SCHEMBL775428

SCHEMBL775428

C=C(C)SC(=C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10776638 0.76
SCHEMBL12576569 0.76
SCHEMBL14866096 0.76
SCHEMBL12859571 0.76
SCHEMBL19018433 0.73
SCHEMBL23808234 0.71
SCHEMBL22782180 0.71
SCHEMBL20808749 0.71
SCHEMBL16316037 0.71
SCHEMBL24250328 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 98 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3519083-A1 METHOD FOR PRODUCING TEMPERATURE-STABLE POLYALKENYLENES Evonik Degussa GmbH (DE) 2019-08-07 EP claimed
CN-102648217-B Low molecular weight polymers of multifunctional multiple graft monomers CASTROL LTD. (GB) 2015-11-25 CN claimed
CN-102648217-A Low molecular weight polymers of multifunctional multiple graft monomers CASTROL LTD 2012-08-22 CN claimed
US-4518754-A Imido copolymers RHONE-POULENC INDUSTRIES (FR) 1985-05-21 US claimed
US-12100809-B2 Non-aqueous liquid electrolyte and non-aqueous liquid electrolyte secondary battery MITSUBISHI CHEMICAL CORPORATION (JP) 2024-09-24 US disclosed
CN-118255955-A Resin, curable resin composition, cured product, resin material for solder resist, insulating material, and resist member DIC株式会社 2024-06-28 CN disclosed
CN-118103414-A Curable resin, curable resin composition, and cured product DIC株式会社 2024-05-28 CN disclosed
CN-113748149-B Curable resin composition DIC株式会社 2024-05-24 CN disclosed
CN-113728030-B Curable resin composition DIC株式会社 2023-08-15 CN disclosed
CN-113748152-B Curable resin composition DIC株式会社 2023-08-15 CN disclosed
CN-113767117-B Curable resin composition DIC株式会社 2023-08-15 CN disclosed
CN-111556880-B Ethylene copolymer and process for producing the same SABIC环球技术有限责任公司 2023-02-28 CN disclosed
EP-0126231-A2 Vinylphenyl benzimidazole derivatives, their polymers, their preparation and use Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1984-11-28 EP disclosed
US-4411793-A FORMING ADSORBENT BAND IN PACKED COLUMN ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1983-10-25 US disclosed
US-4406870-A Method for the separation of carbon isotopes by chemical exchange method ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1983-09-27 US disclosed
US-4394353-A COMPLEXING AGENT ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1983-07-19 US disclosed
EP-0054969-A1 A process for the separation of elements by chromatography Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1982-06-30 EP disclosed
EP-0042877-A1 A METHOD FOR THE SEPARATION OF CARBON ISOTOPES BY CHEMICAL EXCHANGE METHOD Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1982-01-06 EP disclosed
US-4119646-A Hexahydrobenzofuranone compounds MOBIL OIL CORPORATION (US) 1978-10-10 US disclosed
US-4011239-A MANGANESE, VANADIUM, CERIUM MOBIL OIL CORPORATION (US) 1977-03-08 US disclosed