Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.50 |
| ▸ | FFAR1 | O14842 | 2/20 | 0.50 |
| ▸ | CPT2 | P23786 | 1/20 | 0.50 |
| ▸ | TET2 | Q6N021 | 2/20 | 0.47 |
| ▸ | CES2 | O00748 | 1/20 | 0.36 |
| ▸ | THRB | P10828 | 1/20 | 0.36 |
| ▸ | FNTA | P49354 | 1/20 | 0.36 |
| ▸ | FNTB | P49356 | 1/20 | 0.36 |
| ▸ | PGGT1B | P53609 | 1/20 | 0.36 |
| ▸ | AKR1B1 | P15121 | 1/20 | 0.35 |
| ▸ | CCR2 | P41597 | 1/20 | 0.35 |
| ▸ | PPARG | P37231 | 5/20 | 0.34 |
| ▸ | PPARD | Q03181 | 5/20 | 0.34 |
| ▸ | PPARA | Q07869 | 5/20 | 0.34 |
| ▸ | HDAC11 | Q96DB2 | 4/20 | 0.34 |
| ▸ | TSHR | P16473 | 3/20 | 0.34 |
| ▸ | GPR84 | Q9NQS5 | 3/20 | 0.34 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.34 |
| ▸ | TLR2 | O60603 | 2/20 | 0.34 |
| ▸ | FABP4 | P15090 | 2/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6564845 | 0.98 | TDP1 (0.53) | TDP1FFAR1CPT2TET2CES2 | |
| SCHEMBL8049142 | 0.98 | TDP1 (0.53) | TDP1FFAR1CPT2TET2CES2 | |
| SCHEMBL15791890 | 0.98 | TDP1 (0.53) | TDP1FFAR1CPT2TET2CES2 | |
| SCHEMBL15791895 | 0.86 | TET2 (0.52) | TDP1FFAR1CPT2TET2TSHR | |
| SCHEMBL10336141 | 0.85 | FFAR1 (0.50) | TDP1FFAR1CPT2TET2GPR84 | |
| SCHEMBL17291866 | 0.81 | TDP1 (0.42) | TDP1FFAR1CPT2THRBFNTA | |
| SCHEMBL17291872 | 0.81 | TDP1 (0.42) | TDP1FFAR1CPT2THRBFNTA | |
| SCHEMBL15104628 | 0.81 | TET2 (0.47) | TET2CES2 | |
| SCHEMBL5611305 | 0.80 | TDP1 (0.54) | TDP1FFAR1CPT2CES2THRB | |
| SCHEMBL5611302 | 0.80 | TDP1 (0.54) | TDP1FFAR1CPT2CES2THRB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 180 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3650513-B1 | WATER-BASED ACRYLIC PRESSURE-SENSITIVE ADHESIVE FOR CLOTHING, AND PREPARATION METHOD THEREOF | LG CHEMICAL LTD (KR) | 2024-01-31 | — | — | EP | disclosed |
| US-20230265314-A1 | RESIN COMPOSITION AND DISPLAY APPARATUS INCLUDING THE SAME | SAMSUNG DISPLAY CO., LTD. (KR) | 2023-08-24 | — | — | US | disclosed |
| US-11685145-B2 | Flow path structure, liquid ejecting apparatus, liquid ejecting head, and method of manufacturing flow path structure | SEIKO EPSON CORPORATION (JP) | 2023-06-27 | — | — | US | disclosed |
| US-11613677-B2 | Water-based acrylic pressure-sensitive adhesive for clothing, and preparation method thereof | LG CHEM, LTD. | 2023-03-28 | — | — | US | disclosed |
| US-11525019-B2 | Process for preparing acrylic emulsion resin | LG CHEM, LTD. | 2022-12-13 | — | — | US | disclosed |
| US-20220389308-A1 | WAVELENGTH CONVERSION FILM, WAVELENGTH CONVERSION FILM FORMING COMPOSITION, AND CLUSTER-CONTAINING QUANTUM DOT PRODUCTION METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-12-08 | — | — | US | disclosed |
| US-20210122845-A1 | Process for Preparing Acrylic Emulsion Resin | LG CHEM, LTD. (KR) | 2021-04-29 | — | — | US | disclosed |
| US-20200199414-A1 | Water-Based Acrylic Pressure-Sensitive Adhesive for Clothing, and Preparation Method Thereof | LG CHEM, LTD. (KR) | 2020-06-25 | — | — | US | disclosed |
| EP-3650513-A1 | AQUEOUS ACRYLIC PRESSURE-SENSITIVE ADHESIVE FOR CLOTHING, AND PREPARATION METHOD THEREFOR | LG CHEM, LTD. (KR) | 2020-05-13 | — | — | EP | disclosed |
| US-10559777-B2 | Radiation curable composition for water scavenging layer, and method of manufacturing the same | BASF COATINGS GMBH (DE) | 2020-02-11 | — | — | US | disclosed |
| WO-2005083522-A1 | PATTERN FORMING PROCESS | FUJI PHOTO FILM CO., LTD. (JP) | 2005-09-09 | — | — | WO | disclosed |
| WO-2005078776-A1 | PATTERN FORMING PROCESS | FUJI PHOTO FILM CO., LTD. (JP) | 2005-08-25 | — | — | WO | disclosed |
| US-20050037281-A1 | Light-sensitive sheet comprising support, first and second light-sensitive layers and barrier layer | FUJI PHOTO FILM CO., LTD. | 2005-02-17 | — | — | US | disclosed |
| US-20040192804-A1 | Photosensitive resin composition | IGM GROUP B.V. (NL) | 2004-09-30 | — | — | US | disclosed |
| US-5571642-A | LIGHT SENSITIVE ELEMENTS WITH CHEMICAL RESISTANCE | FUJI PHOTO FILM CO., LTD. (JP) | 1996-11-05 | — | — | US | disclosed |
| EP-0360129-B1 | Molding compounds made of polyamides and tert.-butylacrylate containing graft polymers | BAYER AG (DE) | 1994-11-09 | — | — | EP | disclosed |
| EP-0355512-B1 | Thermoplastic homogenisation products and their use in compositions of polyamide and copolymers and/or graft polymers of styrene | BAYER AG (DE) | 1994-09-21 | — | — | EP | disclosed |
| EP-0355510-B1 | Reinforced/filled blends of thermoplastic interpolymers and polyamides and process for their preparation | BAYER AG (DE) | 1993-11-24 | — | — | EP | disclosed |
| EP-0283871-B1 | THERMOPLASTIC MOULDINGS FROM POLYAMIDES AND RESINOUS COPOLYMERS | BAYER AG (DE) | 1993-04-21 | — | — | EP | disclosed |
| US-5010138-A | Molding compounds of polyamides and styrene copolymers | BAYER AKTIENGESELLSCHAFT (DE) | 1991-04-23 | — | — | US | disclosed |