SCHEMBL778613

SCHEMBL778613

C=COP(C)(C)=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL778567 0.80
SCHEMBL4820636 0.79
SCHEMBL4946264 0.75
SCHEMBL5189606 0.75
SCHEMBL27765422 0.73
SCHEMBL19602985 0.73
SCHEMBL777996 0.73 TSHR (0.43)
SCHEMBL777535 0.73
SCHEMBL2299096 0.73
SCHEMBL93174 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10087265-B2 Method for producing dimethyl polyvinylphosphonate and polyvinylphosphonic acid MARUZEN PETROCHEMICAL CO., LTD. (JP) 2018-10-02 US claimed
US-12100809-B2 Non-aqueous liquid electrolyte and non-aqueous liquid electrolyte secondary battery MITSUBISHI CHEMICAL CORPORATION (JP) 2024-09-24 US disclosed
CN-117999319-A Halogen-free flame-retardant curable resin composition, prepreg, metal-clad laminate, and printed wiring board 日铁化学材料株式会社 2024-05-07 CN disclosed
WO-2023053782-A1 HALOGEN-FREE FLAME-RETARDANT CURABLE RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATED BOARD, AND PRINTED WIRING BOARD 日鉄ケミカル&マテリアル株式会社 2023-04-06 WO disclosed
US-20220149436-A1 NON-AQUEOUS LIQUID ELECTROLYTE AND NON-AQUEOUS LIQUID ELECTROLYTE SECONDARY BATTERY MITSUBISHI CHEMICAL CORPORATION (JP) 2022-05-12 US disclosed
EP-3524644-B1 POLYPHENYLENE ETHER RESIN COMPOSITION ASAHI CHEMICAL IND (JP) 2022-05-11 EP disclosed
US-11283107-B2 Non-aqueous liquid electrolyte and non-aqueous liquid electrolyte secondary battery MITSUBISHI CHEMICAL CORPORATION (JP) 2022-03-22 US disclosed
CN-109790370-B Polyphenylene ether resin composition 旭化成株式会社 2022-02-01 CN disclosed
CN-107892807-B Flame-retardant resin composition 旭化成株式会社 2021-01-29 CN disclosed
CN-107915981-B Laminated molded body 旭化成株式会社 2020-11-24 CN disclosed
US-9252457-B2 Non-aqueous liquid electrolyte and non-aqueous liquid electrolyte secondary battery MITSUBISHI CHEMICAL CORPORATION (JP) 2016-02-02 US disclosed
US-20150188192-A1 NON-AQUEOUS LIQUID ELECTROLYTE AND NON-AQUEOUS LIQUID ELECTROLYTE SECONDARY BATTERY MITSUBISHI CHEMICAL CORPORATION (JP) 2015-07-02 US disclosed
US-20150056503-A1 NON-AQUEOUS LIQUID ELECTROLYTE AND NON-AQUEOUS LIQUID ELECTROLYTE SECONDARY BATTERY MITSUBISHI CHEMICAL CORPORATION (JP) 2015-02-26 US disclosed
US-20120177988-A1 NON-AQUEOUS LIQUID ELECTROLYTE AND NON-AQUEOUS LIQUID ELECTROLYTE SECONDARY BATTERY MITSUBISHI CHEMICAL CORPORATION (JP) 2012-07-12 US disclosed
US-20120070731-A1 NON-AQUEOUS LIQUID ELECTROLYTE AND NON-AQUEOUS LIQUID ELECTROLYTE SECONDARY BATTERY MITSUBISHI CHEMICAL CORPORATION (JP) 2012-03-22 US disclosed
US-20090325065-A1 NON-AQUEOUS LIQUID ELECTROLYTE AND NON-AQUEOUS LIQUID ELECTROLYTE SECONDARY BATTERY MITSUBISHI CHEMICAL CORPORATION (JP) 2009-12-31 US disclosed
CN-101454362-A Flameproof copolymer and flame retardant thermoplastic resin composition using thereof CHEIL IND INC (KR) 2009-06-10 CN disclosed
EP-2012386-A1 NONAQUEOUS ELECTROLYTE SOLUTION AND NONAQUEOUS ELECTROLYTE SECONDARY BATTERY Mitsubishi Chemical Corporation (JP) 2009-01-07 EP disclosed
WO-2008120854-A1 FLAMEPROOF COPOLYMER AND FLAME RETARDANT THERMOPLASTIC RESIN COMPOSITION USING THEREOF CHEIL INDUSTRIES INC. (KR) 2008-10-09 WO disclosed
US-20080242795-A1 Flameproof Copolymer and Flame Retardant Thermoplastic Resin Composition Including the Same CHEIL INDUSTRIES INC. (KR) 2008-10-02 US disclosed