SCHEMBL758171

SCHEMBL758171

ClCCC[SiH2]C(Cl)Cl

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL705251 0.83
SCHEMBL706109 0.83
SCHEMBL2328958 0.80
SCHEMBL332951 0.75
SCHEMBL31563723 0.75
SCHEMBL3797048 0.73
SCHEMBL6890499 0.73
SCHEMBL9642367 0.69 TSHR (0.42)
SCHEMBL2924991 0.69 TSHR (0.42)
SCHEMBL6064050 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 53 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3307816-B1 HIGH STRENGTH AND MOISTURE RESISTANT ADHESIVE BISON INT B V (NL) 2025-02-26 EP claimed
EP-3307816-A1 HIGH STRENGTH AND MOISTURE RESISTANT ADHESIVE Bison International B.v. (NL) 2018-04-18 EP claimed
WO-2016202359-A1 HIGH STRENGTH AND MOISTURE RESISTANT ADHESIVE BISON INTERNATIONAL B.V. (NL) 2016-12-22 WO claimed
US-20250115626-A1 BIFUNCTIONAL LINKER COMPRISING METAALLYLSILANE AND METHOD FOR PREPARING SAME INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS (KR) 2025-04-10 US disclosed
EP-3307816-B1 HIGH STRENGTH AND MOISTURE RESISTANT ADHESIVE BISON INT B V (NL) 2025-02-26 EP disclosed
WO-2023128282-A1 BIFUNCTIONAL LINKER COMPRISING METAALLYLSILANE AND METHOD FOR PREPARING SAME 한양대학교 에리카산학협력단 2023-07-06 WO disclosed
CN-104418873-B Compounds having guanidino groups and containing a semi-organosilicon group 赢创运营有限公司 2020-12-01 CN disclosed
EP-2840087-B1 USE OF COMPOUNDS CONTAINING SEMI-ORGANIC SILICON GROUPS WITH GUANIDINE GROUPS FOR CURING OF COMPOUNDS CONTAINING ALKOXYSILYL GROUPS EVONIK DEGUSSA GMBH (DE) 2019-04-10 EP disclosed
EP-3307816-A1 HIGH STRENGTH AND MOISTURE RESISTANT ADHESIVE Bison International B.v. (NL) 2018-04-18 EP disclosed
US-9790327-B2 Silicone resin compositions which can be cured at room temperature EVONIK DEGUSSA GMBH (DE) 2017-10-17 US disclosed
EP-2468798-B1 SOLID ELECTROLYTE MEMBRANE FOR FUEL CELL AND PROCESS FOR PRODUCING SAME CENTRAL GLASS CO LTD (JP) 2017-03-08 EP disclosed
EP-1538152-B1 Process for the preparation of (mercaptoorganyl)-alkoxysilanen DEGUSSA (DE) 2006-03-22 EP disclosed
US-6995280-B2 Process for preparing (mercaptoorganyl)alkoxysilanes DEGUSSA AG (DE) 2006-02-07 US disclosed
US-20060009650-A1 3-iodopropylmethyldiisopropoxysilane and imaging members including the same XEROX CORPORATION 2006-01-12 US disclosed
US-20050124822-A1 Process for the preparation of (mercaptoorganyl)alkoxysilanes EVONIK OPERATIONS GMBH (DE) 2005-06-09 US disclosed
US-20050124821-A1 Process for preparing (mercaptoorganyl)alkoxysilanes EVONIK OPERATIONS GMBH (DE) 2005-06-09 US disclosed
EP-1538152-A1 Process for the preparation of (mercaptoorganyl)-alkoxysilanen Degussa AG (DE) 2005-06-08 EP disclosed
EP-1529782-A1 Process for preparing mercaptoorganyl alkoxy silanes Degussa AG (DE) 2005-05-11 EP disclosed
US-5502229-A ENDCAPPING DOW CORNING ASIA, LTD. (JP) 1996-03-26 US disclosed
US-3983148-A Process for producing cyclic siloxanes UNION CARBIDE CORPORATION (US) 1976-09-28 US disclosed