SCHEMBL7727653

SCHEMBL7727653

CC(=O)CC(C)=O.COC(=O)CC(C)=O

nearest known ligand 0.94

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGAM O43451 2/20 0.94
GAA P10253 2/20 0.94
SI P14410 2/20 0.94
MGAM2 Q2M2H8 2/20 0.94
TSHR P16473 4/20 0.53
HSD17B10 Q99714 2/20 0.48
ALDH1A1 P00352 5/20 0.44
KDM4E B2RXH2 2/20 0.42
LMNA P02545 2/20 0.42
KMT2A Q03164 2/20 0.39
TET2 Q6N021 1/20 0.39
MEN1 O00255 1/20 0.39
HTT P42858 2/20 0.38
CA12 O43570 1/20 0.37
CA14 Q9ULX7 1/20 0.37
RECQL P46063 1/20 0.37
TDP1 Q9NUW8 1/20 0.37
KDM6B O15054 1/20 0.36
KDM5C P41229 1/20 0.36
EGLN1 Q9GZT9 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8720734 0.97 MGAM (0.88) MGAMGAASIMGAM2TSHR
SCHEMBL1162 0.97
SCHEMBL27677215 0.97 MGAM (1.00) MGAMGAASIMGAM2TSHR
Methyl Alcohol SCHEMBL5312310 0.94 MGAM (0.94) MGAMGAASIMGAM2TSHR
SCHEMBL11024720 0.94
SCHEMBL17433643 0.94 MGAM (0.94) MGAMGAASIMGAM2TSHR
SCHEMBL303851 0.94
SCHEMBL303752 0.94
SCHEMBL20942931 0.94
SCHEMBL11019941 0.94

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-1998028395-A1 FORMULATIONS INCLUDING A 1,3-DICARBONYL COMPOUND CHELATING AGENT FOR STRIPPING RESIDUES FROM SEMICONDUCTOR SUBSTRATES ADVANCED CHEMICAL SYSTEMS INTERNATIONAL, INC. (US) 1998-07-02 WO claimed
CN-117447738-A Polyimide film, forming method thereof and flexible copper-clad plate 上海中化科技有限公司 2024-01-26 CN disclosed
US-6410640-B1 POLYMER, SILANE COUPLING AGENT, PLASTICIZER AND STANNOUS CURING AGENTS KANEKA CORPORATION (JP) 2002-06-25 US disclosed
EP-1041119-A2 One-pack type curable resin composition KANEKA CORPORATION (JP) 2000-10-04 EP disclosed
WO-1998022568-A1 STRIPPING FORMULATION INCLUDING CATECHOL, HYDROXYLAMINE, NON-ALKANOLAMINE, WATER FOR POST PLASMA ASHED WAFER CLEANING ADVANCED CHEMICAL SYSTEMS INTERNATIONAL, INC. (US) 1998-05-28 WO disclosed
EP-0307996-B1 A CORROSION PREVENTING COATING COMPOSITION TO BE APPLIED AS A THIN LAYER FOR STEEL SHEET Nippon Paint Co., Ltd. (JP) 1992-01-22 EP disclosed
EP-0307996-A1 A corrosion preventing coating composition to be applied as a thin layer for steel sheet Nippon Paint Co., Ltd. (JP) 1989-03-22 EP disclosed