SCHEMBL7589592

SCHEMBL7589592

NC1(N)C=CN=C(c2ccccn2)C1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 10/20 0.42
LMNA P02545 3/20 0.42
CCR1 P32246 2/20 0.42
CCR5 P51681 2/20 0.42
CCR8 P51685 2/20 0.42
POLB P06746 2/20 0.42
CYP1A2 P05177 1/20 0.42
METAP1 P53582 1/20 0.42
BLM P54132 1/20 0.42
HIF1A Q16665 1/20 0.42
DOHH Q9BU89 1/20 0.42
P4HTM Q9NXG6 1/20 0.42
NPC1 O15118 6/20 0.40
TP53 P04637 4/20 0.40
SMN1; SMN2 Q16637 3/20 0.40
TSHR P16473 1/20 0.40
RAB9A P51151 5/20 0.37
ALDH1A1 P00352 4/20 0.37
ALOX15 P16050 3/20 0.37
L3MBTL1 Q9Y468 3/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27225878 0.80 KDM4E (0.42) KDM4ELMNACCR1CCR5CCR8
SCHEMBL435396 0.80 KDM4E (0.42) KDM4ELMNACCR1CCR5CCR8
SCHEMBL28055751 0.80 KDM4E (0.42) KDM4ELMNACCR1CCR5CCR8
SCHEMBL28575256 0.79 KDM4E (0.41) KDM4ELMNACCR1CCR5CCR8
Hydrochloric Acid SCHEMBL30022974 0.79 KDM4E (0.41) KDM4ELMNACCR1CCR5CCR8
Hydrochloric Acid SCHEMBL38657196 0.79 KDM4E (0.41) KDM4ELMNACCR1CCR5CCR8
SCHEMBL1311501 0.78 KDM4E (0.39) KDM4ELMNACCR1CCR5CCR8
SCHEMBL28603183 0.78 KDM4E (0.39) KDM4ELMNACCR1CCR5CCR8
SCHEMBL7604029 0.78 KDM4E (0.39) KDM4ELMNACCR1CCR5CCR8
SCHEMBL28452296 0.78 KDM4E (0.39) KDM4ELMNACCR1CCR5CCR8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113604804-B Etching solution for stabilizing line width loss and etching cone angle in panel copper plating process 湖北兴福电子材料股份有限公司 2022-09-23 CN claimed
CN-113604804-A Etching solution for stabilizing line width loss and etching cone angle in panel copper plating process 湖北兴福电子材料有限公司 2021-11-05 CN claimed
CN-112662236-A High-temperature-resistant low-creep sealing plate and preparation process thereof 江苏赛尔密封科技股份有限公司 2021-04-16 CN claimed
CN-114262341-B Method for preparing silanol by photocatalytic oxidation of silane 西安交通大学 2023-05-02 CN disclosed
CN-111068787-B Hydrogen peroxide hydrogenation catalyst, preparation method and application thereof 东莞东阳光科研发有限公司 2022-12-27 CN disclosed
CN-113604804-B Etching solution for stabilizing line width loss and etching cone angle in panel copper plating process 湖北兴福电子材料股份有限公司 2022-09-23 CN disclosed
CN-114262341-A Method for preparing silanol by utilizing photocatalytic oxidation of silane 西安交通大学 2022-04-01 CN disclosed
CN-113604804-A Etching solution for stabilizing line width loss and etching cone angle in panel copper plating process 湖北兴福电子材料有限公司 2021-11-05 CN disclosed
CN-112662236-A High-temperature-resistant low-creep sealing plate and preparation process thereof 江苏赛尔密封科技股份有限公司 2021-04-16 CN disclosed
CN-111068787-A Hydrogen peroxide hydrogenation catalyst, preparation method and application thereof 东莞东阳光科研发有限公司 2020-04-28 CN disclosed
WO-2002096390-A1 NEUTRAL-CATIONIC LIPID FOR SYSTEMIC DELIVERY OF FACTOR VIII GENE ALZA CORPORATION (US) 2002-12-05 WO disclosed