⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Water SCHEMBL21403933 | 1.00 | — | — | |
| Methane SCHEMBL23088734 | 0.00 | — | — | |
| Hydrogen Sulfide SCHEMBL23805181 | 0.00 | — | — | |
| SCHEMBL23528133 | 0.00 | — | — | |
| SCHEMBL23358113 | 0.00 | — | — | |
| SCHEMBL23462252 | 0.00 | — | — | |
| SCHEMBL25435013 | 0.00 | — | — | |
| SCHEMBL23462141 | 0.00 | — | — | |
| Potassium Ion SCHEMBL23462035 | 0.00 | CA4 (0.50) | — | |
| SCHEMBL23462036 | 0.00 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-58073141-A | — | — | None | — | — | JP | disclosed |
| CN-116442872-A | Vehicle-mounted heat dissipation cushion based on phase change material and semiconductor refrigeration and method | 南京工业大学 | 2023-07-18 | — | — | CN | disclosed |
| WO-2023091489-A1 | HANDHELD LASER WELDING DEVICE | LINCOLN GLOBAL, INC. (US) | 2023-05-25 | — | — | WO | disclosed |
| US-20230158601-A1 | HANDHELD LASER WELDING DEVICE | LINCOLN GLOBAL, INC. | 2023-05-25 | — | — | US | disclosed |
| EP-4177940-A1 | A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL AS A METHOD FOR MANUFACTURING SUCH SEMICONDUCTOR PACKAGE ASSEMBLY | Nexperia B.V. (NL) | 2023-05-10 | — | — | EP | disclosed |
| CN-116072645-A | Semiconductor package assembly and method of manufacturing the same | 安世有限公司 | 2023-05-05 | — | — | CN | disclosed |
| US-20230137612-A1 | SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING | NEXPERIA B.V. (NL) | 2023-05-04 | — | — | US | disclosed |
| CN-218956680-U | Concrete resistivity testing device under different temperatures | 三峡大学 | 2023-05-02 | — | — | CN | disclosed |
| CN-112284512-A | Capacitive vibration sensor and power plant fan diagnosis system and method | 陕西宝鸡第二发电有限责任公司 | 2021-01-29 | — | — | CN | disclosed |
| CN-210620639-U | Fertilizer making machine for removing toxic and harmful substances in livestock and poultry manure | 河南省功能农业新科技有限公司 | 2020-05-26 | — | — | CN | disclosed |
| CN-201695493-U | Telescopic closestool capable of automatically flushing water | GENRONG WU | 2011-01-05 | — | — | CN | disclosed |
| CN-101583060-A | Replaceable component and recyclable component of earphone | LI ZUO (CN) | 2009-11-18 | — | — | CN | disclosed |
| CN-2815497-Y | Crushing machine water sprayin dust-reducing device | ZHONGJING CEMENT LLC JIAOZUO C (CN) | 2006-09-13 | — | — | CN | disclosed |
| CN-2610320-Y | Carbon detemination probe in molten steel furnace | CHEN JIAN (CN) | 2004-04-07 | — | — | CN | disclosed |
| US-6370003-B1 | Electrostatic charge resistant instrument system | WELCH ALLYN DATA COLLECTIONS, INC. | 2002-04-09 | — | — | US | disclosed |
| WO-2001041516-A1 | ELECTROSTATIC CHARGE RESISTANT INSTRUMENT SYSTEM | WELCH ALLYN DATA COLLECTION, INC. (US) | 2001-06-07 | — | — | WO | disclosed |
| US-5627792-A | Loc type semiconductor memory device | NEC CORPORATION (JP) | 1997-05-06 | — | — | US | disclosed |
| US-4959565-A | Output buffer with ground bounce control | NATIONAL SEMICONDUCTOR CORPORATION (US) | 1990-09-25 | — | — | US | disclosed |
| EP-0382124-A2 | Output buffer with ground bounce control | NATIONAL SEMICONDUCTOR CORPORATION (US) | 1990-08-16 | — | — | EP | disclosed |
| JP-S5873141-A | MULTICHIP LSI PACKAGE | NEC CORP | 1983-05-02 | — | — | JP | disclosed |