SCHEMBL7646391

CC(C)OCC(=O)C(OC(C)C)(OC(C)C)C(=O)[O-].CC(C)OCC(=O)C(OC(C)C)(OC(C)C)C(=O)[O-].CC(C)OCC(=O)C(OC(C)C)(OC(C)C)C(=O)[O-].CC(C)OCC(=O)C(OC(C)C)(OC(C)C)C(=O)[O-].[Ti+4]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compound	similarity	top predicted	shared targets
SCHEMBL17477099	0.80	—	—
SCHEMBL1078861	0.80	—	—
SCHEMBL29170924	0.79	—	—
SCHEMBL29035554	0.78	—	—
SCHEMBL1360945	0.77	—	—
SCHEMBL207036	0.74	FFAR3 (0.37)	—
SCHEMBL8468853	0.74	—	—
SCHEMBL4478417	0.74	TSHR (0.33)	—
SCHEMBL1361866	0.74	—	—
SCHEMBL93233	0.74	—	—

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

Patent	Title	Assignee	Published	Priority	Filing	Country	Status
EP-0844283-B1	Curable resin composition and cured products	JSR CORP (JP)	2002-10-09	—	—	EP	disclosed
US-6313233-B1	CAN BE CURED AND FABRICATED WITHOUT PRODUCING NO CRACKS INTO A CURED PRODUCT SUCH AS A SEMICONDUCTOR DEVICE HAVING A LOW DIELECTRIC CONSTANT, HIGH HEAT RESISTANCE AND MOISTURE RESISTANCE, SUPERIOR ADHESION TO VARIOUS SUBSTRATE MATERIALS	JAPAN SYNTHETIC RUBBER CO., LTD. (JP)	2001-11-06	—	—	US	disclosed
US-6011123-A	ORGANOSILANE COMPOUND; POLYAMIC ACIDS HAVING A HYDROLYZABLE SILYL GROUP OR CARBOXYLIC ACID ANHYDRIDE GROUP, OR BOTH, AND POLYIMIDES HAVING A HYDROLYZABLE SILYL GROUP OR CARBOXYLIC ACID ANHYDRIDE GROUP, OR BOTH.	JSR CORPORATION (JP)	2000-01-04	—	—	US	disclosed
EP-0844283-A1	Curable resin composition and cured products	JAPAN SYNTHETIC RUBBER CO., LTD. (JP)	1998-05-27	—	—	EP	disclosed