⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL952555 | 0.92 | — | — | |
| SCHEMBL5476187 | 0.89 | — | — | |
| SCHEMBL9775435 | 0.88 | — | — | |
| SCHEMBL10423203 | 0.79 | — | — | |
| SCHEMBL10424795 | 0.76 | — | — | |
| SCHEMBL18531350 | 0.74 | — | — | |
| SCHEMBL16627103 | 0.74 | — | — | |
| SCHEMBL10584204 | 0.74 | — | — | |
| SCHEMBL17768962 | 0.74 | — | — | |
| SCHEMBL2045942 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6337518-B1 | INTEGRATED CIRCUIT INTERCONNECT STRUCTURE COMPRISING SUBSTRATE WITH ELECTROCONDUCTIVE LAYER, LAYER OF NON-FLUORINATED DIAMOND-LIKE CARBON, GRADED LAYER, LAYER OF AMORPHOUS FLUORINATED CARBON, ELECTROCONDUCTIVE LAYER, METAL CONNECTOR | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2002-01-08 | — | — | US | claimed |
| US-5945155-A | Low dielectric constant amorphous fluorinated carbon and method of preparation | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1999-08-31 | — | — | US | claimed |
| US-5942328-A | Low dielectric constant amorphous fluorinated carbon and method of preparation | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1999-08-24 | — | — | US | claimed |
| US-5942769-A | Low dielectric constant amorphous fluorinated carbon and method of preparation | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1999-08-24 | — | — | US | claimed |
| US-6337518-B1 | INTEGRATED CIRCUIT INTERCONNECT STRUCTURE COMPRISING SUBSTRATE WITH ELECTROCONDUCTIVE LAYER, LAYER OF NON-FLUORINATED DIAMOND-LIKE CARBON, GRADED LAYER, LAYER OF AMORPHOUS FLUORINATED CARBON, ELECTROCONDUCTIVE LAYER, METAL CONNECTOR | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2002-01-08 | — | — | US | disclosed |
| US-6337518-B1 | INTEGRATED CIRCUIT INTERCONNECT STRUCTURE COMPRISING SUBSTRATE WITH ELECTROCONDUCTIVE LAYER, LAYER OF NON-FLUORINATED DIAMOND-LIKE CARBON, GRADED LAYER, LAYER OF AMORPHOUS FLUORINATED CARBON, ELECTROCONDUCTIVE LAYER, METAL CONNECTOR | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2002-01-08 | — | — | US | disclosed |
| US-6150010-A | Integrated circuit insulator | TEXAS INSTRUMENTS INCORPORATED (US) | 2000-11-21 | — | — | US | disclosed |
| US-5945155-A | Low dielectric constant amorphous fluorinated carbon and method of preparation | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1999-08-31 | — | — | US | disclosed |
| US-5945155-A | Low dielectric constant amorphous fluorinated carbon and method of preparation | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1999-08-31 | — | — | US | disclosed |
| US-5942328-A | Low dielectric constant amorphous fluorinated carbon and method of preparation | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1999-08-24 | — | — | US | disclosed |
| US-5942328-A | Low dielectric constant amorphous fluorinated carbon and method of preparation | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1999-08-24 | — | — | US | disclosed |
| US-5942769-A | Low dielectric constant amorphous fluorinated carbon and method of preparation | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1999-08-24 | — | — | US | disclosed |
| US-5942769-A | Low dielectric constant amorphous fluorinated carbon and method of preparation | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1999-08-24 | — | — | US | disclosed |
| US-4892975-A | Diethynyl monomers and polymers thereof | PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) | 1990-01-09 | — | — | US | disclosed |