⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL345763 | 1.00 | — | — | |
| SCHEMBL231164 | 1.00 | — | — | |
| SCHEMBL30989494 | 1.00 | — | — | |
| SCHEMBL29419920 | 0.45 | — | — | |
| SCHEMBL10769372 | 0.45 | — | — | |
| SCHEMBL29628015 | 0.45 | — | — | |
| SCHEMBL29732618 | 0.45 | — | — | |
| SCHEMBL5383540 | 0.45 | — | — | |
| SCHEMBL11138911 | 0.45 | CA1 (0.50) | — | |
| SCHEMBL9697682 | 0.45 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 302 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119194652-A | Special material for spinning large-diameter polyphenyl ether monofilament as well as preparation method and application thereof | 南通大学 | 2024-12-27 | — | — | CN | claimed |
| WO-2024131556-A1 | HIGH-ADHESION CONDUCTIVE ADHESIVE, PREPARATION METHOD THEREFOR AND USE THEREOF | 湖北亿纬动力有限公司 | 2024-06-27 | — | — | WO | claimed |
| US-11977007-B2 | Gas detection device and gas detection method | FIGARO ENGINEERING INC. (JP) | 2024-05-07 | — | — | US | claimed |
| CN-117736633-A | Anti-fouling color pavement anti-skid coating and preparation method and application thereof | 山西省建筑科学研究院集团有限公司 | 2024-03-22 | — | — | CN | claimed |
| CN-117511223-A | Active fire-extinguishing foam silica gel sheet and preparation method thereof | 苏州铂韬新材料科技有限公司 | 2024-02-06 | — | — | CN | claimed |
| CN-116314788-A | High-adhesion conductive adhesive, and preparation method and application thereof | 湖北亿纬动力有限公司 | 2023-06-23 | — | — | CN | claimed |
| WO-2022247634-A1 | BATTERY WITH COATING AND PREPARATION METHOD THEREFOR | 江苏菲沃泰纳米科技股份有限公司 | 2022-12-01 | — | — | WO | claimed |
| CN-113584944-B | White craft paper and preparation method thereof | 浙江金龙再生资源科技股份有限公司 | 2022-11-01 | — | — | CN | claimed |
| CN-110242418-B | High-performance gas turbine air intake system | 江苏华强新能源科技有限公司 | 2022-04-01 | — | — | CN | claimed |
| CN-113717601-A | Waterproof reflective heat-insulating coating and preparation method thereof | 广东顺德三和化工有限公司 | 2021-11-30 | — | — | CN | claimed |
| US-20150079799-A1 | METHOD FOR STABILIZING AN INTERFACE POST ETCH TO MINIMIZE QUEUE TIME ISSUES BEFORE NEXT PROCESSING STEP | APPLIED MATERIALS INC (US) | 2015-03-19 | — | — | US | claimed |
| US-20110052909-A1 | DEVICE FOR THERMOHYDRAULIC APPLICATIONS WITH IMPROVED WATER SOFTENING PROPERTIES, LOWER RELEASE OF HEAVY METALS, AND RELATIVE METHOD OF MANUFACTURING | MOMA S.R.L. (IT) | 2011-03-03 | — | — | US | claimed |
| EP-2276872-A1 | DEVICE FOR THERMOHYDRAULIC APPLICATIONS WITH IMPROVED WATER SOFTENING PROPERTIES, LOWER RELEASE OF HEAVY METALS, AND RELATIVE METHOD OF MANUFACTURING | Moma S.r.l. (IT) | 2011-01-26 | — | — | EP | claimed |
| WO-2009130288-A1 | DEVICE FOR THERMOHYDRAULIC APPLICATIONS WITH IMPROVED WATER SOFTENING PROPERTIES, LOWER RELEASE OF HEAVY METALS, AND RELATIVE METHOD OF MANUFACTURING | MOMA S.R.L. (IT) | 2009-10-29 | — | — | WO | claimed |
| US-7459388-B2 | Methods of forming dual-damascene interconnect structures using adhesion layers having high internal compressive stresses | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2008-12-02 | — | — | US | claimed |
| US-7393795-B2 | Methods for post-etch deposition of a dielectric film | APPLIED MATERIALS, INC. (US) | 2008-07-01 | — | — | US | claimed |
| US-20080057697-A1 | Methods of Forming Dual-Damascene Interconnect Structures Using Adhesion Layers Having High Internal Compressive Stress and Structures Formed Thereby | SAMSUNG ELECTRONICS CO., LTD. | 2008-03-06 | — | — | US | claimed |
| US-20070175858-A1 | Methods for post-etch deposition of a dielectric film | APPLIED MATERIALS, INC. | 2007-08-02 | — | — | US | claimed |
| EP-0626683-B1 | Microwave processing apparatus and process for producing an inorganic dielectrique film | CANON KK (JP) | 1999-08-11 | — | — | EP | claimed |
| US-5494712-A | Method of forming a plasma polymerized film | THE DOW CHEMICAL COMPANY (US) | 1996-02-27 | — | — | US | claimed |