SCHEMBL7516706

SCHEMBL7516706

Nc1ccc(Oc2ccc(Oc3ccc(C(=O)c4ccc(Oc5ccc(Oc6ccc(N)cc6)cc5)cc4)cc3)cc2)cc1

nearest known ligand 0.73

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PARP10 Q53GL7 5/20 0.73
ALDH1A1 P00352 4/20 0.64
TDP1 Q9NUW8 2/20 0.64
CYP3A4 P08684 1/20 0.64
TSHR P16473 1/20 0.64
SRD5A2 P31213 3/20 0.59
KMT2A Q03164 2/20 0.58
PARP15 Q460N3 2/20 0.58
PARP14 Q460N5 1/20 0.58
PARP16 Q8N5Y8 1/20 0.58
PARP11 Q9NR21 1/20 0.58
PARP4 Q9UKK3 1/20 0.58
MAOA P21397 2/20 0.54
MAPT P10636 4/20 0.52
TEAD4 Q15561 1/20 0.52
HPGD P15428 1/20 0.52
RAB9A P51151 1/20 0.52
MAOB P27338 1/20 0.52
POLB P06746 2/20 0.50
MEN1 O00255 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL202216 1.00 PARP10 (0.73) PARP10ALDH1A1TDP1CYP3A4TSHR
SCHEMBL204411 1.00 PARP10 (0.73) PARP10ALDH1A1TDP1CYP3A4TSHR
SCHEMBL201750 1.00 PARP10 (0.73) PARP10ALDH1A1TDP1CYP3A4TSHR
SCHEMBL9860090 1.00 PARP10 (0.73) PARP10ALDH1A1TDP1CYP3A4TSHR
SCHEMBL8734920 1.00 PARP10 (0.73) PARP10ALDH1A1TDP1CYP3A4TSHR
SCHEMBL12553949 1.00 PARP10 (0.73) PARP10ALDH1A1TDP1CYP3A4TSHR
SCHEMBL15297595 1.00 PARP10 (0.73) PARP10ALDH1A1TDP1CYP3A4TSHR
Ammonia Solution, Strong SCHEMBL9625023 0.98 PARP10 (0.70) PARP10ALDH1A1TDP1CYP3A4TSHR
SCHEMBL15294825 0.94 PARP10 (0.66) PARP10ALDH1A1TDP1CYP3A4TSHR
SCHEMBL17281693 0.94 PARP10 (0.66) PARP10ALDH1A1TDP1CYP3A4TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230384672-A1 Polymer Layer in Semiconductor Device and Method of Manufacture TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2023-11-30 US disclosed
EP-0518571-B1 Favorably processable polyimide and process for preparing polyimide MITSUI CHEMICALS INC (JP) 2002-01-23 EP disclosed
EP-0633294-B1 Polyimide based resin composition MITSUI CHEMICALS INC (JP) 1998-06-10 EP disclosed
EP-0591551-B1 POLYIMIDE RESIN COMPOSITION MITSUI TOATSU CHEMICALS (JP) 1998-03-04 EP disclosed
EP-0812885-A2 Polyimide based resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1997-12-17 EP disclosed
US-5571875-A BLEND WITH FLUOROPOLYMER, GRAPHITE, POLYAMIDE AND LIQUID CRYSTAL POLYMER MITSUI TOATSU CHEMICALS, INC. (JP) 1996-11-05 US disclosed
EP-0462282-B1 POLYIMIDE MOLDING MITSUI TOATSU CHEMICALS (JP) 1996-06-26 EP disclosed
US-5516837-A FLUOROPOLYMER, CARBON FIBERS, AROMATIC POLYESTER LIQUID CRYSTAL POLYMER MITSUI TOATSU CHEMICALS, INC. (JP) 1996-05-14 US disclosed
EP-0430640-B1 Polyimide based resin composition MITSUI TOATSU CHEMICALS (JP) 1996-03-27 EP disclosed
US-5473010-A Blend with a polyether ketone polymer; fatigue and creepresistance; high strength MITSUI TOATSU CHEMICALS, INC. (JP) 1995-12-05 US disclosed
EP-0643105-A1 Polyimide based resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1995-03-15 EP disclosed
EP-0633294-A2 Polyimide based resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1995-01-11 EP disclosed
US-5374708-A Filaments; films; high strength, elastic modulus and crystallinity; melt spinnable MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1994-12-20 US disclosed
US-5312866-A Contains polyether ketone resin and/or polyester which forms anisotropic molten phase; additional polyimide compositions containing carbon fiber reinforcement, potassium titanate fiber or crystallization accelerator MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1994-05-17 US disclosed
EP-0591551-A1 POLYIMIDE RESIN COMPOSITION MITSUI TOATSU CHEMICALS, Inc. (JP) 1994-04-13 EP disclosed
US-5276133-A Heat resistant, dimensionaly stable polymers for molding materials used in electronics MITSUI TOATSU CHEMICALS, INC. (JP) 1994-01-04 US disclosed
EP-0518571-A2 Favorably processable polyimide and process for preparing polyimide MITSUI TOATSU CHEMICALS, Inc. (JP) 1992-12-16 EP disclosed
EP-0462282-A1 POLYIMIDE MOLDING MITSUI TOATSU CHEMICALS, Inc. (JP) 1991-12-27 EP disclosed
EP-0430640-A1 Polyimide based resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1991-06-05 EP disclosed