SCHEMBL767709

SCHEMBL767709

C=CC(=O)O[CH]CCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6784539 0.87 TSHR (0.53)
SCHEMBL4919084 0.85 TSHR (0.52)
SCHEMBL7103515 0.84 TSHR (0.50)
SCHEMBL6045859 0.84 TSHR (0.50)
SCHEMBL6259527 0.84 TSHR (0.50)
SCHEMBL20917083 0.84 TSHR (0.50)
SCHEMBL37043 0.81
SCHEMBL2137702 0.79
SCHEMBL865384 0.79
SCHEMBL27673514 0.78 TSHR (0.44)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 117 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2435502-B1 CURABLE SILYL-GROUP CONTAINING COMPOSITIONS AND ITS USE EVONIK DEGUSSA GMBH (DE) 2016-10-19 EP claimed
US-9416300-B2 Low temperature curable adhesive compositions SIMPSON STRONG-TIE COMPANY, INC. (US) 2016-08-16 US claimed
US-8974627-B2 Curable compositions containing silyl groups, and use thereof EVONIK DEGUSSA GMBH (DE) 2015-03-10 US claimed
WO-2012097186-A1 LOW TEMPERATURE CURABLE ADHESIVE COMPOSITIONS SIMPSON STRONG-TIE COMPANY, INC. (US) 2012-07-19 WO claimed
US-20120067520-A1 Curable Compositions Containing Silyl Groups, And Use Thereof EVONIK GOLDSCHMIDT GMBH (DE) 2012-03-22 US claimed
CN-113785005-B Curing composition 美国圣戈班性能塑料公司 2023-12-12 CN disclosed
WO-2023182514-A1 ADHESIVE COMPOSITION FOR STEREOLITHOGRAPHIC ARTICLE AND NON-STEREOLITHOGRAPHIC ARTICLE クラレノリタケデンタル株式会社 2023-09-28 WO disclosed
CN-115298274-B Antifouling coating composition 中国涂料株式会社 2023-08-25 CN disclosed
CN-110325912-B Photosensitive resin composition, method for producing pattern, cured product, interlayer insulating film, covercoat, protective film, and electronic component 艾曲迪微系统股份有限公司 2023-07-14 CN disclosed
CN-116323726-A Active energy ray-curable composition, cured product, lens, and camera module DIC株式会社 2023-06-23 CN disclosed
CN-114206960-B Polymerizable composition, compound, polymer, resin composition, ultraviolet shielding film, and laminate 富士胶片株式会社 2023-05-23 CN disclosed
CN-115667453-A Hydrophilizing agent 日涂表面处理化工有限公司 2023-01-31 CN disclosed
WO-2001053420-A1 CURABLE COMPOSITION CONTAINING REACTIVE MELAMINE DERIVATIVE, CURED PRODUCT, AND LAMINATE DSM N.V. (NL) 2001-07-26 WO disclosed
EP-1071677-A1 PRODUCTION OF FURANONES UNISEARCH LIMITED (AU) 2001-01-31 EP disclosed
WO-1999054323-A1 PRODUCTION OF FURANONES UNISEARCH LIMITED (AU) 1999-10-28 WO disclosed
EP-0387315-A1 FLUORINATED ALKOXYL COMPOUNDS. MERCK PATENT GMBH (DE) 1990-09-19 EP disclosed
WO-1990001021-A1 FLUORINATED ALKOXYL COMPOUNDS MERCK Patent Gesellschaft mit beschränkter Haftung (DE) 1990-02-08 WO disclosed
US-4496447-A PHOTOPOLYMERIZATION OF UNSATURATED COMPOUNDS AND FOR CURING PRINTING INKS MERCK PATENT GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG (DE) 1985-01-29 US disclosed
US-4374984-A Aromatic-aliphatic ketones useful as photoinitiators MERCK PATENT GESELLSCHAFT MIT BESCHRANKTER HAFTUNG (DE) 1983-02-22 US disclosed
US-4370157-A UNSATURATED POLYESTER MODIFIED WITH AN AMINO FUNCTIONAL SILANE COMPOUND PPG INDUSTRIES, INC. (US) 1983-01-25 US disclosed