SCHEMBL768365

SCHEMBL768365

C[Si](C)(CCC(F)(F)F)O[Si](C)(C)CCC(F)(F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19410341 0.87
SCHEMBL316927 0.84
SCHEMBL12051897 0.82
SCHEMBL10667277 0.82
SCHEMBL2711141 0.81
SCHEMBL15497489 0.80
SCHEMBL629750 0.79
SCHEMBL9492631 0.79
SCHEMBL10674402 0.77
SCHEMBL4736506 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 143 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025106343-A1 ETCHING METHODS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2025-05-22 WO claimed
US-20250157825-A1 ETCHING METHODS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2025-05-15 US claimed
US-20240258111-A1 Surface Treatment Compositions and Methods FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2024-08-01 US claimed
US-11447642-B2 Methods of using surface treatment compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2022-09-20 US claimed
US-11174394-B2 Surface treatment compositions and articles containing same FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2021-11-16 US claimed
EP-3830196-A1 SURFACE TREATMENT COMPOSITIONS AND METHODS FUJIFILM Electronic Materials U.S.A, Inc. (US) 2021-06-09 EP claimed
US-20210122925-A1 METHODS OF USING SURFACE TREATMENT COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2021-04-29 US claimed
EP-3735325-A1 SURFACE TREATMENT COMPOSITIONS AND METHODS FUJIFILM Electronic Materials U.S.A, Inc. (US) 2020-11-11 EP claimed
WO-2020028214-A1 SURFACE TREATMENT COMPOSITIONS AND METHODS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2020-02-06 WO claimed
US-20200035494-A1 Surface Treatment Compositions and Methods FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2020-01-30 US claimed
WO-2019135901-A1 SURFACE TREATMENT COMPOSITIONS AND METHODS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2019-07-11 WO claimed
US-20190211210-A1 SURFACE TREATMENT COMPOSITIONS AND METHODS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2019-07-11 US claimed
CN-109401620-A Coating composition and preparation method thereof, coating piece and preparation method thereof, household electrical appliance 广东美的厨房电器制造有限公司 2019-03-01 CN claimed
CN-109401621-A Coating composition and preparation method thereof, coating piece and preparation method thereof, household electrical appliance 广东美的厨房电器制造有限公司 2019-03-01 CN claimed
JP-3103382-A None JP disclosed
CN-122095045-A Etching composition 2026-05-26 CN disclosed
US-20260018421-A1 SUBSTRATE PROCESSING METHOD, AND SUBSTRATE MANUFACTURING METHOD CENTRAL GLASS CO LTD (JP) 2026-01-15 US disclosed
EP-0195936-B1 METHOD FOR PRODUCING ORGANOSILICON POLYMERS AND THE POLYMERS PREPARED THEREBY Toray Silicone Company Limited (JP) 1990-04-25 EP disclosed
US-4707531-A Method for producing organosilicon polymers and the polymers prepared thereby TORAY SILICONE CO., LTD. (JP) 1987-11-17 US disclosed
EP-0195936-A1 Method for producing organosilicon polymers and the polymers prepared thereby Toray Silicone Company Limited (JP) 1986-10-01 EP disclosed