⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22254694 | 0.76 | — | — | |
| SCHEMBL766013 | 0.76 | — | — | |
| Ammonia Solution, Strong SCHEMBL4021906 | 0.74 | — | — | |
| SCHEMBL765969 | 0.74 | — | — | |
| SCHEMBL19072213 | 0.72 | SOS1 (0.33) | — | |
| SCHEMBL8464116 | 0.72 | SOS1 (0.33) | — | |
| Hydrochloric Acid SCHEMBL2937440 | 0.72 | TSHR (0.31) | — | |
| SCHEMBL22930557 | 0.72 | SOS1 (0.33) | — | |
| SCHEMBL17423998 | 0.72 | SOS1 (0.33) | — | |
| SCHEMBL2262125 | 0.72 | SOS1 (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117858872-A | Heterocyclic EGFR inhibitors for the treatment of cancer | 缆图药品公司 | 2024-04-09 | — | — | CN | disclosed |
| US-20230350294-A1 | Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-11-02 | — | — | US | disclosed |
| US-20230350294-A1 | Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-11-02 | — | — | US | disclosed |
| US-11768434-B2 | Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-09-26 | — | — | US | disclosed |
| US-11768434-B2 | Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-09-26 | — | — | US | disclosed |
| WO-2023107863-A1 | HETEROCYCLIC COMPOUNDS AS KIT KINASE INHIBITORS | DECIPHERA PHARMACEUTICALS, LLC (US) | 2023-06-15 | — | — | WO | disclosed |
| EP-3888658-A1 | EIF4-A-INHIBITING COMPOUNDS AND METHODS RELATED THERETO | Effector Therapeutics Inc. (US) | 2021-10-06 | — | — | EP | disclosed |
| EP-3380101-B1 | EIF4-A-INHIBITING COMPOUNDS AND METHODS RELATED THERETO | EFFECTOR THERAPEUTICS INC (US) | 2021-01-27 | — | — | EP | disclosed |
| WO-2020257549-A2 | COMPOUNDS FOR TREATMENT OF PD-L1 DISEASES | CHEMOCENTRYX, INC. (US) | 2020-12-24 | — | — | WO | disclosed |
| US-20200041903-A1 | POLYMER HAVING A STRUCTURE OF POLYAMIDE, POLYAMIDE-IMIDE, OR POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, PHOTOSENSITIVE DRY FILM, AND PROTECTIVE FILM FOR ELECTRIC AND ELECTRONIC PARTS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-02-06 | — | — | US | disclosed |
| WO-2014037340-A1 | USE OF SUBSTITUTED 2-AMIDOBENZIMIDAZOLES, 2-AMIDOBENZOXAZOLES AND 2-AMIDOBENZOTHIAZOLES OR SALTS THEREOF AS ACTIVE SUBSTANCES AGAINST ABIOTIC PLANT STRESS | BAYER CROPSCIENCE AG (DE) | 2014-03-13 | — | — | WO | disclosed |
| US-20140066426-A1 | FLUOROMETHYL-SUBSTITUTED PYRROLE CARBOXAMIDES | GRUENENTHAL GMBH (DE) | 2014-03-06 | — | — | US | disclosed |
| US-20130309607-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, AND PATTERN FORMING METHOD AND ARTICLE USING THE PHOTOSENSITIVE RESIN COMPOSITION | DAI NIPPON PRINTING CO., LTD. (JP) | 2013-11-21 | — | — | US | disclosed |
| US-8476444-B2 | Base generator | DAI NIPPON PRINTING CO., LTD. (JP) | 2013-07-02 | — | — | US | disclosed |
| US-20130126860-A1 | THIN FILM TRANSISTOR SUBSTRATE | DAI NIPPON PRINTING CO., LTD. (JP) | 2013-05-23 | — | — | US | disclosed |
| US-20120183751-A1 | BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD USING THE PHOTOSENSITIVE RESIN COMPOSITION AND PRODUCTS COMPRISING THE SAME | DAI NIPPON PRINTING CO., LTD. (JP) | 2012-07-19 | — | — | US | disclosed |
| US-20120070781-A1 | BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD USING THE PHOTOSENSITIVE RESIN COMPOSITION AND PRODUCTS COMPRISING THE SAME | DAI NIPPON PRINTING CO., LTD. (JP) | 2012-03-22 | — | — | US | disclosed |
| CN-102171612-A | Photosensitive resin composition, article using same, and negative pattern forming method | DAINIPPON PRINTING CO LTD | 2011-08-31 | — | — | CN | disclosed |
| US-20110086311-A1 | BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, AND PATTERN FORMING METHOD AND ARTICLE USING THE PHOTOSENSITIVE RESIN COMPOSITION | DAI NIPPON PRINTING CO., LTD. (JP) | 2011-04-14 | — | — | US | disclosed |
| US-3946048-A | HERBICIDES | BASF AKTIENGESELLSCHAFT (DT) | 1976-03-23 | — | — | US | disclosed |