SCHEMBL755414

SCHEMBL755414

CCCC(NCCN)[SiH](OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14697326 0.90 CA12 (0.35)
SCHEMBL2452292 0.83
SCHEMBL17599999 0.83 SLC2A1 (0.30)
SCHEMBL54974 0.83
SCHEMBL1135936 0.80
SCHEMBL300735 0.76
SCHEMBL11905618 0.76 PLA2G10 (0.36)
SCHEMBL3159553 0.76
SCHEMBL1136090 0.74
SCHEMBL3371255 0.74 CA12 (0.37)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 102 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4652497-A ORGANO-ALKOXYSILANE, POLYOXYMETHYLENE REACTION PRODUCT AGIP S.P.A. (IT) 1987-03-24 US claimed
US-20260085153-A1 MOISTURE-CURABLE COMPOSITION AND ADHESIVE CONTAINING THE COMPOSITION WACKER CHEMIE AG (DE) 2026-03-26 US disclosed
EP-4569025-B1 MOISTURE-CURABLE COMPOSITION AND ADHESIVE CONTAINING THE COMPOSITION WACKER CHEMIE AG (DE) 2025-12-03 EP disclosed
WO-2024056473-A1 MOISTURE-CURABLE COMPOSITION AND ADHESIVE CONTAINING THE COMPOSITION WACKER CHEMIE AG (DE) 2024-03-21 WO disclosed
WO-2023068083-A1 MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF 株式会社カネカ 2023-04-27 WO disclosed
WO-2023013487-A1 MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF 株式会社カネカ 2023-02-09 WO disclosed
EP-2887385-B1 Non-volatile memory device method for fabricating the same SK INNOVATION CO LTD (KR) 2020-04-22 EP disclosed
EP-1621568-B1 ORGANIC POLYMER CONTAINING REACTIVE SILICON GROUP KANEKA CORP (JP) 2019-11-13 EP disclosed
US-10450468-B2 Surface treatment composition for coated steel sheet, surface treated plated steel sheet and method of production of same, and coated plated steel sheet and method of production of same NIHON PARKERIZING CO., LTD. (JP) 2019-10-22 US disclosed
EP-3553134-A1 LIQUID RESIN COMPOSITION Kaneka Corporation (JP) 2019-10-16 EP disclosed
EP-1731544-A1 HARDENABLE COMPOSITION KANEKA CORPORATION (JP) 2006-12-13 EP disclosed
US-20060247376-A1 Curing composition KANEKA CORPORATION (JP) 2006-11-02 US disclosed
US-20060211821-A1 Organic polymer containing reactive silicon group KANEKA CORPORATION (JP) 2006-09-21 US disclosed
US-20060173121-A1 Curable composition KANEKA CORPORATION (JP) 2006-08-03 US disclosed
US-20060135709-A1 Curing composition KANEKA CORPORATION (JP) 2006-06-22 US disclosed
US-20060079645-A1 Curable compositions KANEKA CORPORATION (JP) 2006-04-13 US disclosed
EP-1642932-A1 CURING COMPOSITION KANEKA CORPORATION (JP) 2006-04-05 EP disclosed
EP-1630186-A1 CURING COMPOSITION Kaneka Corporation (JP) 2006-03-01 EP disclosed
EP-1621568-A1 ORGANIC POLYMER CONTAINING REACTIVE SILICON GROUP KANEKA CORPORATION (JP) 2006-02-01 EP disclosed
EP-1598402-A1 CURABLE COMPOSITIONS KANEKA CORPORATION (JP) 2005-11-23 EP disclosed