3].[N-3].[N-3].[N-3].[N-3].[N-3].[N-3].[Nb+5].[Nb+5].[Nb+5]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL41912 0.82
SCHEMBL18886767 0.82
SCHEMBL16037 0.82
SCHEMBL7973038 0.82
SCHEMBL4865213 0.82
SCHEMBL8849452 0.82
SCHEMBL10578755 0.82
SCHEMBL2886285 0.67
Water SCHEMBL1263931 0.67
SCHEMBL571254 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9882113-B1 Gallium beam lithography for superconductive structure formation NATIONAL TECHNOLOGY & ENGINEERING SOLUTIONS OF SANDIA, LLC (US) 2018-01-30 US claimed
US-9030862-B2 Resistive-switching nonvolatile memory elements INTERMOLECULAR, INC. (US) 2015-05-12 US claimed
US-20150034896-A1 Resistive-Switching Nonvolatile Memory Elements INTERMOLECULAR INC (US) 2015-02-05 US claimed
US-8873276-B2 Resistive-switching nonvolatile memory elements INTERMOLECULAR, INC. (US) 2014-10-28 US claimed
US-20140042384-A1 Resistive-Switching Nonvolatile Memory Elements INTERMOLECULAR INC. (US) 2014-02-13 US claimed
US-8599603-B2 Resistive-switching nonvolatile memory elements INTERMOLECULAR, INC. (US) 2013-12-03 US claimed
US-20130217200-A1 Resistive-Switching Nonvolatile Memory Elements INTERMOLECULAR INC. (US) 2013-08-22 US claimed
CN-110438442-B Nano niobium aluminum yttrium nitride/amorphous silicon nitride biphase superhard coating and deposition method thereof 江西科技师范大学 2021-07-23 CN disclosed
US-9882113-B1 Gallium beam lithography for superconductive structure formation NATIONAL TECHNOLOGY & ENGINEERING SOLUTIONS OF SANDIA, LLC (US) 2018-01-30 US disclosed
US-20020125573-A1 Ferroelectric integrated circuit having hydrogen barrier layer SYMETRIX CORPORATION 2002-09-12 US disclosed
US-20020125573-A1 Ferroelectric integrated circuit having hydrogen barrier layer SYMETRIX CORPORATION 2002-09-12 US disclosed
US-6365927-B1 Ferroelectric integrated circuit having hydrogen barrier layer SYMETRIX CORPORATION 2002-04-02 US disclosed
US-6365927-B1 Ferroelectric integrated circuit having hydrogen barrier layer SYMETRIX CORPORATION 2002-04-02 US disclosed
WO-2001075945-A3 FERROELECTRIC INTEGRATED CIRCUIT HAVING HYDROGEN BARRIER LAYER SYMETRIX CORP (US) 2002-01-31 WO disclosed
WO-2001075945-A2 FERROELECTRIC INTEGRATED CIRCUIT HAVING HYDROGEN BARRIER LAYER SYMETRIX CORPORATION (US) 2001-10-11 WO disclosed
WO-2001075945-A2 FERROELECTRIC INTEGRATED CIRCUIT HAVING HYDROGEN BARRIER LAYER SYMETRIX CORPORATION (US) 2001-10-11 WO disclosed