SCHEMBL7732609

SCHEMBL7732609

[Al].[CaH2].[Y]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29641530 0.82
SCHEMBL8662308 0.82
SCHEMBL29354105 0.82
SCHEMBL867367 0.82
SCHEMBL29961243 0.82
SCHEMBL23199802 0.67
SCHEMBL10866873 0.67
SCHEMBL145653 0.67
SCHEMBL6901228 0.67
SCHEMBL10429773 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-121573977-A Preparation method of calcium yttrium aluminum co-doped high-toughness zirconia ceramic 福州大学 2026-02-27 CN claimed
CN-101372418-A Low temperature synthesized aluminum-yttrium-calcium ceramic material LIJIE PANG (CN) 2009-02-25 CN claimed
EP-0593679-A1 ALUMINUM NITRIDE DENSIFICATION WITH MINIMAL GRAIN GROWTH THE DOW CHEMICAL COMPANY (US) 1994-04-27 EP claimed
WO-1993001147-A1 ALUMINUM NITRIDE DENSIFICATION WITH MINIMAL GRAIN GROWTH THE DOW CHEMICAL COMPANY (US) 1993-01-21 WO claimed
CN-121573977-A Preparation method of calcium yttrium aluminum co-doped high-toughness zirconia ceramic 福州大学 2026-02-27 CN disclosed
EP-3804849-A1 STEAM-REFORMING CATALYST Tanaka Kikinzoku Kogyo K.K. (JP) 2021-04-14 EP disclosed
CN-101372418-A Low temperature synthesized aluminum-yttrium-calcium ceramic material LIJIE PANG (CN) 2009-02-25 CN disclosed
CN-101372418-A Low temperature synthesized aluminum-yttrium-calcium ceramic material LIJIE PANG (CN) 2009-02-25 CN disclosed
EP-0913371-B1 Sintered aluminum nitride body and metallized substrate prepared therefrom SUMITOMO ELECTRIC INDUSTRIES (JP) 2002-02-20 EP disclosed
US-6174614-B1 SINTERED ALUMINUM NITRIDE BODY COMPRISING ALUMINUM NITRIDE AS THE MAIN COMPONENT AND CONTAINING A CALCIUM COMPOUND, A YTTERBIUM COMPOUND, AND A NEODYMIUM COMPOUND; PRODUCED THROUGH LOW-TEMPERATURE SINTERING SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) 2001-01-16 US disclosed
EP-0913371-A2 Sintered aluminum nitride body and metallized substrate prepared therefrom SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) 1999-05-06 EP disclosed
EP-0593679-A1 ALUMINUM NITRIDE DENSIFICATION WITH MINIMAL GRAIN GROWTH THE DOW CHEMICAL COMPANY (US) 1994-04-27 EP disclosed
WO-1993001147-A1 ALUMINUM NITRIDE DENSIFICATION WITH MINIMAL GRAIN GROWTH THE DOW CHEMICAL COMPANY (US) 1993-01-21 WO disclosed