SCHEMBL7775262

SCHEMBL7775262

CCC(C)CNC1CCCCC1

nearest known ligand 0.54

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 2/20 0.54
ANPEP P15144 2/20 0.43
ERAP2 Q6P179 2/20 0.43
HTT P42858 2/20 0.43
SHBG P04278 1/20 0.43
SMN1; SMN2 Q16637 1/20 0.43
EPHX1 P07099 2/20 0.42
LMNA P02545 1/20 0.41
CYP1A2 P05177 1/20 0.41
CYP2D6 P10635 1/20 0.41
SCN1A P35498 1/20 0.41
SCN2A Q99250 1/20 0.41
SCN3A Q9NY46 1/20 0.41
EPHX2 P34913 2/20 0.36
ALDH1A1 P00352 1/20 0.35
HSD17B10 Q99714 1/20 0.35
DPP7 Q9UHL4 1/20 0.34
HRH3 Q9Y5N1 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14612175 1.00 KDM4E (0.54) KDM4EANPEPERAP2HTTSHBG
SCHEMBL7770658 1.00 KDM4E (0.54) KDM4EANPEPERAP2HTTSHBG
SCHEMBL7775034 0.98 KDM4E (0.50) KDM4EANPEPERAP2HTTSHBG
SCHEMBL13606425 0.93 KDM4E (0.45) KDM4EANPEPERAP2HTTSHBG
SCHEMBL9407491 0.89 KDM4E (0.60) KDM4EANPEPERAP2HTTSHBG
SCHEMBL13606424 0.89
SCHEMBL11054718 0.83 KDM4E (0.50) KDM4EANPEPERAP2HTTSHBG
SCHEMBL1043149 0.81 KDM4E (0.62) KDM4EANPEPERAP2HTTSHBG
SCHEMBL7775092 0.81 KDM4E (0.62) KDM4EANPEPERAP2HTTSHBG
SCHEMBL7775213 0.81 KDM4E (0.62) KDM4EANPEPERAP2HTTSHBG

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9997782-B2 Bisphenol-based resin, electrode, lead storage battery, production methods for these, and resin composition HITACHI CHEMICAL COMPANY, LTD (JP) 2018-06-12 US disclosed
US-20180076460-A1 BISPHENOL-BASED RESIN, ELECTRODE, LEAD STORAGE BATIERY, PRODUCTION METHODS FOR THESE, AND RESIN COMPOSITION HITACHI CHEMICAL COMPANY, LTD. (JP) 2018-03-15 US disclosed
US-20160195814-A1 PATTERN FORMATION METHOD, ELECTRONIC-DEVICE PRODUCTION METHOD, AND PROCESSING AGENT FUJIFILM CORPORATION (JP) 2016-07-07 US disclosed
EP-0838508-B1 Aqueous ink composition for use in an ink-jet printer SEIKO EPSON CORP (JP) 2001-08-29 EP disclosed
US-5871572-A COLORANT, WATER, A WATER-SOLUBLE ORGANIC SOLVENT, AND PECTIC ACID SEIKO EPSON CORPORATION (JP) 1999-02-16 US disclosed
EP-0838508-A2 Aqueous ink composition for use in an ink-jet printer SEIKO EPSON CORPORATION (JP) 1998-04-29 EP disclosed
US-4459424-A SECONDARY AMINE, CARBON DISULFIDE, METAL CONTAINING CATALYST AKZONA INCORPORATED (US) 1984-07-10 US disclosed