SCHEMBL7743207

SCHEMBL7743207

ClNCl.ClNCl.[Pd]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4114327 1.00
Ammonia Solution, Strong SCHEMBL8733016 0.91
Ammonia Solution, Strong SCHEMBL28262683 0.91
SCHEMBL9494497 0.89
SCHEMBL8756 0.89
SCHEMBL30528656 0.80
SCHEMBL9388314 0.80
SCHEMBL28626809 0.80
SCHEMBL29057764 0.80
Ammonia Solution, Strong SCHEMBL28975722 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3964610-A1 ELECTROPLATING BATH FOR PALLADIUM RUTHENIUM COATINGS IWG Ing. W. Garhöfer Gesellschaft m. b. H. (AT) 2022-03-09 EP claimed
EP-3356579-B1 ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY, SUBSTRATE COMPRISING SAID ALLOY AND USES OF THE SUBSTRATE COVENTYA S P A (IT) 2020-03-11 EP claimed
EP-3150744-B1 ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY LAYER, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY LAYER, SUBSTRATE COMPRISING SAID ALLOY LAYER AND USES OF THE COATED SUBSTRATE COVENTYA S P A (IT) 2020-02-12 EP claimed
EP-3356579-A1 ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY, SUBSTRATE COMPRISING SAID ALLOY AND USES OF THE SUBSTRATE Coventya S.p.A. (IT) 2018-08-08 EP claimed
EP-3150744-A1 ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY, SUBSTRATE COMPRISING SAID ALLOY AND USES OF THE SUBSTRATE COVENTYA S.p.A. (IT) 2017-04-05 EP claimed
EP-2664621-A1 ANTIVIRAL AGENT "Ivy Pharm" Limited Liability Company (RU) 2013-11-20 EP claimed
US-20130281362-A1 ANTIVIRAL AGENT "IVY PHARM" LIMITED LIABILITY COMPANY (RU) 2013-10-24 US claimed
EP-3964610-A1 ELECTROPLATING BATH FOR PALLADIUM RUTHENIUM COATINGS IWG Ing. W. Garhöfer Gesellschaft m. b. H. (AT) 2022-03-09 EP disclosed
EP-3356579-B1 ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY, SUBSTRATE COMPRISING SAID ALLOY AND USES OF THE SUBSTRATE COVENTYA S P A (IT) 2020-03-11 EP disclosed
EP-3150744-B1 ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY LAYER, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY LAYER, SUBSTRATE COMPRISING SAID ALLOY LAYER AND USES OF THE COATED SUBSTRATE COVENTYA S P A (IT) 2020-02-12 EP disclosed
EP-3356579-A1 ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY, SUBSTRATE COMPRISING SAID ALLOY AND USES OF THE SUBSTRATE Coventya S.p.A. (IT) 2018-08-08 EP disclosed
EP-3150744-A1 ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY, SUBSTRATE COMPRISING SAID ALLOY AND USES OF THE SUBSTRATE COVENTYA S.p.A. (IT) 2017-04-05 EP disclosed
EP-2664621-A1 ANTIVIRAL AGENT "Ivy Pharm" Limited Liability Company (RU) 2013-11-20 EP disclosed
US-20130281362-A1 ANTIVIRAL AGENT "IVY PHARM" LIMITED LIABILITY COMPANY (RU) 2013-10-24 US disclosed
US-6267801-B1 Method for producing a tubular hydrogen permeation membrane W. C. HERAEUS GMBH & CO. KG (DE) 2001-07-31 US disclosed