SCHEMBL756745

SCHEMBL756745

OC1CSCCCSC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL676835 1.00 TSHR (0.32)
SCHEMBL3271432 1.00 TSHR (0.32)
SCHEMBL7554950 0.94
SCHEMBL7934771 0.86
SCHEMBL1929406 0.81
Hydrochloric Acid SCHEMBL31706459 0.79
SCHEMBL523741 0.79
SCHEMBL4187235 0.78 PTPN1 (0.32)
SCHEMBL9397884 0.77
SCHEMBL303459 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 72 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1500978-B1 Photosensitive metal nanoparticle and method of forming conductive pattern using the same SAMSUNG ELECTRONICS CO LTD (KR) 2014-04-23 EP claimed
US-8288130-B2 Polypeptide cleavage process MEDTRONIC, INC. (US) 2012-10-16 US claimed
EP-1532142-B1 POLYPEPTIDE CLEAVAGE PROCESS MEDTRONIC INC (US) 2012-03-21 EP claimed
US-7923110-B2 Metal nanoparticle having a self-assembled monolayer on its surface, and formation of conductive pattern using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-04-12 US claimed
US-20100311947-A1 POLYPEPTIDE CLEAVAGE PROCESS MEDTRONIC, INC. (US) 2010-12-09 US claimed
EP-1531836-B1 POLYPEPTIDE CLEAVAGE PROCESS MEDTRONIC INC (US) 2010-11-10 EP claimed
US-7771966-B2 Polypeptide cleavage process MEDTRONIC, INC. (US) 2010-08-10 US claimed
CN-1573543-B Photosensitive metal nanoparticle and method of forming conductive pattern using the same SAMSUNG ELECTRONICS CO LTD 2010-05-12 CN claimed
US-7592432-B2 selectively splitting the polypeptide at a Cys-His site, by hydrolysis in presence of a palladium promotor dissolved in formic acid; purification with by-product inhibition RESTORAGEN, INC. (US) 2009-09-22 US claimed
US-7473513-B1 Photosensitive metal nanoparticle and method of forming conductive pattern using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-01-06 US claimed
EP-1532142-A2 POLYPEPTIDE CLEAVAGE PROCESS Restoragen, Inc. (US) 2005-05-25 EP claimed
CN-1573543-A Photosensitive metal nanoparticle and method of forming conductive pattern using the same SAMSUNG ELECTRONICS CO LTD (KR) 2005-02-02 CN claimed
EP-1500978-A2 Photosensitive metal nanoparticle and method of forming conductive pattern using the same Samsung Electronics Co., Ltd. (KR) 2005-01-26 EP claimed
US-20040253536-A1 Photosensitive metal nanoparticle and method of forming conductive pattern using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-12-16 US claimed
WO-2003100015-A2 POLYPEPTIDE CLEAVAGE PROCESS RESTORAGEN, INC. (US) 2003-12-04 WO claimed
EP-0743574-B1 Migration imaging members XEROX CORP (US) 2000-12-27 EP claimed
EP-0743573-B1 Method for obtaining image contrast migration imaging members XEROX CORP (US) 2000-09-06 EP claimed
EP-0743573-A2 Method for obtaining image contrast migration imaging members XEROX CORPORATION (US) 1996-11-20 EP claimed
US-5563014-A SOFTENABLE LAYER CONTAINIG PHOTOSENSITIVE MARKING MATERIAL; TRANSPARENTIZING AGENT XEROX CORPORATION (US) 1996-10-08 US claimed
US-5514505-A SELECTIVE TRANSPARENTIZATION OF PHOTOSENSITIVE MIGRATION MARKING PARTICLES EMBEDDED NEAR THE SURFACE OF A SOFTENABLE LAYER SUPPORTED BY AN ELECTROCONDUCTIVE SUBSTRATE XEROX CORPORATION (US) 1996-05-07 US claimed